EP4CGX75DF27I6N - 73,920 Logic Cells Cyclone IV GX FPGA | Intel
MPN: EP4CGX75DF27I6N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $89.5 | $89.50 |
| 10 | $82 | $820.00 |
| 100 | $75.5 | $7,550.00 |
| 500 | $70 | $35,000.00 |
| 1,000 | $65 | $65,000.00 |
EP4CGX75DF27I6N Overview
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit whose digital logic is defined after manufacturing via a configuration bitstream. FPGAs occupy the top of the programmable logic device hierarchy, alongside CPLDs (smaller, non-volatile) and ASSPs (fixed-function ASICs). The Cyclone IV GX family is positioned at the low-power, transceiver-equipped end of the FPGA market, bridging the gap between pure-logic FPGAs and high-end transceiver FPGAs.
Key features of the EP4CGX75DF27I6N include 73,920 logic elements, approximately 4,257,792 bits of embedded RAM distributed across M9K blocks, up to eight integrated transceivers supporting data rates up to 3.125 Gbps, two PLLs per transceiver block plus four general-purpose PLLs, and 310 user I/O pins. The device supports commercial, industrial, and automotive temperature grades, with the I6N suffix denoting the -40C to +100C industrial operating range. Hard PCIe hard IP blocks (x1/x2 Gen1) are also integrated, enabling low-cost PCIe endpoint implementations.
The device uses a 60 nm process node with a 1.2 V core supply and dedicated transceiver and I/O banks. The FineLine BGA package provides high pin density for its class while keeping PCB routing manageable on standard 4-layer FR-4 stack-ups. Configuration is supported via JTAG, serial, and parallel modes, with bitstream encryption available for IP protection.
Typical applications include industrial video broadcast and image processing, motor control and machine automation, low-cost PCIe endpoint cards, USB 3.0 expansion and bridging, industrial protocol bridging (EtherCAT, PROFINET, Sercos), and remote radio heads / wireless baseband preprocessing. The integrated transceivers also suit point-to-point serial links in test & measurement equipment.
When designing with this device, ensure your power sequencing keeps VCCINT (1.2 V core) within +/-50 mV of nominal during power-up, and place VCCIO decoupling within 200 mils of each bank. The 672-pin BGA package requires precise reflow profile and via-in-pad capability for reliable assembly; we recommend ENIG surface finish and 0.4 mm pitch BGA assembly experience.
Drop-in alternatives for EP4CGX75DF27I6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX75DF27I6N (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Number of Transceivers, RoHS Status.
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View Datasheet →EP4CGX75DF27I6N Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV GX |
| Device Model | EP4CGX75 |
| Logic Elements (LE) | 73,920 |
| Embedded Memory Bits | 4,257,792 |
| Embedded Memory Blocks | M9K (9 Kbit) |
| Maximum User I/O | 310 |
| Transceivers | Up to 8 channels |
| Transceiver Data Rate | Up to 3.125 Gbps |
| Hard PCIe Blocks | x1 / x2 Gen1 |
| Process Node | 60 nm |
| Core Voltage (VCCINT) | 1.2 V |
| Package | FBGA-672 (FineLine BGA) |
| Pin / Ball Count | 672 |
| Operating Temperature (I6N suffix) | -40C to +100C (industrial) |
| Configuration Modes | JTAG, Serial, Parallel |
| RoHS Status | Compliant |
| Lead-Free | Yes |
EP4CGX75DF27I6N fbga-672 (fineline bga) Pin Configuration Guide
Pin configuration for EP4CGX75DF27I6N (fbga-672 (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CGX75DF27I6N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CGX75DF27I6N is suitable for 6 applications: Industrial Video Broadcast & Machine Vision, Low-Cost PCIe Endpoint Cards, Industrial Protocol Bridging (EtherCAT / PROFINET), Motor Control and Drive Systems, Wireless Baseband Preprocessing / Remote Radio Head, Test & Measurement Equipment.
Industrial Video Broadcast & Machine Vision
The EP4CGX75DF27I6N is well suited to industrial video broadcast and machine vision systems thanks to its 73,920 logic elements, which can absorb pixel pipelines, color space converters, and image preprocessing blocks. Its 4,257,792 bits of embedded M9K memory serve as line buffers and frame buffers without external SRAM, while 310 user I/O pins expose parallel camera interfaces such as LVDS, sub-LVDS, and SLVS-EC. The -40C to +100C industrial temperature rating ensures reliable operation in factory floor enclosures. The integrated 3.125 Gbps transceivers also enable CoaXPress or SDI links for camera aggregation.
Recommended
Low-Cost PCIe Endpoint Cards
The EP4CGX75DF27I6N includes dedicated PCIe hard IP blocks supporting x1 and x2 Gen1 endpoints, eliminating fabric-based PCIe soft cores that consume LE and add latency. Designers can implement a PCIe endpoint plus DMA engine plus application logic in a single chip. The FBGA-672 package provides 310 user I/O for downstream interfaces, while the 1.2 V core keeps power low enough for half-height, half-length card thermal envelopes. Reference designs from Intel's Cyclone IV GX handbook illustrate typical endpoint implementations.
Recommended
Industrial Protocol Bridging (EtherCAT / PROFINET)
The 73,920 LEs of the EP4CGX75DF27I6N are sufficient to host real-time industrial Ethernet stacks such as EtherCAT slave, PROFINET IRT, and Sercos III in parallel with the user application. The integrated M9K memory blocks provide deterministic buffers for process data, while 310 user I/O support analog and digital side channels to motor drives, sensors, and actuators. The 3.125 Gbps transceivers enable backplane gigabit Ethernet for chassis-to-chassis communication. Industrial temperature grade ensures operation in cabinet environments.
Recommended
Motor Control and Drive Systems
Motor control algorithms (FOC, direct torque control, sensorless estimators) benefit from the parallel fabric of the EP4CGX75DF27I6N, with 73,920 LEs absorbing PWM generators, ADRC observers, and SVP modulators. The high count of user I/O supports multi-axis feedback encoder inputs (EnDat, BISS, SSI) and PWM outputs to IGBT/MOSFET driver stages. Hard PCIe IP allows integration with a host controller for parameter updates and diagnostics. The -40C to +100C industrial temperature rating suits motor cabinet installations.
Recommended
Wireless Baseband Preprocessing / Remote Radio Head
The EP4CGX75DF27I6N's 8 integrated transceivers at up to 3.125 Gbps make it suitable for CPRI or OBSAI fronthaul links in small-cell and remote radio head (RRH) applications. The fabric handles digital up/down conversion, crest factor reduction, and digital predistortion. Embedded M9K blocks implement FFTs and channel filters, while 310 user I/O support analog RF front-panel interface logic. The industrial temperature rating allows deployment in outdoor or rooftop radio units.
Recommended
Test & Measurement Equipment
Test and measurement platforms benefit from the EP4CGX75DF27I6N's combination of high logic density, fast transceivers, and abundant user I/O for instrumentation front-ends. The fabric can implement custom DSP, trigger logic, and pattern generation, while M9K memory blocks store sample buffers. The PCIe hard IP enables high-throughput data streaming to host processors. Industrial temperature grade allows portable and laboratory equipment designs in varied environmental conditions.
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX75DF27I6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX75DF27I7N | EP4CGX75DF27C8N | EP4CGX75DF27C7N | EP4CGX75DF27C6N | EP4CGX110DF27I7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-672 | FBGA-672 - same | FBGA-672 - same | FBGA-672 - same | FBGA-672 - same | FBGA-672 - same |
| Logic Elements | 73,920 | 73,920 | 73,920 | 73,920 | 73,920 | 109,440 |
| Embedded Memory | 4,257,792 bits | 4,257,792 bits | 4,257,792 bits | 4,257,792 bits | 4,257,792 bits | 5,490,000 bits (approx) |
| User I/O | 310 | 310 | 310 | 310 | 310 | 310 (same package) |
| Transceivers | Up to 8 (3.125 Gbps) | Up to 8 (3.125 Gbps) | Up to 8 (3.125 Gbps) | Up to 8 (3.125 Gbps) | Up to 8 (3.125 Gbps) | Up to 8 (3.125 Gbps) |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
| Speed Grade | I6 (industrial, mid-speed) | I7 (industrial, faster) | C8 (commercial, fastest) | C7 (commercial) | C6 (commercial, mid-speed) | I7 (industrial, faster) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Hard PCIe IP | x1/x2 Gen1 | x1/x2 Gen1 | x1/x2 Gen1 | x1/x2 Gen1 | x1/x2 Gen1 | x1/x2 Gen1 |
Key Differentiators
- Industrial temperature grade within FBGA-672 package (vs EP4CGX75DF27C8N)
- Pin-compatible upward migration to EP4CGX110 family (vs EP4CGX75CF23I6N)
- Speed grade I6 vs I7 trade-off (vs EP4CGX75DF27I7N)
- Integrated PCIe hard IP reduces LE consumption (vs Cyclone IV E family (no transceivers, no PCIe IP))
Design Notes
Sequence VCCINT (1.2 V core) before VCCPD (3.3 V) and VCCA_PLL. Estimated: at full utilization with 8 transceivers active at 3.125 Gbps, the EP4CGX75DF27I6N can draw 1.5-2 A from the 1.2 V rail; use a switching regulator with at least 30% headroom and place decoupling capacitors within 200 mils of every VCCINT pin. VCCR/VCCT for transceivers requires low-noise LDO regulation within 2% accuracy.
Estimated: at 25C ambient with 1.5 W dissipation, the FBGA-672 package (theta_JA approximately 14 C/W with proper PCB thermal design) reaches 21C above ambient - well within industrial limits. At 85C ambient with full transceiver utilization, junction may approach 105C; verify the design's worst-case dissipation against the FBGA thermal model in the Cyclone IV GX handbook and use at least 4 thermal vias under the center BGA balls.
The FBGA-672 package requires via-in-pad technology with 0.2 mm via diameter and ENIG or ENEPIG surface finish for reliable assembly. Maintain a 4-layer FR-4 stack-up with continuous GND planes on layers 2 and 4; use 0.5 mm trace/space routing with controlled impedance (50 ohm single-ended) for high-speed transceiver lanes. Reference the Cyclone IV GX pin-out file for bank assignments.
Transceiver channels operating at 3.125 Gbps require length-matched differential pairs within 0.13 mm tolerance per the Cyclone IV GX handbook. Use 100 ohm differential impedance with AC-coupling capacitors of 100 nF placed near the receiver end. Keep reference planes continuous under all high-speed lanes and avoid layer transitions.
Do not confuse the EP4CGX75DF27I6N (industrial grade, FBGA-672) with the EP4CGX75CF23I6N (industrial grade, FBGA-256) - the latter has fewer I/O and transceivers. When migrating to EP4CGX110, confirm bank assignments remain identical despite the larger logic capacity. JTAG configuration requires the Quartus Prime programmer to recognize the I6N speed grade - older versions may need a device update.
Compliance Information
RoHS and REACH compliance per Intel Altera product page. Not AEC-Q100 qualified (FPGA not targeted at automotive functional safety); refer to Cyclone IV Auto family for AEC-Q100 variants.
