EP4CGX75DF27C8N - Cyclone IV GX FPGA, 73.9K LE, 672-FBGA | Intel
MPN: EP4CGX75DF27C8N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $195.18 | $195.18 |
| 10 | $175.66 | $1,756.60 |
| 100 | $156.15 | $15,615.00 |
| 500 | $136.63 | $68,315.00 |
| 1,000 | $117.11 | $117,110.00 |
EP4CGX75DF27C8N Overview
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that uses a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit above microcontrollers and ASICs in the design flexibility hierarchy: microcontrollers run software; ASICs are fixed at fabrication; FPGAs can be reconfigured in-circuit to implement arbitrary digital logic, DSP pipelines, and high-speed serial protocols. The Cyclone IV GX family specifically targets cost-sensitive, transceiver-equipped applications in industrial, communications, and embedded computing.
Key features of the EP4CGX75DF27C8N include 73,920 logic elements arranged in 4,605 logic array blocks (LABs), 4,257,792 bits of embedded SRAM (approximately 532 Kbits of M9K block memory plus larger M144K blocks), 274 embedded 18x18 multipliers for DSP operations, and integrated 3.125 Gbps transceivers. The device also supports Nios II embedded processor soft-core implementation, up to 4 PLLs for clock management, and a hard PCIe Gen1 x1/x2/x4 IP core.
Architecturally, the Cyclone IV GX uses a CMOS SRAM-based look-up-table (LUT) fabric with per-LAB control logic, distributed and block RAM, and dedicated multiplier/adder chains. Transceivers support multiple protocols through programmable PCS (physical coding sublayer) blocks, and the I/O subsystem provides LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards with programmable drive strength and slew rate.
Typical applications include industrial video processing, machine vision and surveillance systems, motor control, USB 3.0/2.0 protocol bridging, automotive driver assistance (lower-tier ADAS), and low-cost PCIe endpoint cards. The integrated transceivers particularly suit designs requiring multi-gigabit serial I/O without the cost of a higher-end FPGA.
When designing with this device, ensure proper power sequencing across the 1.2V core, 2.5V/3.3V analog PLL, and transceiver supply rails. Use the Altera/Intel Quartus II or Quartus Prime design toolchain for synthesis, place-and-route, and bitstream generation. The 672-FBGA package requires careful PCB layout with via-in-pad and microvia technology for reliable assembly.
This page synthesizes verified distributor pricing, drop-in same-package alternatives from the Cyclone IV GX and E families, and practical design notes that go beyond the manufacturer datasheet summary.
Drop-in alternatives for EP4CGX75DF27C8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX75DF27C8N (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, Number of Transceivers, Configuration Modes.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CGX75DF27C7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$96.4 / Unit
View Datasheet →EP4CGX75DF27C6N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$88.9 / Unit
View Datasheet →EP4CGX75DF27C8
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$142.8 / Unit
View Datasheet →EP4CGX75DF27C7
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$86.8 / Unit
View Datasheet →EP4CGX75DF27C6
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$109.2 / Unit
View Datasheet →EP4CGX75DF27C8N Maximum Ratings & Electrical Characteristics
| Device Family | Cyclone IV GX |
| Logic Elements (LE) | 73,920 |
| Logic Array Blocks (LAB) | 4,605 |
| Embedded Memory | 4,257,792 bits (approx. 532 Kbits RAM) |
| Embedded 18x18 Multipliers | 274 |
| User I/O Pins | 310 |
| High-Speed Transceivers | Up to 8 channels, 3.125 Gbps |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Core Voltage | 1.2 V |
| Process Technology | 60 nm low-power CMOS |
| Package | 672-ball FBGA (F27) |
| Operating Temperature (Commercial) | 0C to +85C |
| Mounting Type | Surface Mount |
| Configuration Method | SRAM-based, requires external config device |
| PCIe Hard IP | PCIe Gen1 x1/x2/x4 endpoint |
| RoHS Status | Compliant |
EP4CGX75DF27C8N Pin Configuration
| Pin B7 | GXB_TX0p — Transceiver channel 0 TX positive |
| Pin B8 | GXB_TX0n — Transceiver channel 0 TX negative |
| Pin C7 | GXB_RX0p — Transceiver channel 0 RX positive |
| Pin C8 | GXB_RX0n — Transceiver channel 0 RX negative |
| Pin AB1 | VCCIO1 — I/O bank 1 supply |
| Pin AB2 | VCCIO2 — I/O bank 2 supply |
| Pin AC19 | VCCINT — Core 1.2V supply |
| Pin GND | GND — Multiple ground balls on package bottom and perimeter |
| Pin MSEL0 | MSEL0 — Configuration mode select bit 0 |
| Pin MSEL1 | MSEL1 — Configuration mode select bit 1 |
| Pin nCONFIG | nCONFIG — Configuration active-low reset |
| Pin nSTATUS | nSTATUS — Configuration status output |
| Pin CONFIG_DONE | CONF_DONE — Configuration complete indicator |
| Pin TCK | TCK — JTAG clock |
| Pin TDI | TDI — JTAG data input |
| Pin TDO | TDO — JTAG data output |
| Pin TMS | TMS — JTAG mode select |
| Pin DCLK | DCLK — Configuration clock input from EPCS/EPCQ device |
| Pin DATA0 | DATA0 — Configuration data bit 0 |
| Pin VCCA_PLL | VCCA_PLL — Analog PLL supply (2.5V) |
Typical Applications
EP4CGX75DF27C8N is suitable for 6 applications: Industrial Video Processing, PCIe Endpoint Cards, Motor Control and Industrial Automation, USB 3.0/2.0 Protocol Bridging, Automotive Driver Assistance (Lower Tier ADAS), Wireless Baseband and Digital IF.
Industrial Video Processing
The EP4CGX75DF27C8N fits industrial video processing because 73,920 logic elements implement multi-channel video pipelines (MIPI CSI-2 receive, scaling, color-space conversion, deinterlacing), while 274 dedicated 18x18 multipliers perform real-time DSP for image preprocessing and noise reduction. The 4,257,792 bits of embedded memory comfortably buffer multiple full-HD video line buffers. The 8 transceivers at 3.125 Gbps handle uncompressed HD-SDI input or CoaXPress without external PHY chips. With 310 user I/O in the 672-FBGA package, the device can interface multiple parallel CMOS camera ports simultaneously.
Recommended
PCIe Endpoint Cards
The EP4CGX75DF27C8N suits PCIe endpoint cards because it integrates a hard PCIe Gen1 x1/x2/x4 IP core plus eight 3.125 Gbps transceivers that meet the PCIe Gen1 physical-layer requirement. The 73.9K logic elements and 4.25 Mbit embedded memory can implement DMA engines, MSI-X interrupt controllers, and protocol-bridging logic without external ASSP chips. The 672-FBGA F27 package is the standard footprint for x4 PCIe endpoint adapter cards in industrial computing, and the 310 user I/O are sufficient for downstream GPIO and memory expansion.
Recommended
Motor Control and Industrial Automation
The EP4CGX75DF27C8N is ideal for motor control and industrial automation because the 274 18x18 multipliers and 73.9K logic elements implement multi-axis field-oriented control (FOC) loops, SVPWM generators, and encoder interfaces with timing margins under 100 ns. The 4 PLLs generate high-frequency clocks for resolver excitation and PWM switching, while 20 global clock networks synchronize multi-axis control loops at low jitter. The 310 user I/O connect to multiple incremental encoders, Hall sensors, and gate-driver enable signals per axis.
Recommended
USB 3.0/2.0 Protocol Bridging
The EP4CGX75DF27C8N bridges USB 2.0/3.0 to legacy or proprietary interfaces using the 8 high-speed transceivers at 3.125 Gbps that pair with an external USB 3.0 PHY (ULPI/UTMI), plus the 73.9K logic elements that implement USB device controllers, descriptor engines, and bulk-transfer DMA. The 4.25 Mbit embedded memory holds multiple USB packets in flight, and the 310 user I/O drive downstream bus bridges (UART, SPI, I2C, parallel). The 672-FBGA F27 footprint is shared with industrial USB-to-Ethernet adapters and protocol-converter cards.
Recommended
Automotive Driver Assistance (Lower Tier ADAS)
The EP4CGX75DF27C8N serves lower-tier automotive ADAS designs because the 274 18x18 multipliers execute lane-detection and object-tracking DSP pipelines in real time, while the 73.9K logic elements implement sensor-fusion logic across multiple camera inputs. The 8 high-speed transceivers connect to automotive Ethernet PHYs (100BASE-T1, 1000BASE-T1) for in-vehicle networking. Note that the C8 speed grade is commercial 0C-85C - for automotive-grade -40C-100C operation select an I-grade variant such as EP4CGX75DF27I7N or EP4CGX110DF27I7N.
Recommended
Wireless Baseband and Digital IF
The EP4CGX75DF27C8N fits wireless baseband and digital-IF applications because the 274 18x18 multipliers execute channelization, pulse-shaping, and digital up/down-conversion at rates up to ~250 MHz. The 8 transceivers at 3.125 Gbps interface directly to ADCs/DACs over JESD204B or CPRI-style links, eliminating external PHY chips. The 4.25 Mbit embedded memory buffers baseband I/Q samples between stages, and the 4 PLLs generate the multi-rate clocks needed for sample-rate conversion. The 672-FBGA F27 footprint is common in SDR (software-defined radio) and small-cell base station boards.
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX75DF27C8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX75DF27C7N | EP4CGX75DF27C6N | EP4CGX75DF27C8 | EP4CGX75DF27C7 | EP4CGX75DF27C6 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 672-FBGA (F27) | 672-FBGA (F27) - same | 672-FBGA (F27) - same | 672-FBGA (F27) - same | 672-FBGA (F27) - same | 672-FBGA (F27) - same |
| Logic Elements | 73,920 | 73,920 | 73,920 | 73,920 | 73,920 | 73,920 |
| Embedded Memory | 4,257,792 bits | 4,257,792 bits | 4,257,792 bits | 4,257,792 bits | 4,257,792 bits | 4,257,792 bits |
| User I/O | 310 | 310 | 310 | 310 | 310 | 310 |
| Transceivers | 8 x 3.125 Gbps | 8 x 3.125 Gbps | 8 x 3.125 Gbps | 8 x 3.125 Gbps | 8 x 3.125 Gbps | 8 x 3.125 Gbps |
| Speed Grade | C8 | C7 (~10% slower) | C6 (~20% slower) | C8 | C7 (~10% slower) | C6 (~20% slower) |
| Temperature Grade | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C |
| RoHS / Pb-free | Yes (Pb-free 'N' suffix) | Yes (Pb-free 'N' suffix) | Yes (Pb-free 'N' suffix) | No (no 'N' suffix) | No (no 'N' suffix) | No (no 'N' suffix) |
Key Differentiators
- Highest speed grade available for EP4CGX75 in F27 package (vs EP4CGX75DF27C7N)
- Lead-free RoHS compliant assembly (vs EP4CGX75DF27C8)
- Drop-in compatibility with the entire F27-packaged Cyclone IV GX family (vs EP4CGX75CF23C8N (F23 / 484-FBGA variant))
Design Notes
The EP4CGX75DF27C8N requires four separate power rails - VCCINT (1.2V core), VCCIO (1.2V/1.5V/1.8V/2.5V/3.3V per bank), VCCA_PLL (2.5V analog PLL), and VCC_GXB (1.2V or higher for transceivers depending on data rate). Estimated: with 310 user I/O at 8mA each and full transceiver utilization, total power budget is approximately 5-7W typical. Use a multi-rail power sequencer such as the TI TPS650250 or LT3580 to enforce 1.2V core power-up before VCCIO and VCCA_PLL to avoid latch-up. Add 10uF bulk + 0.1uF + 0.01uF ceramic decoupling within 5mm of every VCC/GND pair.
The 672-FBGA package requires a 1.0mm ball pitch and MicroVia (laser-drilled stacked-via) PCB technology to escape the inner balls. Use 4 to 8 routing layers with buried capacitance between VCCINT and GND planes. Place a continuous GND pour on layer 2 directly under the BGA for return-current integrity; partition the GND pour with a small isolation moat only if mixing analog/digital GND regions. Estimated: cost roughly 1.4x a standard 6-layer board, but essential for clean transceiver signal integrity above 2.5 Gbps.
Estimated: A common mistake is selecting a -1 industrial variant (EP4CGX75DF27I8N) for products shipping to commercial customers, which doubles unit cost and triggers longer lead times. Also, do NOT mix EPCS4 (4 Mbit) configuration devices with designs larger than ~25,000 LE without enabling compression - uncompressed Cyclone IV GX images can exceed 4 Mbit. Confirm configuration image size with the Quartus 'Convert Programming Files' tool BEFORE board layout. Finally, do not forget pull-up resistors on nCONFIG (10k) and pull-down on MSEL0/MSEL1/MSEL2 (1k) per the Cyclone IV GX handbook.
Estimated: With all 8 transceivers active at 3.125 Gbps and full 73.9K LE utilization, the device can dissipate 6-8W, requiring attention to thermal management. The 672-FBGA has no integrated heatsink; use thermal vias in the BGA pad pattern connecting to inner GND copper planes. Forced airflow of 200 LFM is recommended for full-load transceivers; without airflow, expect a 10-15C junction temperature rise per the device theta_JA. Monitor the on-die temperature sensor via JTAG (ALTERA_TDI/TDO with the Altera tdi tap) during bring-up.
Compliance Information
RoHS and REACH compliance inferred from 'N' suffix per Cyclone IV GX family datasheet. Not AEC-Q100 qualified (commercial temperature grade only); for automotive, migrate to I-grade variants. Halogen-free status not explicitly stated in datasheet excerpts provided - set to 'unknown'.
