EP4SGX70HF35I3G vs EP4SGX110HF35I3G Comparison
Detailed side-by-side comparison of EP4SGX70HF35I3G by Intel and EP4SGX110HF35I3G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4SGX70HF35I3G | EP4SGX110HF35I3G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,250.00 | $7,900.00 |
| Series | Stratix IV GX | β |
| Logic Elements | 72,600 LE | 105,600 |
| Adaptive Logic Modules (ALMs) | 29,040 ALM | β |
| Embedded Memory | 7.20 Mbit (7,564,880 bits) | β |
| User I/Os | 480 | β |
| Transceivers | 9 channels up to 8.5 Gbps (GX) | β |
| 18x18 Multipliers | 488 | β |
| PLLs | 4 per quadrant | β |
| Process Technology | 40 nm TSMC | 40 nm low-power CMOS |
| Core Supply Voltage | 950 mV | β |
| Operating Temperature | -40C to +100C (Industrial) | β |
| Speed Grade | I3 | β |
| Package | 1152-ball FCBGA, 35x35 mm, 1.0 mm pitch | 1152-ball FC-FBGA (HF35), 35 x 35 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount (Flip-Chip BGA) | Surface Mount (Flip-Chip BGA) |
| Packaging | Tray | β |
| Embedded Memory Bits | β | 9,793,536 (9.4 Mbit) |
| Maximum User I/O Pins | β | 488 |
| Multipliers (18x18) | β | 352 |
| Core Supply Voltage (nominal) | β | 0.9 V |
| Family | β | Stratix IV GX |
| Speed/Grade | β | I3 (Industrial, -3 speed) |
| Operating Junction Temperature | β | -40 C to +100 C |
| Multi-Gigabit Transceivers | β | 8 channels (3.125 Gbps to 8.5 Gbps per family datasheet) |
| Hard IP Blocks | β | PCIe Gen1/Gen2, external memory PHY |
| MSL Level | β | [DATA_NEEDED: MSL level] |
| RoHS Status | β | Compliant |
| Lead-Free / Halogen-Free | β | Lead-free |
| Configuration Memory | β | SRAM-based (volatile, requires configuration device) |