EP4CGX75DF27C7 - 73,920-LCell Cyclone IV GX FPGA | Intel
MPN: EP4CGX75DF27C7 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $128.75 | $128.75 |
| 10 | $118.4 | $1,184.00 |
| 100 | $105.9 | $10,590.00 |
| 500 | $94.25 | $47,125.00 |
| 1,000 | $86.8 | $86,800.00 |
EP4CGX75DF27C7 Overview
A field-programmable gate array (FPGA) is a semiconductor device whose logic function is defined through programmable configuration rather than fixed masking. In the hierarchy, an FPGA belongs to programmable logic, then digital integrated circuits and integrated circuits. Unlike a fixed-function application-specific integrated circuit (ASIC), an FPGA can be reprogrammed during development and, where supported by the system, updated in the field. It typically contains configurable logic blocks, programmable interconnects, memory elements, I/O blocks, and configuration circuitry. Engineers use FPGAs to accelerate parallel processing, implement custom interfaces, consolidate glue logic, and create adaptable control or communications subsystems. The Cyclone IV GX family places these programmable resources in a device aimed at embedded and connectivity-oriented applications. Exact supported protocols, transceiver counts, memory capacity, speed grades, and configuration requirements must be confirmed from the manufacturer documentation before implementation.
The principal verified attributes of EP4CGX75DF27C7 are its FPGA device type, 73,920 logic cells, 4,620 configurable logic blocks, 310 user I/O, 4,257,792 configuration-related bits, and 1.2 V supply voltage. The package is a 672-ball FBGA device with a 27 mm by 27 mm body and 1 mm pitch. These attributes define a high-capacity programmable platform with many external connections, but the published web excerpts do not establish every electrical limit. Values such as operating temperature, transceiver count, embedded memory size, I/O standards, maximum clock frequency, power consumption, and configuration memory technology therefore require manufacturer-document confirmation. The target ordering code should be distinguished from other package, speed, temperature, and non-RoHS ordering codes because those changes can affect assembly, qualification, and lifecycle decisions.
The architecture supports a range of digital implementation patterns because the logic is configured through programmable resources rather than a fixed datapath. For a communications or industrial interface, the FPGA can be placed between a processor and multiple external peripherals, with custom logic performing protocol conversion, timing, buffering, and control. The 310 I/O resources provide a large connection envelope for such aggregation, while the 73,920 logic cells provide capacity for state machines, datapaths, and protocol engines. The 1.2 V supply voltage must be integrated with suitable power sequencing, decoupling, and signal-integrity practices. Pinout, transceiver specifications, configuration interface details, and package-ball assignments are not included in the supplied excerpts; they must be obtained from the complete manufacturer datasheet before PCB design or firmware release.
Typical applications include communications equipment, industrial automation, test and measurement systems, video and image-processing equipment, embedded controllers, and custom interface aggregation. In industrial automation, the FPGA can implement deterministic control, sensor-data formatting, and protocol bridging while providing 310 I/O for parallel connections. In communications systems, it can provide link monitoring, packet or frame processing, and interface adaptation. In test equipment, it can generate timing patterns, capture parallel data, and perform real-time preprocessing. These uses are appropriate where parallelism, custom timing, and field programmability are valuable. The selected FPGA should be evaluated against the required logic utilization, I/O count, power budget, supported interfaces, and assembly capability.
A key design consideration is package and power integration. The 672-ball FBGA package requires a compatible land pattern, controlled-impedance routing where appropriate, and a documented ball-assignment review. The 1.2 V supply should be decoupled locally with the capacitor types and values specified by the manufacturer. Do not infer unsupported I/O standards, transceiver counts, or operating limits from the family name alone. Validate configuration, clocking, reset, bank-voltage, and board-level power requirements in the manufacturer datasheet, and confirm the exact ordering-code temperature and environmental options before production release.
This product record combines the verified distributor and manufacturer-page attributes, package information, pricing-tier structure, and application context into one engineering reference. It also distinguishes confirmed values from parameters that still require datasheet review. For a reliable design decision, consult the full EP4CGX75DF27C7 manufacturer documentation, use the official package pinout and power guidance, and verify current availability and price directly with an authorized distributor.
Drop-in alternatives for EP4CGX75DF27C7 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX75DF27C7 (same form factor and footprint) β differing in Package, Process Technology, Mounting Type, RoHS Status, Operating Temperature.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4CGX75DF27C6N
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$88.9 / Unit
View Datasheet βEP4CGX75DF27C6
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View Datasheet βEP4CGX75CF23I7N
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View Datasheet βEP4CGX75CF23I7
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View Datasheet βEP4CGX75CF23C7N
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View Datasheet βEP4CGX75DF27C7 Maximum Ratings & Electrical Characteristics
| Device Type | Field Programmable Gate Array (FPGA) |
| Series | Cyclone IV GX |
| Logic Cells | 73,920 |
| Configurable Logic Blocks | 4,620 |
| User I/O | 310 |
| Configuration-related Bits | 4,257,792 |
| Supply Voltage | 1.2 V |
| Package | 672-ball FBGA |
| Package Body | 27 mm x 27 mm |
| Ball Pitch | 1 mm |
| Mounting Type | Surface Mount |
| Terminal Form | Ball |
| Package Code | BGA |
EP4CGX75DF27C7 bga Pin Configuration Guide
Pin configuration for EP4CGX75DF27C7 (bga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CGX75DF27C7.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CGX75DF27C7 is suitable for 6 applications: Industrial Automation Controller, Communications Interface Bridge, Test and Measurement Data Capture, Video and Image Processing Platform, Embedded Control and Logic Consolidation, High-Speed Data Aggregation.
Industrial Automation Controller
EP4CGX75DF27C7 is a strong candidate for an industrial automation controller that must combine multiple deterministic functions on one programmable platform. Its verified 73,920 logic cells and 4,620 configurable logic blocks provide capacity for state machines, sequencing logic, sensor-data processing, and custom control algorithms. The 310 user I/O can aggregate encoders, limit switches, isolated inputs, actuator controls, and communication interfaces without immediately requiring a large external glue-logic count. The device is implemented in a 672-ball FBGA package, so the design must provide a compatible land pattern, controlled escape routing, and careful power distribution. The supplied data does not confirm the operating temperature, I/O voltage, or industrial qualification, so those requirements must be checked in the official datasheet before release.
Recommended
Communications Interface Bridge
EP4CGX75DF27C7 can be evaluated for a communications interface bridge where parallel data must be adapted, buffered, monitored, or converted between system domains. The verified 73,920 logic cells support custom protocol engines, framing logic, error handling, and traffic management, while 310 user I/O provide a broad connection point for parallel buses and auxiliary controls. The 1.2 V supply and 672-ball FBGA package require a structured power-integrity and signal-integrity design. Because the supplied web data does not confirm transceiver count, supported protocols, I/O standards, or line rates, the design team must not assume a communications capability from the Cyclone IV GX family name. Confirm the device-specific interface table, timing budget, reference-clock requirements, and pin assignments in the manufacturer documentation before schematic completion.
Recommended
Test and Measurement Data Capture
EP4CGX75DF27C7 is suitable in concept for test and measurement systems that generate or capture multiple parallel channels and apply real-time preprocessing. Its 4,620 configurable logic blocks can implement counters, timing generators, trigger logic, serializers, data qualification, and channel control. The verified 310 user I/O can support parallel instrumentation buses and auxiliary digital signals, while the 73,920 logic cells provide margin for more than simple bridge logic. The packageβs 672-ball FBGA construction supports a compact, high-density assembly but demands careful ball escape, impedance control, and thermal analysis. The supplied evidence does not provide maximum clock frequency, I/O performance, power consumption, or timing specifications, so designers must validate acquisition bandwidth and data throughput using the official device documentation and a prototype measurement plan.
Recommended
Video and Image Processing Platform
EP4CGX75DF27C7 can serve as a programmable processing element in video or image-processing equipment when parallel pixel processing, frame timing, and interface adaptation are required. The verified 73,920 logic cells and 4,620 configurable logic blocks can support pixel pipelines, timing generation, color-space conversion, frame buffering control, and region-of-interest logic. The 310 user I/O provide substantial connectivity for image sensors, displays, memory interfaces, and control channels. The 1.2 V supply must be designed with low-noise power distribution, and the 672-ball FBGA package requires high-density PCB implementation. The supplied web excerpts do not establish embedded memory size, DSP resources, supported video interfaces, or clock limits, so actual throughput and image-rate capability must be confirmed through the manufacturer datasheet, device architecture table, and representative benchmark design.
Recommended
Embedded Control and Logic Consolidation
EP4CGX75DF27C7 is a candidate for embedded systems that need to consolidate several custom timing, control, and interface functions in one programmable device. The verified 73,920 logic cells allow implementation of multiple independent logic blocks, while 4,620 configurable logic blocks provide the basic architecture for counters, registers, state machines, and datapath elements. Its 310 user I/O can connect a processor, memory, peripheral controllers, and application-specific signals. The 1.2 V supply and 672-ball FBGA package may help create a compact controller, but they also introduce strict power-integrity, routing, and assembly requirements. The supplied data does not confirm configuration method, I/O standards, embedded memory, or speed grade, so the design must use the complete manufacturer documentation and validate tool-generated timing before selecting the part.
Recommended
High-Speed Data Aggregation
EP4CGX75DF27C7 can be considered for high-speed data-aggregation equipment that combines several streams, applies real-time filtering, and presents processed data to a host processor. The verified 310 user I/O create a large external interface envelope, and 73,920 logic cells provide capacity for FIFOs, packet handling, channel arbitration, and protocol-specific processing. The 1.2 V supply and 672-ball FBGA package are appropriate for a high-density board when the power and signal-integrity budgets are controlled. However, the supplied data does not state transceiver resources, maximum clock frequency, supported I/O standards, or memory configuration, so it cannot be used to claim a particular aggregate bandwidth. Confirm the device-specific I/O and timing tables, perform channel-budget analysis, and verify signal integrity on the actual PCB before committing the architecture.
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX75DF27C7 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX75DF27C6N | EP4CGX75DF27C6 | EP4CGX75CF23I7N | EP4CGX75CF23I7 | EP4CGX75CF23C7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-ball FBGA | 672-ball FBGA | 672-ball FBGA | 672-ball FBGA | 672-ball FBGA | 672-ball FBGA |
| Device Type | FPGA | FPGA | FPGA | FPGA | FPGA | FPGA |
Key Differentiators
- Verified logic-capacity position (vs EP4CGX150DF27C7N)
- Verified user-I/O count (vs EP4CGX75CF23I7N)
- Verified supply-voltage specification (vs EP4CGX75DF27C6)
- Verified 672-ball FBGA geometry (vs EP4CGX75CF23C7N)
Design Notes
EP4CGX75DF27C7 has a verified 1.2 V supply-voltage specification, but the supplied data does not provide a complete rail table, current budget, sequencing requirement, or recommended decoupling network. Use the official Cyclone IV GX documentation to identify core and I/O-bank supplies, tolerances, transient limits, and power-up behavior. Place local ceramic decoupling close to the associated power balls and connect bulk capacitance to the regulator plane with low-impedance paths. The 672-ball FBGA package increases the importance of power-plane continuity and return-path planning. Validate regulator stability, startup current, and thermal behavior in the prototype rather than deriving them from family-name assumptions. Every capacitor value and sequence step should come from the current manufacturer design guidance or a verified reference design.
The verified package is 672-ball FBGA with a 27 mm by 27 mm body and 1 mm ball pitch. Implement the land pattern from the official package drawing, not from a visual approximation or a related device. Review escape routing for power, configuration, clocks, and high-speed signals before placing supporting components. Keep power and ground return paths continuous, use the manufacturer-recommended via and fanout strategy, and check the complete ball-assignment table against the selected ordering code. The supplied web data does not provide individual ball functions, so schematic review and signal-integrity simulation must wait for the official package pinout. Confirm package dimensions, solder-mask-defined or nonsolder-mask-defined geometry, and assembly rules with the current Intel/Altera documentation before Gerber release.
Do not assume that a related Cyclone IV GX ordering code is a verified drop-in replacement for EP4CGX75DF27C7. The site MPN list contains many related Intel devices, but the supplied cross-reference data does not establish identical logic capacity, I/O count, speed grade, temperature grade, power, configuration interface, or 672-ball pinouts. Before substituting, obtain a manufacturer cross-reference or compare the complete ordering tables and package drawings. Also verify whether the exact code has the required 1.2 V supply, configuration support, I/O standards, and environmental compliance. Treat all unmarked parameters as [DATA_NEEDED] until confirmed. This conservative approach prevents an apparently similar FPGA from causing a PCB, firmware, timing, or qualification failure.
Plan the FPGA implementation around verified resource margins rather than using the family name as a proxy for performance. EP4CGX75DF27C7 provides 73,920 logic cells, 4,620 configurable logic blocks, and 310 user I/O, so the board should allocate clocks, configuration signals, power balls, and high-speed routes according to the official ball map. The supplied data does not provide clock, memory, transceiver, or I/O timing specifications, so tool-generated timing results must be used after the design is sufficiently defined. Check impedance, crosstalk, simultaneous-switching-noise limits, and connector/voltage requirements during schematic and layout reviews. Use the FPGA vendor design rules and reference designs as the authority for escape, decoupling, and clock distribution, then confirm all recommendations against the exact device ordering code.
Compliance Information
The supplied verified web data does not state RoHS, REACH, lead-free, halogen-free, or conflict-minerals declarations. Operating temperature and AEC-Q100 qualification are also not established. Compliance and temperature status must be confirmed from the exact manufacturer ordering-code documentation.
