EP4CE6E22C6 vs EP4CE6E22A7N Comparison
Detailed side-by-side comparison of EP4CE6E22C6 by Intel and EP4CE6E22A7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP4CE6E22A7N
EP4CE6E22A7N - Cyclone IV E FPGA, 6K LEs, 144-EQFP | Intel
EP4CE6E22A7N β ActiveSpecification Comparison
| Parameter | EP4CE6E22C6 | EP4CE6E22A7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $12.05 | $17.40 |
| Family | Cyclone IV E | β |
| Device Logic Elements | 6,272 LE | β |
| Logic Array Blocks (LABs) | 392 LABs | β |
| Total RAM Bits | 270 Kbit | β |
| Embedded 18x18 Multipliers | 15 | β |
| PLLs | 2 | β |
| Maximum User I/Os | 91 | β |
| Core Voltage | 1.2 V | 1.2 V |
| Speed Grade | C6 | β |
| Operating Temperature | 0 Β°C to +85 Β°C (Commercial) | β |
| Package Type | 144-pin EQFP (Enhanced QFP, exposed pad) | 144-pin EQFP (E22) with exposed pad |
| Package Dimensions | 22 mm Γ 22 mm | β |
| Lead Pitch | 0.5 mm | β |
| Mounting Type | Surface Mount | Surface Mount |
| Process Technology | TSMC 60 nm low-k | β |
| Configuration Method | SRAM-based (volatile); JTAG, Active Serial, Passive Serial | β |
| RoHS Status | Compliant | Compliant |
| Series | β | Cyclone IV E |
| Logic Elements | β | 6,272 |
| Embedded Memory (bits) | β | 276,480 |
| Embedded Multipliers (18x18) | β | 15 |
| User I/O Pins | β | 91 |
| Number of I/O Banks | β | 4 |
| Number of PLLs | β | 2 |
| Global Clock Networks | β | 10 |
| Process Node | β | 60 nm low power |
| Operating Temperature Grade | β | Automotive A7 (-40C to +125C junction) |
| Configuration Modes | β | JTAG, AS, PS, FPP |