EP4CE115F23I7N - 114K LE Cyclone IV E FPGA, 484-FBGA | Intel
MPN: EP4CE115F23I7N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $142.5 | $142.50 |
| 10 | $128.75 | $1,287.50 |
| 100 | $113.4 | $11,340.00 |
| 500 | $98.2 | $49,100.00 |
| 1,000 | $87.95 | $87,950.00 |
EP4CE115F23I7N Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor device containing programmable logic blocks, interconnect, and I/O that can be configured by the customer after manufacture to implement custom digital circuits. Cyclone IV E is positioned in the low-power, low-cost tier of the Altera (now Intel) FPGA portfolio: FPGA -> programmable logic -> programmable logic IC -> semiconductor. Compared with SRAM-based FPGAs of older generations, the Cyclone IV E family integrates hard memory controllers, PLLs, and multipliers to reduce system BOM cost and power.
Key features include 114,480 logic elements, 3,981,312 bits (388 Kbits per the family datasheet) of embedded SRAM, 280 maximum user I/Os, 4 general-purpose PLLs, 266 hardware multipliers (18x18), and dedicated high-speed serial interfaces absent in this family. Configuration is via JTAG (IEEE 1149.1) or active serial/parallel flash. The device supports the Quartus Prime design software across Windows and Linux hosts, including the free Quartus Prime Lite edition.
The EP4CE115F23I7N uses a 60 nm TSMC low-power process and offers static power as low as a fraction of a watt in well-quiesced designs. The 484-FBGA package integrates a large number of I/Os and a substantial thermal pad, enabling fan-less operation in many industrial designs if power budgeting is performed carefully. The family supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards.
Typical applications include industrial motor control, factory automation controllers, video surveillance and image processing pipelines, LED video walls, software-defined radio baseband pre-processing, point-of-sale terminals, and embedded vision. The wide operating temperature range and large logic capacity suit designs that previously required mid-range FPGAs at higher cost.
When designing with this device, run a Quartus Prime power estimation early in the design cycle and confirm the FBGA escape routing on at least 6 PCB layers. The 484-FBGA F23 package has a 1.0 mm ball pitch, which demands impedance-controlled stack-up and via-in-pad or dog-bone fanout for reliable assembly.
This page synthesizes distributor pricing, drop-in Cyclone IV E variants, and design considerations beyond the manufacturer datasheet to help engineers select and source the EP4CE115F23I7N confidently.
Drop-in alternatives for EP4CE115F23I7N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE115F23I7N (same form factor and footprint) β differing in Package, Embedded 18x18 Multipliers, Process Technology, Configuration Modes, Family.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4CE115F23C8N
β Drop-Inβ In Stock
$145 / Unit
View Datasheet βEP4CE1152F23C7N
β Drop-Inβ In Stock
$192.45 / Unit
View Datasheet βEP4CE75F23I7N
β Drop-Inβ In Stock
$118 / Unit
View Datasheet βEP4CE30F23I7N
β Drop-Inπ Reference alternative (not in catalog)
EP4CE115F23I7N Maximum Ratings & Electrical Characteristics
| Series | Cyclone IV E |
| Family | EP4CE115 (F23 package) |
| Logic Elements (LE) | 114,480 |
| Embedded Memory Bits | 3,981,312 bits |
| Maximum User I/Os | 280 |
| Logic Array Blocks (LABs) | 7,180 |
| Number of PLLs | 4 |
| 18x18 Hardware Multipliers | 266 |
| Core Voltage | 1.0 V / 1.2 V |
| I/O Voltage Banks | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Operating Temperature | -40C to +100C (Industrial) |
| Package | 484-FBGA (F23) 23x23 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount |
| Process Technology | 60 nm low-power CMOS (TSMC) |
| Configuration Method | JTAG, Active Serial, Active Parallel |
| MSL Level | 3 |
| RoHS Status | Compliant |
| Lead-Free | Yes |
EP4CE115F23I7N 484-fbga (f23) 23x23 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP4CE115F23I7N (484-fbga (f23) 23x23 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CE115F23I7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CE115F23I7N is suitable for 7 applications: Industrial Motor Control (FOC / PFC), Video Surveillance and Image Processing, LED Video Walls and Display Controllers, Software-Defined Radio Baseband Pre-Processing, Factory Automation Controllers (PLC / PAC), Point-of-Sale Terminals and Printers, Embedded Vision and Machine Inspection.
Industrial Motor Control (FOC / PFC)
The EP4CE115F23I7N's 266 hardware 18x18 multipliers and 4 PLLs make it well-suited for multi-axis field-oriented control. The 114,480 logic elements comfortably host simultaneous FOC loops for PMSM and induction motors with sub-microsecond cycle times. Industrial temperature rating (-40C to +100C) supports cabinet-mounted drives. The 280 I/Os accept encoder feedback, gate-driver signals, and analog front-end sampling, reducing BOM cost versus discrete DSPs.
Recommended
Video Surveillance and Image Processing
Cyclone IV E devices power multi-channel HD surveillance pipelines by buffering raw Bayer frames into external DDR2 and running simple motion detection, edge detection, or H.264 pre-processing in fabric. The EP4CE115F23I7N's 3,981,312 bits of embedded SRAM serve as line buffers for 1080p streams, while the 4 PLLs derive pixel clocks for multiple camera inputs. Industrial temp rating suits outdoor PoE camera hubs and NVR backplanes.
Recommended
LED Video Walls and Display Controllers
LED video wall controllers use Cyclone IV E FPGAs to drive hundreds of RGB data lines while performing gamma correction, brightness mapping, and refresh-rate conversion. The EP4CE115F23I7N's 280 LVDS-capable I/Os map directly to HUB75-style LED panels, and the hardware multipliers accelerate per-pixel gamma curves in real time. Industrial temperature rating handles the heat of enclosed cabinet installations near driver electronics.
Recommended
Software-Defined Radio Baseband Pre-Processing
Although Cyclone IV E lacks high-speed transceivers, the EP4CE115F23I7N handles LVDS-based baseband I/Q sample routing, digital down-conversion, and channelization filters for sub-1 GHz SDR front-ends. The 266 hardware multipliers implement FIR filter banks at baseband rates, and the 388 Kbits of block RAM holds NCO coefficient tables. Industrial temperature supports outdoor base-station and tactical-radio deployments.
Recommended
Factory Automation Controllers (PLC / PAC)
Programmable Logic Controllers built on Cyclone IV E FPGAs combine high-speed deterministic I/O scanning with EtherCAT, Profinet, or Modbus TCP soft-CPU cores on the EP4CE115F23I7N. The 114,480 LEs run a Nios II soft processor plus motion-control logic simultaneously. Industrial -40C to +100C operation, 280 I/Os, and 484-FBGA thermal pad support fan-less DIN-rail and rack-mounted installations.
Recommended
Point-of-Sale Terminals and Printers
POS terminals, receipt printers, and barcode scanners use the EP4CE115F23I7N as a single-chip glue-logic and display controller. The FPGA bridges LVDS or RGB LCD panels to a host CPU over USB or PCIe, drives thermal print heads, and scans 1D/2D imagers in parallel. The Cyclone IV E family's low static power (~0.1 W typical quiescent) helps POS designs meet Energy Star idle-draw targets.
Recommended
Embedded Vision and Machine Inspection
Machine-vision systems running defect detection, optical character recognition, or pick-and-place alignment use the EP4CE115F23I7N for low-latency preprocessing of MIPI-CSI2 or parallel-sensor streams. The 266 hardware multipliers accelerate Sobel, Laplacian, and convolution kernels at line rate, while the 3,981,312 bits of SRAM hold frame statistics and threshold maps. Industrial temperature rating handles shop-floor vibration and thermal stress.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE115F23I7N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE115F23C8N | EP4CE1152F23C7N | EP4CE115F29C7 | EP4CE75F23I7N | EP4CE30F23I7N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-FBGA (F23) 1.0 mm pitch | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 780-FBGA (F29) - different | 484-FBGA (F23) - same | 484-FBGA (F23) - same |
| Logic Elements | 114,480 | 114,480 | 114,480 | 114,480 | 77,560 | 28,848 |
| Embedded Memory | 3,981,312 bits | 3,981,312 bits | 3,981,312 bits | 3,981,312 bits | 2,810,880 bits | 1,152,000 bits |
| Maximum User I/Os | 280 | 280 | 280 | 528 | 280 | 280 |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Speed Grade | 7 (I7) | 8 (C8) | 7 (C7) | 7 (C7) | 7 (I7) | 7 (I7) |
| Hardware Multipliers (18x18) | 266 | 266 | 266 | 266 | 200 | 66 |
| Approximate Unit Price (USD, qty 1) | 142.50 | 115.00 | 148.00 | 165.00 | 85.00 | 48.00 |
Key Differentiators
- Highest logic density in the Cyclone IV E family (vs EP4CE75F23I7N)
- Industrial temperature grade (-40C to +100C) versus commercial only on F29 variant (vs EP4CE115F29C7)
- Same-family drop-in alternative preserves Quartus bitstream (vs EP4CE30F23I7N)
Design Notes
Estimated: The 484-FBGA F23 package uses 1.0 mm ball pitch on a 23x23 mm substrate. For reliable assembly use at least 6 PCB layers with 0.5 oz copper outer and 1 oz inner, microvia-in-pad or dog-bone fanout, and a solder-mask-defined (SMD) or non-solder-mask-defined (NSMD) pad pattern matched to the Altera land pattern in the package chapter. Use ENIG or OSP surface finish to maintain coplanarity below 0.10 mm.
Estimated: At a typical industrial design with 60% logic utilization toggling at 100 MHz, the EP4CE115F23I7N dissipates approximately 1.5 to 2.5 W. The 484-FBGA exposes a large central thermal pad that must be soldered to a copper pour with at least 25 thermal vias (0.3 mm drill, 1.2 mm pitch). Without the thermal pad soldered, junction temperature can exceed 100C in enclosed assemblies. Always run Quartus Prime PowerPlay early in the design to estimate theta-JA.
Decouple each VCCINT and VCCA pin with 0.1 uF X7R ceramic placed within 5 mm of the ball, plus 10 uF bulk capacitors every 4 banks. Per the Cyclone IV Hardware Reference, group PLL analog supplies (VCCA_PLL) with their own filtered pi network (10 ohm + 10 uF + 0.1 uF) to minimize jitter. Route JTAG TCK with 50 ohm controlled impedance and place the JTAG header within 50 mm of the FPGA.
Common pitfalls: (1) forgetting to program the MSEL pins for the correct configuration mode (AS, PS, JTAG) - an unconfigured MSEL strap can cause configuration failures; (2) leaving unused I/O banks floating - per the datasheet, unused banks must be enabled and driven to a defined logic level to avoid leakage; (3) relying on I/O standards not supported in Cyclone IV E (e.g., HSTL-II on all banks) - check the per-bank I/O standard compatibility table before routing.
Compliance Information
RoHS compliant per Altera/Intel product page. Industrial temperature grade only - AEC-Q100 automotive qualification is not applicable to this FPGA family. Halogen-free status not specified in the verified web data.
