EP4CGX110DF31C8N - Cyclone IV GX FPGA, 109K LEs, 896-BGA | Intel
MPN: EP4CGX110DF31C8N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $480 | $480.00 |
| 10 | $440 | $4,400.00 |
| 100 | $395 | $39,500.00 |
| 500 | $360 | $180,000.00 |
| 1,000 | $325 | $325,000.00 |
EP4CGX110DF31C8N Overview
A Field Programmable Gate Array (FPGA) is a programmable semiconductor that implements custom digital logic through a configurable matrix of logic elements, embedded memory blocks, and programmable interconnect. FPGAs sit in the broader hierarchy: programmable logic device -> FPGA -> SRAM-based FPGA -> low-power FPGA family. The Cyclone IV GX family specifically targets cost-sensitive, high-volume applications that require integrated transceivers, balancing logic density, DSP capability, and power efficiency in a single chip.
Key features of the EP4CGX110DF31C8N include 109,424 logic elements organized into 6,839 logic array blocks (LABs), 5,621,760 bits (approximately 702 Kbits/Kb) of embedded SRAM with nine-bit parity support, 264 18x18 multipliers for DSP operations, four general-purpose PLLs, and eight 3.125 Gbps transceivers supporting PCI Express Gen1/Gen2 hard IP. The 896-ball BGA package provides ample signal breakout for high-pin-count designs and supports 475 user I/Os across eight I/O banks with LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards.
The Cyclone IV GX architecture uses an SRAM-based lookup-table (LUT) fabric with dedicated routing, M9K memory blocks, and hardware DSP blocks. The transceiver block incorporates physical coding sublayer (PCS) and physical medium attachment (PMA) layers, supporting protocols such as PCIe, Gigabit Ethernet, SRIO, and Serial Digital Interface (SDI). The 1.2V core supply and 60nm process yield lower static power than the prior Cyclone III generation, simplifying thermal management in dense designs.
Typical applications include industrial video broadcast equipment using SDI transceivers, low-cost PCI Express endpoint cards for embedded computing, motor control and industrial automation with deterministic DSP pipelines, and low-cost wireless backhaul baseband processing. The integrated transceivers make the part especially attractive for designs that previously required an FPGA plus an external PHY.
When designing with this device, plan power sequencing for the 1.2V core, 2.5V/3.3V I/O, and PLL analog supplies. Use the Quartus Prime design suite for synthesis, place-and-route, and configuration bitstream generation. The 896-BGA requires careful PCB stack-up and microvia technology; signal integrity on the high-speed transceivers mandates controlled-impedance routing and AC coupling capacitors.
This page synthesizes distributor pricing, drop-in alternative candidates from the same Cyclone IV GX family, and practical board-design notes not found in the standalone manufacturer datasheet, giving procurement and design engineers a single-source comparison reference.
Drop-in alternatives for EP4CGX110DF31C8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX110DF31C8N (same form factor and footprint) — differing in Package, Transceivers, Operating Temperature, PLLs, Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CGX110DF31C7N
✅ Drop-In✓ In Stock
$112.4 / Unit
View Datasheet →EP4CGX110DF31C6N
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →EP4CGX110DF31I7N
✅ Drop-In✓ In Stock
$192.4 / Unit
View Datasheet →EP4CGX110DF27I7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$198 / Unit
View Datasheet →EP4CE75F29C8N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$149.75 / Unit
View Datasheet →EP4CGX110DF31C8N Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV GX |
| Logic Elements | 109,424 |
| Logic Array Blocks (LABs) | 6,839 |
| Embedded Memory Bits | 5,621,760 (approximately 702 Kbits) |
| Embedded Memory Blocks | M9K blocks, 9-bit parity |
| DSP Blocks (18x18 Multipliers) | 264 multipliers |
| Maximum User I/Os | 475 |
| I/O Banks | 8 |
| PLLs | 4 general-purpose PLLs |
| Transceivers | 8 high-speed transceivers up to 3.125 Gbps |
| PCI Express Hard IP | PCIe Gen1/Gen2 x1/x2/x4 |
| Core Supply Voltage | 1.2 V |
| Process Technology | 60 nm low-power CMOS |
| Package | 896-ball FineLine BGA (F31), 31 mm |
| Operating Temperature (Commercial) | 0C to 85C |
| Speed Grade | 8 |
| Configuration | SRAM-based, supports AS, PS, JTAG, FPP |
| RoHS Status | Compliant |
EP4CGX110DF31C8N 896-ball fineline bga (f31), 31 mm Pin Configuration Guide
Pin configuration for EP4CGX110DF31C8N (896-ball fineline bga (f31), 31 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CGX110DF31C8N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CGX110DF31C8N is suitable for 6 applications: Industrial Video Broadcast Equipment, PCI Express Endpoint Cards, Motor Control and Industrial Automation, Low-Cost Wireless Backhaul Baseband, Test and Measurement Instrumentation, Embedded Vision and Machine Learning Inference.
Industrial Video Broadcast Equipment
The EP4CGX110DF31C8N's eight integrated 3.125 Gbps transceivers support SDI (SMPTE 259M/292M/424M) and HD-SDI serial digital video links, eliminating external PHY chips and reducing BOM cost in broadcast video routers, format converters, and multiviewers. With 109,424 logic elements and 264 18x18 DSP multipliers, the device can perform real-time video scaling, de-interlacing, and color-space conversion alongside SDI I/O. The 896-ball BGA package delivers 475 user I/Os for parallel video interfaces such as BT.656, BT.1120, and DisplayPort, while the 5.6 Mbit embedded memory buffers full-HD video frames without external SRAM. Power consumption of the 60nm process at typical SDI link rates remains under 2.5W core, simplifying thermal design in fanless 1RU rack-mount chassis. Engineers designing SDI gear typically pair this FPGA with an external clock cleaner and rely on Quartus Prime's SDI IP core for rapid development.
Recommended
PCI Express Endpoint Cards
The Cyclone IV GX device family includes hardened PCI Express Gen1 (2.5 Gbps) and Gen2 (5.0 Gbps via channel bonding) physical layers and media-access controllers, enabling single-chip PCIe x1/x2/x4 endpoint designs without external PHY cost. With 109K logic elements, the EP4CGX110DF31C8N can implement custom protocol logic, DMA engines, and register interfaces for industrial PCIe cards such as data acquisition, machine vision frame grabbers, and low-cost crypto accelerators. The four general-purpose PLLs provide flexible reference-clock generation, while the 5.6 Mbit embedded memory accommodates PCIe transaction buffering. The 896-ball F31 BGA supports the high pin count required for x4 lane plus side-band signals, JTAG, and parallel host interfaces. Designers should follow Intel's PCIe Signal Integrity guidelines and use the Quartus Prime PCIe Compiler IP for compliant endpoint implementations.
Recommended
Motor Control and Industrial Automation
The 264 18x18 hardware multipliers and 109K logic elements of the EP4CGX110DF31C8N enable real-time field-oriented control (FOC) loops for multi-axis servo drives, with cycle times below 4us per axis at 200 MHz logic. The integrated transceivers support industrial protocols such as EtherCAT, SERCOS III, and Profinet IRT over fiber, while the 475 user I/Os drive multiple encoder inputs, PWM outputs, and resolver excitation signals from a single chip. Deterministic latency is achieved through the FPGA's hardware parallelism, bypassing the jitter of software-based motion controllers. The commercial 0C to 85C temperature range suits cabinet-mounted industrial equipment, and the 60nm process keeps core power under 1.8W in typical multi-axis loops. Designers pair the FPGA with external gate drivers and current-sense ADCs, implementing the control law in VHDL/Verilog through Quartus Prime's DSP Builder.
Recommended
Low-Cost Wireless Backhaul Baseband
Small-cell and rural-wireless backhaul radios use the EP4CGX110DF31C8N's 3.125 Gbps transceivers to interface directly with millimeter-wave or licensed-band RFIC front-ends, supporting protocols such as Ethernet-over-air, CPRI, and OBSAI. The 109K LEs and 264 DSP blocks implement forward-error-correction (FEC), scrambling, and modulation/demodulation pipelines for backhaul modems up to 1 Gbps air rate. Hardware parallelism delivers deterministic sub-microsecond latency critical for cellular timing requirements, while the 5.6 Mbit embedded SRAM accommodates packet buffering without external memory for short bursts. The 896-ball BGA enables the high pin count needed for parallel data converters and antenna-control GPIO. Design teams typically combine the FPGA with a dedicated modem SoC and rely on the device's flexibility to support multiple regional radio standards via firmware reconfiguration.
Recommended
Test and Measurement Instrumentation
The EP4CGX110DF31C8N's combination of 109K logic elements, 264 DSP multipliers, and eight high-speed transceivers suits modular test instruments such as protocol analyzers, logic-analyzer probe heads, and arbitrary waveform generators. Real-time signal processing - filtering, decimation, FFT, and trigger detection - is implemented in dedicated hardware, achieving sample rates and channel counts unattainable with DSP processors. The transceivers stream digitized data to a host at multi-gigabit rates, while the 475 user I/Os accept parallel data from high-speed ADCs and DACs. The 5.6 Mbit embedded memory captures deep snapshots before host transfer. Designers benefit from Quartus Prime's SignalTap logic analyzer for in-system debug, eliminating the need for external logic probes during firmware bring-up.
Recommended
Embedded Vision and Machine Learning Inference
With 109K logic elements and 264 18x18 multipliers, the EP4CGX110DF31C8N can host quantized neural-network inference engines for low-power embedded vision applications such as industrial inspection, drone obstacle avoidance, and smart-camera edge analytics. The integrated transceivers support MIPI CSI-2 deserialization through external bridge chips, while the 5.6 Mbit embedded memory holds activation buffers for small CNN models (MobileNet, SqueezeNet). Hardware parallelism delivers inference latencies of 5-15 ms per frame, suitable for real-time control loops. The 475 user I/Os interface to image sensors, displays, and motor-control peripherals for closed-loop embedded-vision systems. Designers typically use Intel's OpenCL SDK or HLS compiler to accelerate development and reduce time-to-market for production deployments.
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX110DF31C8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX110DF31C7N | EP4CGX110DF31C6N | EP4CGX110DF31I7N | EP4CGX110DF27I7N | EP4CE75F29C8N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 896-ball FineLine BGA (F31) | 896-ball FineLine BGA (F31) - same | 896-ball FineLine BGA (F31) - same | 896-ball FineLine BGA (F31) - same | 484-ball FineLine BGA (F27) - different | 780-ball FineLine BGA (F29) - different |
| Family | Cyclone IV GX | Cyclone IV GX | Cyclone IV GX | Cyclone IV GX | Cyclone IV GX | Cyclone IV E (no transceivers) |
| Logic Elements | 109,424 | 109,424 | 109,424 | 109,424 | 109,424 | 75,408 (-31%) |
| Embedded Memory | 5,621,760 bits | 5,621,760 bits | 5,621,760 bits | 5,621,760 bits | 5,621,760 bits | 4,653,696 bits (-17%) |
| DSP Multipliers (18x18) | 264 | 264 | 264 | 264 | 264 | 200 (-24%) |
| Transceivers | 8 ch @ 3.125 Gbps | 8 ch @ 3.125 Gbps | 8 ch @ 3.125 Gbps | 8 ch @ 3.125 Gbps | 8 ch @ 3.125 Gbps | 0 (no transceivers) |
| Speed Grade | 8 | 7 | 6 | 7 (industrial) | 7 (industrial) | 8 |
| Temperature Grade | Commercial (0C to 85C) | Commercial (0C to 85C) | Commercial (0C to 85C) | Industrial (-40C to 100C) | Industrial (-40C to 100C) | Commercial (0C to 85C) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Key Differentiators
- Highest logic density in Cyclone IV GX family (vs EP4CGX75DF27C8N)
- Eight 3.125 Gbps transceivers with PCIe hard IP (vs EP4CE75F29C8N)
- Speed grade 8 offers fastest timing closure (vs EP4CGX110DF31C7N)
Design Notes
Estimated: at typical utilization (70% LEs, 50% memory, 4 active transceivers at 2.5 Gbps), the EP4CGX110DF31C8N draws approximately 1.5-2.5W from the 1.2V VCCINT rail. Decouple each VCCINT pin with a 0.1uF X7R ceramic placed within 100 mils of the pin, plus a bulk 220uF polymer tantalum at the regulator output. VCCA_PLL requires a dedicated 2.5V LDO filtered to 10 kHz to 1 MHz; do not share this rail with general VCCIO. Power sequencing should assert VCCINT before VCCIO per Intel's Cyclone IV handbook sequence diagram.
The 896-ball F31 BGA uses 1.0mm ball pitch on a 31mm body; design requires an 8-layer stack-up with microvia HDI technology to fan out the inner-row balls. Use 50-ohm controlled-impedance striplines for high-speed transceiver channels (Tx/Rx differential pairs), routed as 100-ohm differential with 4-mil trace/space. Maintain 3W spacing between TX/RX pairs and other signals to minimize crosstalk. The exposed die paddle (if any) must be soldered to a continuous ground plane for thermal dissipation; estimate 31mm BGA thermal resistance of approximately 18 C/W with proper ground stitching.
Each 3.125 Gbps transceiver channel requires external AC-coupling capacitors (0.1uF X7R, 0402 size) on both TX and RX serial data pairs. Maintain continuous reference-plane stitching vias every 200 mils along the differential traces to suppress return-path discontinuities. For PCIe Gen2 operation (5 Gbps bonded channels), use the Cyclone IV GX hard IP and follow Intel's pinout guidelines to bind adjacent transceiver channels. Place the reference clock within 5mm of the REFCLK pin and route with 50-ohm controlled impedance.
Do not leave any VCCINT, VCCIO, or VCCA_PLL pin floating - all power pins must be connected to their respective rails per the pinout file, even if unused internally. Configuration mode pins (MSEL[3:0]) must be tied to the correct logic levels for the chosen configuration scheme (AS, PS, JTAG, or FPP); incorrect MSEL settings will cause configuration failure. After configuration, unused GPIO pins default to input tri-stated; use Quartus Prime's 'Unused Pins' setting to drive them to a defined state and prevent floating-input leakage.
Compliance Information
RoHS and REACH compliant per Intel/Altera product declaration. Not AEC-Q100 qualified - choose automotive-grade (A-suffix) parts for vehicle applications. Lead-free and halogen-free assembly per JEDEC J-STD-020 MSL3 classification.
