EP4CE115F23I7N vs EP4CE75F23C7 Comparison
Detailed side-by-side comparison of EP4CE115F23I7N by Intel and EP4CE75F23C7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP4CE115F23I7N
EP4CE115F23I7N - 114K LE Cyclone IV E FPGA, 484-FBGA | Intel
EP4CE115F23I7N β ActiveIntel
EP4CE75F23C7
EP4CE75F23C7 - Cyclone IV E FPGA, 75K LEs, 484-FBGA | Intel
EP4CE75F23C7 β ActiveSpecification Comparison
| Parameter | EP4CE115F23I7N | EP4CE75F23C7 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $87.95 | $148.00 |
| Series | Cyclone IV E | β |
| Family | EP4CE115 (F23 package) | Cyclone IV E |
| Logic Elements (LE) | 114,480 | β |
| Embedded Memory Bits | 3,981,312 bits | 2,810,880 bits |
| Maximum User I/Os | 280 | β |
| Logic Array Blocks (LABs) | 7,180 | 4,713 |
| Number of PLLs | 4 | β |
| 18x18 Hardware Multipliers | 266 | β |
| Core Voltage | 1.0 V / 1.2 V | β |
| I/O Voltage Banks | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V | β |
| Operating Temperature | -40C to +100C (Industrial) | β |
| Package | 484-FBGA (F23) 23x23 mm, 1.0 mm pitch | 484-ball FBGA, 23 x 23 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount | β |
| Process Technology | 60 nm low-power CMOS (TSMC) | 60 nm low power (TSMC) |
| Configuration Method | JTAG, Active Serial, Active Parallel | β |
| MSL Level | 3 | β |
| RoHS Status | Compliant | Compliant |
| Lead-Free | Yes | β |
| Device Logic Elements | β | 75,408 |
| M9K Memory Blocks | β | 305 |
| Embedded 18x18 Multipliers | β | 244 |
| PLLs | β | 4 |
| Maximum User I/O | β | 292 |
| Core Voltage (VCCINT) | β | 1.2 V |
| Operating Temperature Grade | β | Commercial (0C to 85C) |
| Configuration Modes | β | AS, AP, FPP, PS |
| JTAG Support | β | IEEE 1149.1 boundary-scan |
| Maximum Internal Frequency | β | 472.5 MHz |