EP4CGX110DF23I7N vs EP4CE115F23I7N Comparison
Detailed side-by-side comparison of EP4CGX110DF23I7N by Intel and EP4CE115F23I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4CGX110DF23I7N | EP4CE115F23I7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $182.00 | $87.95 |
| Family | Cyclone IV GX | EP4CE115 (F23 package) |
| Logic Elements | 109,424 | β |
| Logic Array Blocks (LABs) | 6,839 | 7,180 |
| User I/O Pins | 270 | β |
| Embedded Memory | 4.4 Mbits (approximate) | β |
| Embedded 18x18 Multipliers | 56 | β |
| Transceivers | Up to 3.125 Gbps embedded transceivers | β |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V (nominal 1.2 V) | β |
| Process Technology | 60 nm low-power CMOS | 60 nm low-power CMOS (TSMC) |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (Industrial) |
| Speed Grade | 7 | β |
| Package | 484-ball FBGA, 23 x 23 mm, 1.00 mm pitch | 484-FBGA (F23) 23x23 mm, 1.0 mm pitch |
| Package Code | BGA (FBGA) | β |
| Mounting Type | Surface Mount | Surface Mount |
| RoHS Status | Compliant | Compliant |
| Configuration Memory | SRAM-based (volatile, requires external config device) | β |
| Series | β | Cyclone IV E |
| Logic Elements (LE) | β | 114,480 |
| Embedded Memory Bits | β | 3,981,312 bits |
| Maximum User I/Os | β | 280 |
| Number of PLLs | β | 4 |
| 18x18 Hardware Multipliers | β | 266 |
| Core Voltage | β | 1.0 V / 1.2 V |
| I/O Voltage Banks | β | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Configuration Method | β | JTAG, Active Serial, Active Parallel |
| MSL Level | β | 3 |
| Lead-Free | β | Yes |