EP4CGX75DF27I6N vs EP4CGX75DF27C8N Comparison

Detailed side-by-side comparison of EP4CGX75DF27I6N by Intel and EP4CGX75DF27C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP4CGX75DF27I6N EP4CGX75DF27C8N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $65.00 $117.11
Family Cyclone IV GX β€”
Device Model EP4CGX75 β€”
Logic Elements (LE) 73,920 73,920
Logic Array Blocks (LABs) [DATA_NEEDED: LAB count] β€”
Embedded Memory Bits 4,257,792 β€”
Embedded Memory Blocks M9K (9 Kbit) β€”
Maximum User I/O 310 β€”
Transceivers Up to 8 channels β€”
Transceiver Data Rate Up to 3.125 Gbps β€”
PLLs [DATA_NEEDED: total PLL count] 4
Hard PCIe Blocks x1 / x2 Gen1 β€”
Process Node 60 nm β€”
Core Voltage (VCCINT) 1.2 V β€”
Package FBGA-672 (FineLine BGA) 672-ball FBGA (F27)
Pin / Ball Count 672 β€”
Operating Temperature (I6N suffix) -40C to +100C (industrial) β€”
Configuration Modes JTAG, Serial, Parallel β€”
RoHS Status Compliant Compliant
Lead-Free Yes β€”
Device Family β€” Cyclone IV GX
Logic Array Blocks (LAB) β€” 4,605
Embedded Memory β€” 4,257,792 bits (approx. 532 Kbits RAM)
Embedded 18x18 Multipliers β€” 274
User I/O Pins β€” 310
High-Speed Transceivers β€” Up to 8 channels, 3.125 Gbps
Global Clock Networks β€” 20
Core Voltage β€” 1.2 V
Process Technology β€” 60 nm low-power CMOS
Operating Temperature (Commercial) β€” 0C to +85C
Mounting Type β€” Surface Mount
Configuration Method β€” SRAM-based, requires external config device
PCIe Hard IP β€” PCIe Gen1 x1/x2/x4 endpoint
Lead-Free / Halogen-Free β€” Yes / [DATA_NEEDED: halogen free status]

Datasheets & Resources

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