EP4CGX110DF31C8N vs EP4CGX110DF27I7N Comparison

Detailed side-by-side comparison of EP4CGX110DF31C8N by Intel and EP4CGX110DF27I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP4CGX110DF31C8N EP4CGX110DF27I7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $325.00 $198.00
Family Cyclone IV GX β€”
Logic Elements 109,424 β€”
Logic Array Blocks (LABs) 6,839 6,422
Embedded Memory Bits 5,621,760 (approximately 702 Kbits) β€”
Embedded Memory Blocks M9K blocks, 9-bit parity β€”
DSP Blocks (18x18 Multipliers) 264 multipliers β€”
Maximum User I/Os 475 β€”
I/O Banks 8 β€”
PLLs 4 general-purpose PLLs 4
Transceivers 8 high-speed transceivers up to 3.125 Gbps 8 channels, up to 3.125 Gbps
PCI Express Hard IP PCIe Gen1/Gen2 x1/x2/x4 β€”
Core Supply Voltage 1.2 V β€”
Process Technology 60 nm low-power CMOS β€”
Package 896-ball FineLine BGA (F31), 31 mm 672-ball FBGA, 1.0 mm pitch
Operating Temperature (Commercial) 0C to 85C β€”
Speed Grade 8 β€”
Configuration SRAM-based, supports AS, PS, JTAG, FPP β€”
RoHS Status Compliant Compliant
Series β€” Cyclone IV GX
Device Family β€” EP4CGX110
Logic Elements (LEs) β€” 109,424
Embedded Memory (bits) β€” 5,621,760
Memory Blocks (M9K) β€” 610
Embedded 18x18 Multipliers β€” 280
User I/Os β€” 393
PCIe Hard IP Blocks β€” 4 (Gen1 x1/x2/x4)
Core Voltage β€” 1.2 V
Operating Temperature β€” -40C to +100C (Industrial)
Mounting Type β€” Surface Mount
Process Node β€” 60 nm
Configuration Scheme β€” AS, PS, JTAG, FPP

Datasheets & Resources

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