EP4CE115F23I7N vs EP4CGX110DF23I7N Comparison
Detailed side-by-side comparison of EP4CE115F23I7N by Intel and EP4CGX110DF23I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4CE115F23I7N | EP4CGX110DF23I7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $87.95 | $182.00 |
| Series | Cyclone IV E | β |
| Family | EP4CE115 (F23 package) | Cyclone IV GX |
| Logic Elements (LE) | 114,480 | β |
| Embedded Memory Bits | 3,981,312 bits | β |
| Maximum User I/Os | 280 | β |
| Logic Array Blocks (LABs) | 7,180 | 6,839 |
| Number of PLLs | 4 | β |
| 18x18 Hardware Multipliers | 266 | β |
| Core Voltage | 1.0 V / 1.2 V | β |
| I/O Voltage Banks | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V | β |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (industrial) |
| Package | 484-FBGA (F23) 23x23 mm, 1.0 mm pitch | 484-ball FBGA, 23 x 23 mm, 1.00 mm pitch |
| Mounting Type | Surface Mount | Surface Mount |
| Process Technology | 60 nm low-power CMOS (TSMC) | 60 nm low-power CMOS |
| Configuration Method | JTAG, Active Serial, Active Parallel | β |
| MSL Level | 3 | β |
| RoHS Status | Compliant | Compliant |
| Lead-Free | Yes | β |
| Logic Elements | β | 109,424 |
| User I/O Pins | β | 270 |
| Embedded Memory | β | 4.4 Mbits (approximate) |
| Embedded 18x18 Multipliers | β | 56 |
| Transceivers | β | Up to 3.125 Gbps embedded transceivers |
| Core Supply Voltage (VCCINT) | β | 1.15 V to 1.25 V (nominal 1.2 V) |
| Speed Grade | β | 7 |
| Package Code | β | BGA (FBGA) |
| Configuration Memory | β | SRAM-based (volatile, requires external config device) |