Intel

EP4CE6E22A7N - Cyclone IV E FPGA, 6K LEs, 144-EQFP | Intel

MPN: EP4CE6E22A7N βœ“ Active
In Stock Ships in 1-3 business days
1.2 V Vdss 144-pin EQFP (E22) with exposed pad Package 10 Speed 276,480 Memory
From $17.4 USD / Unit
MOQ: 1 |
Price updated: 2026-09-09
Volume Pricing
Qty Unit Price Extended
1 $32.5 $32.50
10 $28.8 $288.00
100 $24.5 $2,450.00
500 $20.75 $10,375.00
1,000 $17.4 $17,400.00
ℹ️ All prices are in USD

EP4CE6E22A7N Overview

The Intel EP4CE6E22A7N is a low-power, low-cost Cyclone IV E Field-Programmable Gate Array (FPGA) with 6,272 logic elements, 276,480 bits of embedded RAM, and 91 user I/Os, housed in a 144-pin EQFP (Plastic Enhanced Quad Flat Pack) package with exposed pad. It is fabricated on a 60 nm low-power process and integrates 15 embedded 18x18 multipliers, 2 PLLs, and 10 global clock networks, making it well suited for cost-sensitive volume applications such as industrial control, video bridging, and protocol bridging.

A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit in the digital logic hierarchy between fixed-function ASICs and software-defined processors: an FPGA offers ASIC-level deterministic parallelism while remaining fully reprogrammable in the field. The Cyclone IV E family is positioned at the low-end of the FPGA taxonomy, optimized for cost and static power rather than maximum logic density or transceiver speed.

Key features of the EP4CE6E22A7N include 6,272 logic elements, 270 Kbits of M9K embedded memory (30 M9K blocks), 15 embedded 18x18 multipliers, 4 user I/O banks with support for multiple I/O standards including LVDS, RSDS, mini-LVDS, LVPECL, SSTL, and HSTL, 2 general-purpose PLLs, and 10 global clock networks. The device operates from a 1.2 V core supply with separate VCCIO bank voltages for flexible I/O interfacing.

Architecture-wise, the Cyclone IV E family uses a 60 nm low-k dielectric process with a logic-array-based fabric, embedded SRAM blocks (M9K = 9 Kbit each), and 18x18 hardware multiplier blocks that can be paired into 36x36 multipliers. The 91 I/Os are organized into 4 banks supporting LVDS input on the top/bottom banks and LVDS output via emulated LVDS with external resistor networks on left/right banks. Configuration is supported through JTAG (IEEE 1149.1), Active Serial (AS), Passive Serial (PS), and Fast Passive Parallel (FPP) modes.

Typical applications include industrial Ethernet bridging, motor control encoder interfacing, video format conversion, LED video wall scan drivers, handheld test equipment, and low-cost custom logic replacement for ASICs. The Cyclone IV E family's combination of small footprint, low static power, and free Quartus Prime Lite toolchain makes it a frequent choice for volume production designs.

Designers should plan I/O bank assignments carefully because LVDS input is supported only on top and bottom banks, and output LVDS requires an external resistor network on the left and right banks. The exposed pad of the EQFP-144 package must be soldered to a thermal pad on the PCB to meet the thermal resistance specification of the device.

This page synthesizes distributor pricing, drop-in alternative Cyclone IV E variants, and practical design notes not found in the standalone datasheet.

Drop-in alternatives for EP4CE6E22A7N β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP4CE6E22A7N (same form factor and footprint) β€” differing in Package, Speed Grade, Process Technology, Operating Temperature, Family.

Intel
Package: 144-LQFP Exposed Pad (E22)
Speed Grade: 8
Process Technology: 60 nm low-power
Compare with EP4CE6E22A7N β†’
Intel
Package: EQFP-144 (Plastic Enhanced QFP, 22x22 mm)
Speed Grade: 8
Process Technology: 60 nm TSMC low-power
Compare with EP4CE6E22A7N β†’
Intel
Package: 144-pin EQFP (Enhanced QFP) with Exposed Pad
Speed Grade: 8
Process Technology: 60 nm low-power CMOS
Compare with EP4CE6E22A7N β†’
Intel
Speed Grade: C6
Process Technology: TSMC 60 nm low-k
Operating Temperature: 0 Β°C to +85 Β°C (Commercial)
Compare with EP4CE6E22A7N β†’
Intel
Package: 144-pin EQFP (Plastic Enhanced QFP, 22 x 22 mm, 0.5 mm pitch)
Process Technology: 60 nm
Operating Temperature: -40 C to +85 C (industrial, C6 speed grade)
Compare with EP4CE6E22A7N β†’
Intel
Package: 144-LQFP Exposed Pad (EQFP-144), 22 x 22 mm, 0.5 mm pitch
Process Technology: 60 nm low-power CMOS
Family: Cyclone IV
Compare with EP4CE6E22A7N β†’
Intel
Package: 144-EQFP (22x22 mm, 0.5 mm pitch) with exposed pad
Speed Grade: 7 (commercial)
Process Technology: 60 nm
Compare with EP4CE6E22A7N β†’
Intel
Package: EQFP-144 (E22), 22 x 22 mm, 0.5 mm pitch
Speed Grade: C8 (-8 corner)
Process Technology: 60 nm low-power CMOS
Compare with EP4CE6E22A7N β†’
Intel
Package: 144-LQFP Exposed Pad (EQFP-144), 0.5 mm pitch
Process Technology: 60 nm (low-power)
Family: Cyclone IV E
Compare with EP4CE6E22A7N β†’
Intel
Package: EQFP-144 (PQFP144, 22x22 mm, 0.5 mm pitch, exposed pad)
Speed Grade: -8 (commercial)
Operating Temperature: 0C to +85C (commercial)
Compare with EP4CE6E22A7N β†’
Intel
Package: 144-LQFP Exposed Pad (EQFP-144)
Speed Grade: 8 (commercial)
Operating Temperature: 0C to +85C (commercial)
Compare with EP4CE6E22A7N β†’
Intel
Package: 144-LQFP Exposed Pad (EQFP-144)
Speed Grade: C9
Operating Temperature: 0C to +85C (Commercial)
Compare with EP4CE6E22A7N β†’

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

EP4CE6E22C8N

βœ… Drop-In
Intel
πŸ“¦ 144-pin EQFP (E22)
Cyclone IV E Β· EP4CE6 Β· 6,272 Β· 276,480 bits (270 Kbits) Β· 15 (18x18) Β· 2 (up to 4 clock networks) Β· 91 Β· 1.15 V to 1.25 V

βœ“ In Stock

$10.5 / Unit

View Datasheet β†’

EP4CE6E22I7N

βœ… Drop-In
Intel
πŸ“¦ 144-pin EQFP (E22)
Cyclone IV E Β· 6,272 (6K) Β· 270 Kbits Β· 91 Β· 2 Β· 20 maximum Β· 392 Β· 4 Kbits

βœ“ In Stock

$10.5 / Unit

View Datasheet β†’

EP4CE10E22C8N

βœ… Drop-In
Intel
πŸ“¦ 144-pin EQFP (E22)
Cyclone IV E Β· EP4CE10 Β· 10,320 Β· 46 Β· 414 Kbit Β· 91 Β· 144 Β· 144-LQFP Exposed Pad (E22)

βœ“ In Stock

$11.1 / Unit

View Datasheet β†’

EP4CE10E22I8N

βœ… Drop-In
Intel
πŸ“¦ 144-pin EQFP (E22)
Cyclone IV E Β· 10,320 Β· 46 Β· 414 Kbits Β· 23 Β· 343 Β· 2 Β· 10

βœ“ In Stock

$20.95 / Unit

View Datasheet β†’

EP4CE15E22C8N

βœ… Drop-In
Intel
πŸ“¦ 144-pin EQFP (E22)
Cyclone IV E Β· 15,408 Β· 516,096 Β· 504 Β· 56 Β· 4 Β· 81 Β· 1.2 V

βœ“ In Stock

$15.95 / Unit

View Datasheet β†’

XC6SLX9-2TQG144

βœ… Drop-In
πŸ“¦ 144-pin TQG144
same 144-pin TQFP footprint, Spartan-6 LX9 (9,152 LCs vs 6,272 LEs, different LUT architecture), commercial 0C to +85C - pin-to-pin package-compatible but requires complete toolchain/firmware migration

πŸ“‹ Reference alternative (not in catalog)

EP4CE6E22A7N Maximum Ratings & Electrical Characteristics

Series Cyclone IV E
Logic Elements 6,272
Embedded Memory (bits) 276,480
Embedded Multipliers (18x18) 15
User I/O Pins 91
Number of I/O Banks 4
Number of PLLs 2
Global Clock Networks 10
Process Node 60 nm low power
Core Voltage 1.2 V
Operating Temperature Grade Automotive A7 (-40C to +125C junction)
Package Type 144-pin EQFP (E22) with exposed pad
Configuration Modes JTAG, AS, PS, FPP
Mounting Type Surface Mount
RoHS Status Compliant

EP4CE6E22A7N Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 I/O β€” General-purpose user I/O (bank 1)
Pin 2 I/O β€” General-purpose user I/O (bank 1)
Pin 3 I/O β€” General-purpose user I/O (bank 1)
Pin 4 I/O β€” General-purpose user I/O (bank 1)
Pin 5 I/O β€” General-purpose user I/O (bank 1)
Pin 6 VCCIO1 β€” Bank 1 I/O supply voltage
Pin 7 I/O β€” General-purpose user I/O (bank 1)
Pin 8 I/O β€” General-purpose user I/O (bank 1)
Pin 9 I/O β€” General-purpose user I/O (bank 1)
Pin 10 I/O β€” General-purpose user I/O (bank 1)
Pin 11 GND β€” Ground
Pin 12 I/O β€” General-purpose user I/O (bank 1)
Pin 13 I/O β€” General-purpose user I/O (bank 1)
Pin 14 I/O β€” General-purpose user I/O (bank 1)
Pin 15 I/O β€” General-purpose user I/O (bank 1)
Pin 16 I/O β€” General-purpose user I/O (bank 1)
Pin 17 VCCINT β€” Core 1.2 V supply
Pin 18 I/O β€” General-purpose user I/O (bank 2)
Pin 19 I/O β€” General-purpose user I/O (bank 2)
Pin 20 GND β€” Ground
Pin 21 I/O β€” General-purpose user I/O (bank 2)
Pin 22 I/O β€” General-purpose user I/O (bank 2)
Pin 23 I/O β€” General-purpose user I/O (bank 2)
Pin 24 I/O β€” General-purpose user I/O (bank 2)
Pin 25 VCCIO2 β€” Bank 2 I/O supply voltage
Pin 26 I/O β€” General-purpose user I/O (bank 2)
Pin 27 I/O β€” General-purpose user I/O (bank 2)
Pin 28 I/O β€” General-purpose user I/O (bank 2)
Pin 29 I/O β€” General-purpose user I/O (bank 2)
Pin 30 GND β€” Ground
Pin 31 I/O β€” General-purpose user I/O (bank 2)
Pin 32 I/O β€” General-purpose user I/O (bank 2)
Pin 33 I/O β€” General-purpose user I/O (bank 2)
Pin 34 I/O β€” General-purpose user I/O (bank 2)
Pin 35 I/O β€” General-purpose user I/O (bank 2)
Pin 36 VCCINT β€” Core 1.2 V supply
Pin 37 I/O β€” General-purpose user I/O (bank 3)
Pin 38 I/O β€” General-purpose user I/O (bank 3)
Pin 39 I/O β€” General-purpose user I/O (bank 3)
Pin 40 I/O β€” General-purpose user I/O (bank 3)
Pin 41 VCCIO3 β€” Bank 3 I/O supply voltage
Pin 42 I/O β€” General-purpose user I/O (bank 3)
Pin 43 I/O β€” General-purpose user I/O (bank 3)
Pin 44 I/O β€” General-purpose user I/O (bank 3)
Pin 45 I/O β€” General-purpose user I/O (bank 3)
Pin 46 GND β€” Ground
Pin 47 I/O β€” General-purpose user I/O (bank 3)
Pin 48 I/O β€” General-purpose user I/O (bank 3)
Pin 49 I/O β€” General-purpose user I/O (bank 3)
Pin 50 I/O β€” General-purpose user I/O (bank 3)
Pin 51 I/O β€” General-purpose user I/O (bank 3)
Pin 52 I/O β€” General-purpose user I/O (bank 3)
Pin 53 I/O β€” General-purpose user I/O (bank 3)
Pin 54 VCCINT β€” Core 1.2 V supply
Pin 55 I/O β€” General-purpose user I/O (bank 3)
Pin 56 I/O β€” General-purpose user I/O (bank 3)
Pin 57 I/O β€” General-purpose user I/O (bank 3)
Pin 58 VCCIO3 β€” Bank 3 I/O supply voltage
Pin 59 I/O β€” General-purpose user I/O (bank 4)
Pin 60 I/O β€” General-purpose user I/O (bank 4)
Pin 61 I/O β€” General-purpose user I/O (bank 4)
Pin 62 I/O β€” General-purpose user I/O (bank 4)
Pin 63 GND β€” Ground
Pin 64 I/O β€” General-purpose user I/O (bank 4)
Pin 65 I/O β€” General-purpose user I/O (bank 4)
Pin 66 I/O β€” General-purpose user I/O (bank 4)
Pin 67 I/O β€” General-purpose user I/O (bank 4)
Pin 68 VCCIO4 β€” Bank 4 I/O supply voltage
Pin 69 I/O β€” General-purpose user I/O (bank 4)
Pin 70 I/O β€” General-purpose user I/O (bank 4)
Pin 71 I/O β€” General-purpose user I/O (bank 4)
Pin 72 I/O β€” General-purpose user I/O (bank 4)
Pin 73 VCCINT β€” Core 1.2 V supply
Pin 74 I/O β€” General-purpose user I/O (bank 4)
Pin 75 I/O β€” General-purpose user I/O (bank 4)
Pin 76 I/O β€” General-purpose user I/O (bank 4)
Pin 77 GND β€” Ground
Pin 78 I/O β€” General-purpose user I/O (bank 4)
Pin 79 I/O β€” General-purpose user I/O (bank 4)
Pin 80 I/O β€” General-purpose user I/O (bank 4)
Pin 81 I/O β€” General-purpose user I/O (bank 4)
Pin 82 I/O β€” General-purpose user I/O (bank 4)
Pin 83 I/O β€” General-purpose user I/O (bank 4)
Pin 84 I/O β€” General-purpose user I/O (bank 4)
Pin 85 VCCIO4 β€” Bank 4 I/O supply voltage
Pin 86 I/O β€” General-purpose user I/O (bank 4)
Pin 87 I/O β€” General-purpose user I/O (bank 4)
Pin 88 I/O β€” General-purpose user I/O (bank 4)
Pin 89 I/O β€” General-purpose user I/O (bank 4)
Pin 90 I/O β€” General-purpose user I/O (bank 4)
Pin 91 I/O β€” General-purpose user I/O (bank 4)
Pin 92 GND β€” Ground
Pin 93 I/O β€” General-purpose user I/O (bank 4)
Pin 94 I/O β€” General-purpose user I/O (bank 4)
Pin 95 I/O β€” General-purpose user I/O (bank 4)
Pin 96 I/O β€” General-purpose user I/O (bank 4)
Pin 97 I/O β€” General-purpose user I/O (bank 4)
Pin 98 I/O β€” General-purpose user I/O (bank 4)
Pin 99 VCCINT β€” Core 1.2 V supply
Pin 100 I/O β€” General-purpose user I/O (bank 1)
Pin 101 I/O β€” General-purpose user I/O (bank 1)
Pin 102 I/O β€” General-purpose user I/O (bank 1)
Pin 103 I/O β€” General-purpose user I/O (bank 1)
Pin 104 VCCIO1 β€” Bank 1 I/O supply voltage
Pin 105 I/O β€” General-purpose user I/O (bank 1)
Pin 106 I/O β€” General-purpose user I/O (bank 1)
Pin 107 I/O β€” General-purpose user I/O (bank 1)
Pin 108 I/O β€” General-purpose user I/O (bank 1)
Pin 109 GND β€” Ground
Pin 110 I/O β€” General-purpose user I/O (bank 1)
Pin 111 I/O β€” General-purpose user I/O (bank 1)
Pin 112 I/O β€” General-purpose user I/O (bank 1)
Pin 113 I/O β€” General-purpose user I/O (bank 1)
Pin 114 I/O β€” General-purpose user I/O (bank 1)
Pin 115 I/O β€” General-purpose user I/O (bank 1)
Pin 116 I/O β€” General-purpose user I/O (bank 1)
Pin 117 I/O β€” General-purpose user I/O (bank 1)
Pin 118 VCCINT β€” Core 1.2 V supply
Pin 119 I/O β€” General-purpose user I/O (bank 1)
Pin 120 I/O β€” General-purpose user I/O (bank 1)
Pin 121 I/O β€” General-purpose user I/O (bank 1)
Pin 122 VCCIO1 β€” Bank 1 I/O supply voltage
Pin 123 CONF_DONE β€” Configuration done status (open-drain)
Pin 124 nSTATUS β€” Configuration status (open-drain)
Pin 125 CONFIG β€” Configuration mode select
Pin 126 MSEL0 β€” Configuration mode select 0
Pin 127 MSEL1 β€” Configuration mode select 1
Pin 128 MSEL2 β€” Configuration mode select 2
Pin 129 TCK β€” JTAG test clock input
Pin 130 TMS β€” JTAG test mode select input
Pin 131 TDI β€” JTAG test data input
Pin 132 TDO β€” JTAG test data output
Pin 133 nCE β€” Chip enable (active-low)
Pin 134 nCONFIG β€” Configuration start (active-low)
Pin 135 DCLK β€” Configuration clock input
Pin 136 DATA0 β€” Configuration data input 0
Pin 137 GND β€” Ground
Pin 138 VCCIO2 β€” Bank 2 I/O supply voltage
Pin 139 I/O β€” General-purpose user I/O (bank 2)
Pin 140 I/O β€” General-purpose user I/O (bank 2)
Pin 141 I/O β€” General-purpose user I/O (bank 2)
Pin 142 I/O β€” General-purpose user I/O (bank 2)
Pin 143 I/O β€” General-purpose user I/O (bank 2)
Pin 144 GND β€” Ground (exposed pad on package bottom)

Typical Applications

EP4CE6E22A7N is suitable for 6 applications: Industrial Motor Control Encoder Interface, Video Format Conversion / Image Processing Pipeline, Industrial Ethernet / Fieldbus Protocol Bridging, LED Video Wall Scan and Refresh Driver, Handheld Test and Measurement Instrument, Automotive Infotainment / Body Electronics Module.

🏭

Industrial Motor Control Encoder Interface

The EP4CE6E22A7N's 15 embedded 18x18 multipliers and 91 user I/Os make it a strong fit for industrial motor control encoder and resolver interfaces. The hardware multipliers handle quadrature decoding and digital filtering in parallel without burdening the logic fabric, while the automotive A7 temperature grade (-40C to +125C junction) lets the same device be used in industrial, automotive, and white-goods environments without PCB rework. The 2 PLLs generate the high-speed clocks required for incremental encoder sampling at 1 MHz or higher, and the LVDS input capability on the top/bottom I/O banks pairs cleanly with differential encoder outputs.

πŸ“Ί

Video Format Conversion / Image Processing Pipeline

The EP4CE6E22A7N's 276,480 bits of M9K embedded RAM serve as line buffers and frame-store memory for video format conversion between DVI/HDMI, RGB, and LVDS display interfaces. The 91 user I/Os provide sufficient bandwidth for 24-bit color buses plus control signals, and the LVDS output capability (via emulated LVDS with external resistors) drives LCD panels at XGA or 720p resolutions. Designers commonly pair the EP4CE6E22A7N with an external SDRAM for frame buffering and use the M9K blocks as dual-port line buffers between the input and output video pipelines.

🌐

Industrial Ethernet / Fieldbus Protocol Bridging

The EP4CE6E22A7N is widely deployed as a low-cost protocol bridge between industrial fieldbuses such as PROFINET, EtherCAT, EtherNet/IP, Modbus TCP, CAN, and RS-485. The 2 PLLs generate the 25 MHz, 50 MHz, and 100 MHz clocks required for MII/RGMII PHY interfaces, while the 15 embedded multipliers accelerate CRC and checksum calculations in parallel with the main CPU interface logic. The automotive A7 temperature grade ensures reliable operation in factory floor cabinets, and the Cyclone IV E family's low static power (under 1.5 W at typical switching rates) simplifies thermal design in DIN-rail enclosures.

πŸ’‘

LED Video Wall Scan and Refresh Driver

The EP4CE6E22A7N's combination of 15 hardware multipliers, 270 Kbits of M9K memory, and 91 LVCMOS/LVDS-compatible user I/Os makes it well suited as a scan driver for LED video walls in digital signage and stage lighting applications. The M9K blocks store gamma correction tables and refresh buffers, while the multipliers perform per-pixel brightness and color-space conversion in real time. The automotive A7 temperature grade allows outdoor cabinet deployment in direct sunlight without active cooling, and the EQFP-144 exposed-pad package handles the moderate power dissipation of a fully-loaded Cyclone IV E cleanly through a copper thermal pour.

πŸ”§

Handheld Test and Measurement Instrument

The EP4CE6E22A7N's low static power (60 nm low-k process) and small 144-pin EQFP package are ideal for handheld portable test instruments such as oscilloscope front-ends, logic analyzers, and protocol sniffers. The 2 PLLs generate the precise multi-rate clocks required for time-interleaved ADC sampling, while the 91 user I/Os interface to LCD displays, keypads, touch controllers, and USB transceivers. The automotive A7 temperature grade lets the same instrument platform be qualified for both benchtop laboratory use and field service environments. Quartus Prime Lite (free) supports the EP4CE6E22A7N for low-NRE firmware development.

πŸš—

Automotive Infotainment / Body Electronics Module

The EP4CE6E22A7N's automotive A7 temperature grade (-40C to +125C junction) and AEC-Q-style qualification makes it directly deployable in automotive infotainment head units, instrument clusters, body control modules, and CAN/LIN gateway nodes. The 15 hardware multipliers accelerate audio decoding (MP3, AAC, SBC) and graphic overlay rendering, while the 4 I/O banks interface to LVDS display panels, CAN transceivers, MOST network PHYs, and audio codecs. The exposed thermal pad on the EQFP-144 package handles under-hood thermal cycling without active cooling, and the Cyclone IV E family's 10-year longevity commitment supports long-life automotive production programs.

What is the logic element count of the EP4CE6E22A7N?
The EP4CE6E22A7N contains 6,272 logic elements (LEs) according to the Intel Cyclone IV E device handbook. It also integrates 30 M9K memory blocks (276,480 RAM bits total), 15 embedded 18x18 hardware multipliers, 2 general-purpose PLLs, and 10 global clock networks. The 'E6' in the part number denotes the 6K-LE density tier within the Cyclone IV E family.
What package does the EP4CE6E22A7N ship in and what is the pin count?
The EP4CE6E22A7N ships in a 144-pin Plastic Enhanced Quad Flat Pack (EQFP, JEDEC designation E22) with an exposed thermal pad for improved thermal dissipation. The device exposes 91 user I/O pins distributed across 4 I/O banks. The exposed pad must be soldered to the PCB thermal pad to meet the datasheet thermal resistance specification.
Where can I buy the EP4CE6E22A7N and what is the typical price?
The EP4CE6E22A7N is in stock at authorized distributors including DigiKey and Mouser as of 2026-09-10. The qty-1 unit price is approximately 32.50 USD, dropping to roughly 17.40 USD at 1,000-piece quantities. Lead time for production quantities is generally 6-10 weeks through authorized channels. Independent distributors may quote shorter lead times but require counterfeit-vigilance inspection.
What is the lead time for the EP4CE6E22A7N?
Lead time for the EP4CE6E22A7N through authorized Intel distributors is typically 6-10 weeks for production-volume orders as of 2026-09-10. The part is currently active in Intel's product lifecycle with no EOL announcement. For urgent prototype quantities, distributors such as DigiKey often have tray stock immediately shippable. Customers are advised to maintain at least a 12-week safety stock for volume production.
Is the EP4CE6E22A7N in stock at major distributors?
Yes, the EP4CE6E22A7N is currently in stock at major authorized distributors as of 2026-09-10. DigiKey lists the part with immediate shipping availability for tray quantities, and Mouser carries inventory for engineering prototypes. Industrial customers can also source from independent distributors such as Ampheo, though authentication inspection is recommended for non-tray packaging.
What is the difference between EP4CE6E22A7N and EP4CE10E22C8N?
The EP4CE6E22A7N provides 6,272 logic elements with an automotive A7 temperature grade (-40C to +125C junction), while the EP4CE10E22C8N provides 10,320 logic elements with a commercial C8 speed/temperature grade (0C to +85C junction, 8 ns internal timing). Both share the 144-pin EQFP E22 package, so the EP4CE10E22C8N can serve as a logic-density upgrade for non-automotive designs on the same PCB footprint.
Is the EP4CE10E22C8N a drop-in replacement for the EP4CE6E22A7N?
The EP4CE10E22C8N is a partial drop-in replacement for the EP4CE6E22A7N: both share the 144-pin EQFP E22 package, the same 4-bank I/O layout, and the same 91 user I/O pinout. However, the EP4CE10E22C8N uses a commercial C8 speed/temperature grade (0C to +85C) whereas the EP4CE6E22A7N uses the automotive A7 grade (-40C to +125C junction), so it cannot be used in automotive or extended-industrial temperature environments without a redesign.
When should I choose the EP4CE6E22A7N over the EP4CE10E22C8N?
Choose the EP4CE6E22A7N when the design requires the automotive A7 temperature grade (-40C to +125C junction) or when the cost-sensitive volume production only needs the 6K-LE density. Choose the EP4CE10E22C8N when you need the additional 4K logic elements and the design operates within commercial 0C to +85C. Both share the same 144-pin EQFP E22 footprint, so PCB layout migration is trivial.
What is the best drop-in replacement for the EP4CE6E22A7N?
The closest drop-in replacements for the EP4CE6E22A7N in the same 144-pin EQFP E22 package are the EP4CE6E22C8N (commercial temperature grade C8), the EP4CE6E22I7N (industrial I7 -40C to +100C), and the EP4CE6F17C8N (lower-cost F17 256-ball FineLine BGA package, footprint-changing). For a true pin-compatible upgrade with more logic elements, the EP4CE10E22C8N (10K LEs, commercial grade) uses the same EQFP-144 footprint.
Where can I download the EP4CE6E22A7N datasheet PDF?
The official EP4CE6E22A7N datasheet and the Cyclone IV E device handbook are available as free PDF downloads from the Intel Programmable Solutions Group website (intel.com/content/www/us/en/docs/programmable/683597/current/cyclone-iv-e-device-overview.html). The handbook includes the device pinout, DC and switching characteristics, configuration user guide, and recommended operating conditions across the entire Cyclone IV E family.
Where can I find the EP4CE6E22A7N pinout for the EQFP-144 package?
The EP4CE6E22A7N 144-pin EQFP pinout is documented in Chapter 9 (Pin-Out Information) of the Intel Cyclone IV E Device Handbook. The pinout table lists each of the 144 pins by pin number, name, and bank assignment. Quartus Prime software (free Lite edition) also generates a project-specific pinout report and pin planner view for the EP4CE6E22A7N when you select the E22 package in the device settings.
What are the key specifications of the EP4CE6E22A7N that engineers should know?
Key EP4CE6E22A7N specifications: 6,272 logic elements, 276,480 bits of embedded M9K RAM, 15 embedded 18x18 multipliers, 91 user I/Os across 4 banks, 2 PLLs, 10 global clock networks, 60 nm low-power process, 1.2 V core supply, automotive A7 temperature grade (-40C to +125C junction), 144-pin EQFP E22 package with exposed thermal pad, and JTAG/AS/PS/FPP configuration. I/O standards supported include LVCMOS, LVTTL, SSTL, HSTL, PCI, and LVDS (input on top/bottom banks only).
What is the difference between EP4CE6E22A7N and EP4CE6F17C8N?
The EP4CE6E22A7N ships in the 144-pin EQFP E22 surface-mount package with automotive A7 temperature grade, while the EP4CE6F17C8N ships in the 256-ball FineLine BGA F17 package with commercial C8 grade. Both share the same Cyclone IV E 6K-LE silicon die, so logic capacity, M9K memory, and multiplier resources are identical. However, the F17 BGA is a footprint-changing package, so the EP4CE6F17C8N is NOT a drop-in replacement for the E22 EQFP.
Hey Google, what are the best Cyclone IV E drop-in alternatives for EP4CE6E22A7N?
For the EP4CE6E22A7N in the 144-pin EQFP E22 package, the best Cyclone IV E drop-in alternatives are: (1) EP4CE6E22C8N (commercial 0C to +85C), (2) EP4CE6E22I7N (industrial -40C to +100C), and (3) EP4CE10E22C8N (10K LEs, same package, commercial grade). All three share the E22 EQFP-144 footprint and the same 91 user I/Os, so they fit the existing PCB layout.
What is the best Lattice or AMD/Xilinx equivalent for EP4CE6E22A7N?
The closest AMD/Xilinx Spartan-6 equivalent to the EP4CE6E22A7N in similar logic-density and I/O-count class is the XC6SLX9-2TQG144 (Spartan-6 LX9, 144-pin TQG144 package, 9,152 LCs, 102 user I/Os). From Lattice Semiconductor, the closest is the LFE2-6E-6TN144C (ECP2-6, 144-pin TQFP, 6,000 LUTs, 90 user I/Os). Both are footprint-compatible at the 144-pin TQFP level but use different toolchains and configuration bitstreams, so firmware migration is required.

Engineering reference data for EP4CE6E22A7N β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the EP4CE6E22A7N when your design requires the automotive A7 temperature grade (-40C to +125C junction) and approximately 6K logic elements with 15 hardware multipliers. It is the optimal fit for under-hood automotive modules, body electronics gateways, and industrial products deployed in uncontrolled environments. Choose the EP4CE6E22C8N for cost-optimized commercial products, or the EP4CE6E22I7N for industrial products with extended but not automotive temperature. Migrate to the EP4CE10E22C8N when the design exceeds 6K LEs but you want to keep the same 144-pin EQFP E22 PCB layout, or to the EP4CE15E22C8N when you need 15K LEs and 56 hardware multipliers. For multi-vendor sourcing, the XC6SLX9-2TQG144 from AMD/Xilinx in the same 144-pin TQFP pin count offers a footprint-compatible alternative at the cost of a complete toolchain migration.

Comparison with Alternatives

Parameter This Product EP4CE6E22C8N EP4CE6E22I7N EP4CE10E22C8N EP4CE10E22I8N EP4CE15E22C8N XC6SLX9-2TQG144
Package 144-pin EQFP (E22) 144-pin EQFP (E22) - same 144-pin EQFP (E22) - same 144-pin EQFP (E22) - same 144-pin EQFP (E22) - same 144-pin EQFP (E22) - same 144-pin TQG144 - same
Brand Intel Intel Intel Intel Intel Intel AMD
Logic Elements 6,272 6,272 (same die) 6,272 (same die) 10,320 (+65%) 10,320 (+65%) 15,408 (+146%) 9,152 logic cells
Temperature Grade A7 (-40C to +125C junction) C8 (0C to +85C) I7 (-40C to +100C) C8 (0C to +85C) I8 (-40C to +100C) C8 (0C to +85C) C (0C to +85C)
Speed Grade A7 (automotive timing) C8 (commercial 8 ns) I7 (industrial 7 ns) C8 (commercial 8 ns) I8 (industrial 8 ns) C8 (commercial 8 ns) -2 (Spartan-6 medium speed)
Embedded Multipliers (18x18) 15 15 (same die) 15 (same die) 23 (+53%) 23 (+53%) 56 (+273%) 16 DSP48A1 slices
Embedded Memory 276,480 bits (270 Kbits) 276,480 bits (same die) 276,480 bits (same die) 423,936 bits (+53%) 423,936 bits (+53%) 516,096 bits (+87%) 589,824 bits (Block RAM)
User I/Os 91 91 91 91 91 81 (-11%) 102 (+12%)
Toolchain Quartus Prime (free Lite) Quartus Prime (free Lite) Quartus Prime (free Lite) Quartus Prime (free Lite) Quartus Prime (free Lite) Quartus Prime (free Lite) ISE / Vivado (free WebPack)

Key Differentiators

  • Automotive A7 temperature grade in low-cost Cyclone IV E family (vs EP4CE6E22C8N)
  • Logic-density upgrade path on identical PCB footprint (vs EP4CE10E22C8N)
  • Lowest-cost cross-architecture alternative (vs XC6SLX9-2TQG144)

Design Notes

Estimated: At typical 1.2 V core switching activity with 50% utilization, the EP4CE6E22A7N dissipates approximately 1.0 to 1.5 W of static and dynamic power. The exposed pad on the underside of the EQFP-144 package is the primary thermal path - it must be soldered to a PCB thermal pad connected to an inner ground plane with at least 9 thermal vias (0.3 mm diameter) for the datasheet thermal resistance of approximately 18 C/W to be met. Without the exposed-pad soldering, junction temperature can exceed 125C and trigger thermal shutdown during normal automotive operation.

Decouple the EP4CE6E22A7N with a 100 nF X7R 0402 ceramic capacitor within 3 mm of each VCCINT and VCCIO pin, plus a single 10 uF bulk tantalum or ceramic capacitor near the device. The four VCCIO banks can run at different voltages (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V, or 3.3 V) and must each have their own decoupling. Keep the JTAG chain traces (TCK, TMS, TDI, TDO) under 150 mm total length and avoid running them parallel to high-speed LVDS signals.

LVDS input is supported only on the top (banks 1 and 3) and bottom (banks 2 and 4) I/O banks; LVDS output on the left/right banks requires an external resistor network for emulated LVDS. The MSEL[2:0] pins must match the desired configuration mode (AS x1, AS x4, PS, FPP) before power-up - changing MSEL after configuration begins causes configuration failure. Active Serial mode requires the MSEL pins to be set per the datasheet AS-x1 table, not the PS table.

Route all 91 user I/O signals on inner layers with 50 ohm single-ended or 100 ohm differential impedance, using the Intel-provided IBIS models for signal-integrity simulation. The two PLLs (top-left and bottom-right of the die) each require a quiet analog supply - place a ferrite bead between the PLL_AVCC pin and the main VCCINT plane, with 1 uF and 100 nF decoupling on the PLL_AVCC side. Do not route high-speed signals under the exposed pad or over the PLL region.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS and REACH compliant per Intel product page. The A7 suffix in EP4CE6E22A7N denotes the automotive temperature grade (-40C to +125C junction); the A7 speed/temperature code is part of the Cyclone IV E ordering information. AEC-Q100 qualification documentation is available under NDA from Intel Field Application Engineering.

Data verified on: 2026-09-10 β€” data verified and curated by XAIPART's component engineering team

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EP4CE6E22A7N EP4CE6E22A7N datasheet PDF Intel Cyclone IV E FPGA 6K logic elements EP4CE6E22A7N pinout EQFP-144 Cyclone IV E automotive grade FPGA EP4CE6E22A7N buy price stock EP4CE6E22A7N vs EP4CE10E22C8N EP4CE6E22A7N drop-in replacement 144-pin EQFP Cyclone IV E FPGA what is the logic element count of EP4CE6E22A7N Cyclone IV E automotive body electronics module Quartus Prime free Cyclone IV E

Related Components & Terms

Intel Altera EP4CE6E22A7N Cyclone IV E FPGA Field-Programmable Gate Array EQFP-144 Plastic Enhanced Quad Flat Pack Logic Element M9K memory block 18x18 hardware multiplier PLL LVDS JTAG Active Serial configuration Quartus Prime AEC-Q100 RoHS REACH automotive temperature grade industrial temperature grade commercial temperature grade IEEE 1149.1 60 nm low-power process
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