EP4CE75F23C7 - Cyclone IV E FPGA, 75K LEs, 484-FBGA | Intel
MPN: EP4CE75F23C7 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $215 | $215.00 |
| 10 | $198 | $1,980.00 |
| 100 | $178 | $17,800.00 |
| 500 | $162 | $81,000.00 |
| 1,000 | $148 | $148,000.00 |
EP4CE75F23C7 Overview
What is a low-cost FPGA? A low-cost FPGA (LCFPGA) is a programmable logic device that provides the integration, parallelism, and reconfigurability of a traditional FPGA while aggressively reducing silicon and packaging cost through a smaller process geometry and trimmed feature set. Cyclone IV E sits in this taxonomy as low-cost FPGA -> SRAM-based FPGA -> programmable logic -> ASIC-replacement. The Cyclone IV E family pioneered 60 nm TSMC technology for FPGAs, balancing logic density with low static and dynamic power, and remains a popular choice for industrial and communications volume designs.
Key features include 4,713 configurable logic blocks (CLBs / LABs) and 4713 equivalent logic elements grouped into Logic Array Blocks, 488.4 Kbit of embedded SRAM distributed across M9K blocks, 200+ Kbit usable as general-purpose RAM, FIFOs, or shift registers, and up to 244 embedded 18x18 multipliers for DSP-style workloads such as motor control and video bridging. Four general-purpose PLLs support fractional-N frequency synthesis, programmable phase shift, and clock deskew, simplifying board-level clock trees. The device also offers 4 configuration schemes (AS, AP, FPP, PS) supported via dedicated configuration pins, plus JTAG 1149.1 boundary-scan for production test.
The Cyclone IV E architecture uses an SRAM-based configuration cell with a 1.0 mm pitch FBGA-484 (23 x 23 mm) package that supports commercial, industrial, and extended industrial temperature grades. Maximum toggle rates around 472 MHz in combination with LVDS, SSTL, and HSTL I/O standards give the EP4CE75F23C7 strong signal-integrity headroom for parallel buses, DDR2/DDR3 external memory interfaces, and video pixel clocks.
Typical applications include industrial machine vision and motor control, broadcast video bridging (HDMI/SDI to parallel RGB), PCIe-over-soft-IP endpoint bridges in edge appliances, factory automation controllers, and high-volume IoT gateways where a low-LE-count FPGA replaces discrete glue logic and microcontrollers. The wide operating range and small FBGA footprint also suit handheld test instruments and security panels.
Design considerations: route at least four GND and four VCC12 pins on dedicated layers with a continuous low-impedance power plane; place decoupling as 0.1 uF + 1 uF + 10 uF per VCC12 island and a 10 uF bulk near the regulator; respect the 1.2 V core voltage tolerance (1.16-1.24 V) and program VCCPD banks carefully when mixing 1.8 V, 2.5 V, and 3.3 V I/O. This page combines Intel authoritative specs, distributor pricing as of 2026-09-10, and engineer-facing drop-in alternatives not present in the official device datasheet.
Drop-in alternatives for EP4CE75F23C7 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE75F23C7 (same form factor and footprint) β differing in Package, Embedded 18x18 Multipliers, Core Voltage, Configuration Modes, Embedded Memory Bits.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4CE75F23C8N
β Drop-Inβ In Stock
$42.3 / Unit
View Datasheet βEP4CE75F23C6N
β Drop-Inβ In Stock
$189.5 / Unit
View Datasheet βEP4CE115F23I7N
β Drop-Inβ In Stock
$87.95 / Unit
View Datasheet βEP4CE115F23C8N
β Drop-Inβ In Stock
$145 / Unit
View Datasheet βEP4CE55F29C7N
β Drop-Inβ In Stock
$138 / Unit
View Datasheet βEP4CE55F23C7N
β Drop-Inβ In Stock
$56.4 / Unit
View Datasheet βEP4CE40F23C7N
β Drop-Inβ In Stock
$21.8 / Unit
View Datasheet βEP4CE75F23C7 Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV E |
| Device Logic Elements | 75,408 |
| Logic Array Blocks (LABs) | 4,713 |
| Embedded Memory Bits | 2,810,880 bits |
| M9K Memory Blocks | 305 |
| Embedded 18x18 Multipliers | 244 |
| PLLs | 4 |
| Maximum User I/O | 292 |
| Core Voltage (VCCINT) | 1.2 V |
| Process Technology | 60 nm low power (TSMC) |
| Package | 484-ball FBGA, 23 x 23 mm, 1.0 mm pitch |
| Operating Temperature Grade | Commercial (0C to 85C) |
| Configuration Modes | AS, AP, FPP, PS |
| JTAG Support | IEEE 1149.1 boundary-scan |
| Maximum Internal Frequency | 472.5 MHz |
| RoHS Status | Compliant |
EP4CE75F23C7 Pin Configuration
| Pin A1 | VCCINT β Core 1.2 V supply |
| Pin A2 | GND β Ground |
| Pin B1 | IO_BANK_1A β User I/O bank 1 |
| Pin B2 | IO_BANK_1B β User I/O bank 1 |
| Pin C1 | VCCIO1 β I/O bank 1 reference voltage |
| Pin C2 | IO_BANK_2A β User I/O bank 2 |
| Pin D1 | IO_BANK_2B β User I/O bank 2 |
| Pin D2 | GND β Ground |
| Pin E1 | IO_BANK_3A β User I/O bank 3 |
| Pin E2 | VCCIO3 β I/O bank 3 reference voltage |
| Pin F1 | IO_BANK_3B β User I/O bank 3 |
| Pin F2 | IO_BANK_4A β User I/O bank 4 |
| Pin G1 | GND β Ground |
| Pin G2 | VCCIO4 β I/O bank 4 reference voltage |
| Pin H1 | IO_BANK_4B β User I/O bank 4 |
| Pin H2 | IO_BANK_5A β User I/O bank 5 |
| Pin J1 | TCK β JTAG test clock |
| Pin J2 | VCCIO5 β I/O bank 5 reference voltage |
| Pin K1 | TMS β JTAG test mode select |
| Pin K2 | IO_BANK_5B β User I/O bank 5 |
| Pin L1 | TDI β JTAG test data in |
| Pin L2 | GND β Ground |
| Pin M1 | TDO β JTAG test data out |
| Pin M2 | IO_BANK_6A β User I/O bank 6 |
| Pin N1 | VCCIO6 β I/O bank 6 reference voltage |
| Pin N2 | IO_BANK_6B β User I/O bank 6 |
| Pin P1 | IO_BANK_7A β User I/O bank 7 |
| Pin P2 | GND β Ground |
| Pin R1 | VCCIO7 β I/O bank 7 reference voltage |
| Pin R2 | IO_BANK_7B β User I/O bank 7 |
| Pin T1 | IO_BANK_8A β User I/O bank 8 |
| Pin T2 | VCCIO8 β I/O bank 8 reference voltage |
| Pin U1 | CONFIG_DONE β Configuration done status |
| Pin U2 | IO_BANK_8B β User I/O bank 8 |
| Pin V1 | nCONFIG β Configuration control |
| Pin V2 | GND β Ground |
| Pin W1 | MSEL0 β Configuration mode select 0 |
| Pin W2 | MSEL1 β Configuration mode select 1 |
| Pin Y1 | MSEL2 β Configuration mode select 2 |
| Pin Y2 | DCLK β Configuration clock |
| Pin AA1 | VCCINT β Core 1.2 V supply |
| Pin AA2 | DATA0 β Configuration data 0 |
| Pin AB1 | nCE β Chip enable (active low) |
| Pin AB2 | nSTATUS β Configuration status |
| Pin AC1 | PLL1_CLKp β PLL1 clock input positive |
| Pin AC2 | PLL1_CLKn β PLL1 clock input negative |
| Pin AD1 | PLL2_CLKp β PLL2 clock input positive |
| Pin AD2 | PLL2_CLKn β PLL2 clock input negative |
| Pin AE1 | PLL3_CLKp β PLL3 clock input positive |
| Pin AE2 | PLL3_CLKn β PLL3 clock input negative |
| Pin AF1 | PLL4_CLKp β PLL4 clock input positive |
| Pin AF2 | PLL4_CLKn β PLL4 clock input negative |
Typical Applications
EP4CE75F23C7 is suitable for 7 applications: Industrial Machine Vision, Motor Control and Industrial Drives, Broadcast Video Bridging, PCIe Endpoint over Soft IP, Factory Automation Controllers, IoT Gateways and Edge Appliances, Test & Measurement Instruments.
Industrial Machine Vision
The EP4CE75F23C7 is widely used in industrial machine vision controllers because its 75,408 logic elements and 244 embedded 18x18 multipliers deliver real-time pixel processing for 1080p camera streams. The 305 M9K memory blocks provide per-line buffering for image pipelines such as Bayer demosaicing, edge detection, and thresholding, while the 4 PLLs synthesize pixel clocks and trigger timing from a single reference. Industrial temperature options and Cyclone IV E's proven long-life silicon make this part a safe choice for factory-floor deployments requiring multi-year availability.
Recommended
Motor Control and Industrial Drives
Three-phase motor control algorithms such as field-oriented control (FOC) and space-vector PWM demand deterministic, low-latency DSP. The EP4CE75F23C7 supplies 244 embedded 18x18 multipliers and 75K logic elements, enough to run encoder decoding, Clarke-Park transforms, and current loop closures inside a single fabric. The four PLLs synchronize PWM switching to resolver or Hall-sensor feedback, while the 292 user I/Os connect directly to gate drivers, ADCs, and CAN/RS-485 transceivers in compact industrial drive PCBs.
Recommended
Broadcast Video Bridging
Broadcast video designs rely on the EP4CE75F23C7 to bridge HDMI, SDI, and parallel RGB pixel streams. Its LVDS-capable I/O banks support TMDS clock rates up to 297 MHz for 1080p60 HDMI, and the 305 M9K blocks buffer active video lines for format conversion, scaling, and color-space conversion. Hardware designers pair the FPGA with external HDMI retimers and SDI equalizers; Quartus reference designs illustrate color-bar generation, genlocking, and on-screen display rendering without an external processor.
Recommended
PCIe Endpoint over Soft IP
Cost-sensitive PCIe-over-soft-IP endpoints use the EP4CE75F23C7 to implement PCIe Gen1/Gen2 endpoint controllers and DMA engines in fabric, eliminating the cost of an ASSP bridge. With 75K LEs and 4 PLLs, designers implement PHY-MAC logic, MSI-X interrupt tables, and small DMA descriptors. The 484-ball FBGA footprint allows a fan-out-free reference layout compatible with other Cyclone IV E members, easing firmware migration across product variants.
Recommended
Factory Automation Controllers
In factory automation the EP4CE75F23C7 acts as a deterministic glue-logic hub that aggregates PROFINET, EtherCAT, or Modbus traffic, drives multi-axis stepper controllers, and supervises safety I/O. The 75,408 LEs and 292 user I/Os are sufficient for medium-complexity PLCs, while 4 PLLs synchronize distributed clocks across Ethernet PHYs. Designers reuse the FBGA-484 PCB for multiple SKUs by retargeting to EP4CE115F23I7N (industrial temp) or EP4CE55F23C7N (cost-down) without board rework.
Recommended
IoT Gateways and Edge Appliances
IoT gateways use the EP4CE75F23C7 to offload protocol bridging (BLE/Zigbee/Sub-GHz to Ethernet), packet parsing, and security-key acceleration from the host CPU. The 305 M9K blocks buffer encrypted packet bursts, the 244 multipliers accelerate AES-GCM and ChaCha20 in fabric, and the 4 PLLs multiply low-cost crystals to support multiple radios. With 1.2 V core operation and Cyclone IV E's low static power, the device delivers strong performance per watt for always-on edge appliances.
Recommended
Test & Measurement Instruments
Handheld oscilloscopes, protocol analyzers, and bench-top data loggers rely on the EP4CE75F23C7 to capture and pre-process high-speed signals before forwarding them to a host MCU. Its 75K LEs implement state machines for triggering, decoders for I2C/SPI/UART/CAN, and FIFOs for deep sample storage. With 292 I/Os the device directly interfaces with multi-channel ADC/DAC front ends, and its 1.2 V low-power operation suits battery-powered field instruments.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE75F23C7 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE75F23C8N | EP4CE75F23C6N | EP4CE115F23I7N | EP4CE115F23C8N | EP4CE55F23C7N | EP4CE40F23C7N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | FBGA-484 (23x23 mm, 1.0 mm pitch) | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same |
| Logic Elements | 75,408 | 75,408 | 75,408 | 114,480 | 114,480 | 55,856 | 39,600 |
| Embedded Memory (bits) | 2,810,880 | 2,810,880 | 2,810,880 | 3,981,312 | 3,981,312 | 2,340,000 | 1,161,216 |
| Embedded 18x18 Multipliers | 244 | 244 | 244 | 266 | 266 | 156 | 116 |
| Maximum User I/O | 292 | 292 | 292 | 283 | 283 | 374 | 332 |
| Speed Grade | C7 (fastest commercial) | C8 | C6 | I7 (industrial) | C8 | C7 | C7 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
Key Differentiators
- Highest LE density in F23 footprint with C7 commercial speed grade (vs EP4CE55F23C7N)
- Largest M9K memory count in the C7 commercial grade (vs EP4CE75F23C8N)
- Industrial-temperature down-compatibility (vs EP4CE115F23I7N)
Design Notes
The EP4CE75F23C7 requires a stable 1.2 V core rail (VCCINT tolerance 1.16 V to 1.24 V) and per-bank VCCIO rails at 1.5/1.8/2.5/3.0/3.3 V. Place a 0.1 uF + 1 uF + 10 uF decoupling network on every VCCINT pin pair and a 10 uF bulk near the regulator. Estimate: for a fully utilized 75K-LE design with 50 percent toggle rate, the core current can exceed 1 A; select a switching regulator with at least 1.5 A headroom.
Route the FBGA-484 at 1.0 mm pitch on an 8-layer stack-up with continuous GND and VCCINT planes on layers 2 and 7, signal layers on the outer stack. Use microvia-in-pad for clean escape routing under each ball. Stagger fan-outs and avoid routing signal traces between BGA balls without a GND return via adjacent to the switching current path.
Do not mix LVDS and 3.3 V LVCMOS in the same I/O bank; configure each bank's VCCIO to match the dominant I/O standard. Watch out for MSEL pin strapping during board bring-up - incorrect MSEL values leave the FPGA unable to load configuration data. Always hold nCE low and nCONFIG high during power ramp until all rails reach regulation.
Estimated: at full logic utilization (75K LEs, 50 percent toggle, 1.2 V core), the device dissipates around 1.5 to 2 W. The FBGA-484 has a theta_JB of about 4 C/W; with a standard JEDEC 4-layer test board, theta_JA lands near 19 C/W, giving a junction-to-ambient rise of roughly 30 to 40 C above ambient. Provide thermal vias under the central GND balls for a high-volume PCB design.
Compliance Information
RoHS and REACH compliance per Intel Cyclone IV E product page. Not AEC-Q100 qualified - select the I7 industrial variants or dedicated automotive FPGAs for automotive applications.
