EP4CGX75DF27C8N vs EP4CGX75DF27C7 Comparison

Detailed side-by-side comparison of EP4CGX75DF27C8N by Intel and EP4CGX75DF27C7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP4CGX75DF27C8N EP4CGX75DF27C7
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $117.11 $86.80
Device Family Cyclone IV GX β€”
Logic Elements (LE) 73,920 β€”
Logic Array Blocks (LAB) 4,605 β€”
Embedded Memory 4,257,792 bits (approx. 532 Kbits RAM) β€”
Embedded 18x18 Multipliers 274 β€”
User I/O Pins 310 β€”
High-Speed Transceivers Up to 8 channels, 3.125 Gbps β€”
PLLs 4 β€”
Global Clock Networks 20 β€”
Core Voltage 1.2 V β€”
Process Technology 60 nm low-power CMOS β€”
Package 672-ball FBGA (F27) 672-ball FBGA
Operating Temperature (Commercial) 0C to +85C β€”
Mounting Type Surface Mount Surface Mount
Configuration Method SRAM-based, requires external config device β€”
PCIe Hard IP PCIe Gen1 x1/x2/x4 endpoint β€”
RoHS Status Compliant [DATA_NEEDED: RoHS status]
Lead-Free / Halogen-Free Yes / [DATA_NEEDED: halogen free status] β€”
Device Type β€” Field Programmable Gate Array (FPGA)
Series β€” Cyclone IV GX
Logic Cells β€” 73,920
Configurable Logic Blocks β€” 4,620
User I/O β€” 310
Configuration-related Bits β€” 4,257,792
Supply Voltage β€” 1.2 V
Package Body β€” 27 mm x 27 mm
Ball Pitch β€” 1 mm
Terminal Form β€” Ball
Package Code β€” BGA
Operating Temperature β€” [DATA_NEEDED: operating temperature range]
REACH Status β€” [DATA_NEEDED: REACH status]

Datasheets & Resources

Browse All Products Create BOM Request Quote