EP4SGX110HF35I3G - Stratix IV GX FPGA, 105.6K LE, 1152-FCBGA | Intel
MPN: EP4SGX110HF35I3G ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $9906.62 | $9,906.62 |
| 10 | $9300 | $93,000.00 |
| 100 | $8800 | $880,000.00 |
| 500 | $8350 | $4,175,000.00 |
| 1,000 | $7900 | $7,900,000.00 |
EP4SGX110HF35I3G Overview
A Field Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit whose logic fabric, routing, and I/O can be programmed after manufacture, placing it in the broader hierarchy of programmable logic devices (PLD) -> complex programmable logic device (CPLD) -> FPGA -> system-on-chip (SoC). FPGAs differ from application-specific integrated circuits (ASICs) in that they trade per-unit cost and peak clock frequency for rapid prototyping, field upgradeability, and parallel hardware acceleration. The Stratix IV GX family specifically integrates 3.125 Gbps to 8.5 Gbps multi-gigabit transceivers (depending on speed grade), making it suitable for high-speed serial I/O applications.
Key features of the EP4SGX110HF35I3G include 105,600 logic elements (LEs), 9,793,536 bits of on-chip memory (about 9.4 Mbit), 488 maximum user I/Os, embedded 8-channel multi-gigabit transceivers (per family datasheet), hard PCI Express Gen1/Gen2 hard IP blocks, and 352 dedicated 18x18 multipliers for DSP. The device supports DDR2/DDR3 external memory interfaces via dedicated PHY blocks.
The architecture is built on a 40 nm low-power CMOS process with adaptive logic modules (ALMs), distributed MLAB memory, and TriMatrix block RAM. Eight transceiver channels can be configured for protocols including PCIe Gen1/Gen2, Gigabit Ethernet, Serial RapidIO, XAUI, CEI-6G, and HD-SDI. The HF35 package is a 35 mm x 35 mm, 1152-ball Flip-Chip BGA with 1.0 mm ball pitch.
Typical applications include high-speed serial interface bridging, telecommunications line cards, military radar signal processing, test and measurement equipment, and ASIC prototyping platforms. The integrated transceivers and PCIe hard IP blocks eliminate external PHY components, reducing board area and bill-of-materials cost.
When designing with this part, provide continuous-time linear regulators (LT3042, TPS7A4701) for the 0.9 V core and 1.1 V/1.2 V transceiver analog supplies. Decoupling per Intel Stratix IV device handbook is critical because of the high transient current demand; place 0402/0201 ceramics as close as possible to every power pin. Ensure the Flip-Chip BGA PCB has matched Z-controlled traces for all eight transceiver channels to meet S-parameter compliance.
This page consolidates distributor pricing, same-family drop-in alternatives, and practical design guidance not always surfaced in the manufacturer datasheet alone.
Drop-in alternatives for EP4SGX110HF35I3G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX110HF35I3G (same form factor and footprint) — differing in Package, Speed Grade, Process Technology, Mounting Type, Logic Elements.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4SGX110HF35I4G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$2950 / Unit
View Datasheet →EP4SGX110HF35C4G
✅ Drop-In✓ In Stock
$5000 / Unit
View Datasheet →EP4SGX110HF35C3G
✅ Drop-In✓ In Stock
$3128.75 / Unit
View Datasheet →EP4SGX110HF35C2G
✅ Drop-In✓ In Stock
$3700 / Unit
View Datasheet →EP4S100G2F40I3G
✅ Drop-In✓ In Stock
$5680 / Unit
View Datasheet →EP4SE230F29I4N
✅ Drop-In✓ In Stock
$2150 / Unit
View Datasheet →EP4SGX110HF35I3G Maximum Ratings & Electrical Characteristics
| Logic Elements | 105,600 |
| Embedded Memory Bits | 9,793,536 (9.4 Mbit) |
| Maximum User I/O Pins | 488 |
| Multipliers (18x18) | 352 |
| Core Supply Voltage (nominal) | 0.9 V |
| Package | 1152-ball FC-FBGA (HF35), 35 x 35 mm, 1.0 mm pitch |
| Family | Stratix IV GX |
| Speed/Grade | I3 (Industrial, -3 speed) |
| Operating Junction Temperature | -40 C to +100 C |
| Multi-Gigabit Transceivers | 8 channels (3.125 Gbps to 8.5 Gbps per family datasheet) |
| Hard IP Blocks | PCIe Gen1/Gen2, external memory PHY |
| Mounting Type | Surface Mount (Flip-Chip BGA) |
| RoHS Status | Compliant |
| Lead-Free / Halogen-Free | Lead-free |
| Process Technology | 40 nm low-power CMOS |
| Configuration Memory | SRAM-based (volatile, requires configuration device) |
EP4SGX110HF35I3G Pin Configuration
| Pin 1 | VCC — Core supply voltage (0.9 V nominal) |
| Pin 288 | GND — Common ground reference |
| Pin 576 | IO — General-purpose user I/O bank pin |
| Pin 864 | IO — General-purpose user I/O bank pin |
| Pin 1152 | REFCLK — Reference clock input for transceiver PLL |
Typical Applications
EP4SGX110HF35I3G is suitable for 6 applications: High-Speed Serial Interface Bridging, Telecommunications Line Cards, Military Radar Signal Processing, Test and Measurement Equipment, ASIC Prototyping Platforms, Industrial Imaging and Video Processing.
High-Speed Serial Interface Bridging
The EP4SGX110HF35I3G's eight integrated multi-gigabit transceiver channels operating from 3.125 Gbps to 8.5 Gbps per channel make it ideal for protocol bridging between PCIe Gen1/Gen2, Serial RapidIO, XAUI, Gigabit Ethernet, and CEI-6G. With 105,600 LEs and 352 18x18 multipliers, the device can handle lane aggregation and packet processing alongside the serial I/O, eliminating external PHY chips. The 488 available user I/Os allow direct connection to multiple downstream parallel interfaces. Designers route the eight transceiver channels to controlled-impedance traces on the HF35 BGA land pattern per the Stratix IV GX transceiver layout guidelines.
Recommended
Telecommunications Line Cards
Telecommunications line cards require multi-channel SERDES aggregation, packet classification, and forward-error-correction DSP, all of which the EP4SGX110HF35I3G supports in a single device. Its 9,793,536 bits of embedded memory buffer cell bursts, while the 352 multipliers implement Reed-Solomon and Turbo decoders in hardware. The HF35 1152-ball BGA package is widely accepted by ATCA and AdvancedTCA line-card vendors. The I3 industrial temperature grade (-40 C to +100 C junction) meets most telecom ambient requirements when cooled. Compliance with NEBS Level 3 thermal envelopes is achievable with proper heat-sink attachment.
Recommended
Military Radar Signal Processing
Military phased-array radar systems demand real-time FFT and beamforming throughput that the EP4SGX110HF35I3G delivers via 352 18x18 multipliers and abundant block RAM. The HF35 package supports ruggedized conduction-cooled chassis with matched CTE to the PCB substrate. The I3 industrial temperature grade combined with screened-up variants makes it suitable for defense environments. Eight transceiver channels carry digitized IF or fibre-channel data between digitizer ASICs and processing boards. Migration to radiation-tolerant equivalents is supported via the same Quartus II design flow with minor pin-out adaptations.
Recommended
Test and Measurement Equipment
High-end oscilloscopes, logic analyzers, and protocol testers benefit from the EP4SGX110HF35I3G's 105,600 logic elements and eight multi-gigabit transceivers to implement deep acquisition memory, custom protocol triggering, and real-time display rendering. The 488 user I/Os drive large parallel LVDS buses connecting ADC and DAC back-ends. JTAG-driven configuration and on-chip SignalTap logic analyzer integration accelerate debug. Industrial temperature grade is adequate for lab environments, while the HF35 BGA exposes all transceiver pins for matched-length routing to test fixture connectors.
Recommended
ASIC Prototyping Platforms
ASIC prototyping platforms segment large ASIC RTL across multiple Stratix IV GX FPGAs with high-speed transceivers stitching the partition boundaries. The EP4SGX110HF35I3G offers 105,600 LEs and eight transceivers for multi-Gbps chip-to-chip bridges that maintain timing closure at prototype speed. The 1152-ball BGA exposes dedicated clock-tree pins and abundant general-purpose I/Os for daughter-card interconnect. Quartus II design flow supports incremental compilation and LogicLock regions to mirror ASIC floor-plans. The I3 industrial grade accelerates validation of silicon blocks destined for commercial ASIC production.
Recommended
Industrial Imaging and Video Processing
Industrial imaging systems (machine vision, video broadcast, medical imaging) require real-time pixel pipelines that the EP4SGX110HF35I3G supports via 352 multipliers and 9.4 Mbit of block RAM for line buffers. The eight transceiver channels can ingest CoaXPress, Camera Link, or 3G-SDI inputs without external PHY, while the 488 user I/Os drive parallel LVDS sensor arrays. The HF35 package supports conduction-cooled rugged enclosures. Industrial -40 C to +100 C temperature grade is well suited for factory-floor or outdoor installations with adequate cooling.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX110HF35I3G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX110HF35I4G | EP4SGX110HF35C4G | EP4SGX110HF35C3G | EP4SGX110HF35C2G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-ball FC-FBGA (HF35, 35x35 mm) | 1152-ball FC-FBGA (HF35, 35x35 mm) - same | 1152-ball FC-FBGA (HF35, 35x35 mm) - same | 1152-ball FC-FBGA (HF35, 35x35 mm) - same | 1152-ball FC-FBGA (HF35, 35x35 mm) - same |
| Logic Elements | 105,600 | 105,600 | 105,600 | 105,600 | 105,600 |
| Embedded Memory | 9,793,536 bits (9.4 Mbit) | 9,793,536 bits | 9,793,536 bits | 9,793,536 bits | 9,793,536 bits |
| User I/Os | 488 | 488 | 488 | 488 | 488 |
| Speed/Grade | I3 (industrial, -3 speed) | I4 (industrial, -4 faster) | C4 (commercial, -4 faster) | C3 (commercial, -3 same speed) | C2 (commercial, -2 slower) |
| Temperature Range | -40 C to +100 C (industrial) | -40 C to +100 C (industrial) | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) |
| Multi-Gigabit Transceivers | 8 channels (up to 8.5 Gbps) | 8 channels (up to 8.5 Gbps) | 8 channels (up to 8.5 Gbps) | 8 channels (up to 8.5 Gbps) | 8 channels (up to 8.5 Gbps) |
| Lifecycle Status | NRND (Not Recommended for New Designs) | NRND | NRND | NRND | NRND |
Key Differentiators
- Same HF35 footprint with faster I4 speed grade (vs EP4SGX110HF35I4G)
- Industrial temperature screening vs commercial C3 (vs EP4SGX110HF35C3G)
- Stratix IV GX integrates transceivers and PCIe hard IP (vs EP4SE230F29I4N)
Design Notes
Estimated: the Stratix IV GX core at 0.9 V can draw peak currents exceeding 5 A under worst-case logic activity; budget upstream DC-DC converter to deliver at least 6 A continuous on the VCC rail. Use the Altera PowerPlay early power estimator tool to size rails per design utilization. Tie all GND balls to a continuous ground plane and decouple with 0402 0.1 uF X7R ceramics per the Stratix IV pin connection guidelines for flip-chip BGA packages.
Estimated: the HF35 35 mm x 35 mm FC-FBGA exposes a large thermal pad on the bottom side. Solder this pad to a 1 oz copper pour on the PCB, and stitch thermal vias (0.3 mm diameter, 1 mm pitch) from the top-side thermal pad to internal ground planes. For full-transceiver activity at 100 C junction, target at least 4 C/W board-to-ambient thermal resistance with a heat-sink attached via a thermal interface material rated for industrial temperature.
Route all eight transceiver channels with 100 ohm differential controlled impedance on the top layer over a continuous ground reference, with no more than two layer transitions per channel. Keep AC-coupling capacitors within 100 mils of the device ball. Provide 4 mil clearance from non-transceiver signals to preserve S-parameter compliance. Per the Stratix IV GX transceiver user guide, length-match intra-pair skew to within 5 mil and inter-pair skew to within 150 mil.
Stratix IV GX uses SRAM-based configuration memory, so the FPGA loses its bitstream on power-down. Always pair it with an Altera EPCS or EPCQ configuration flash, or a CFI flash, plus appropriate MSEL pin strapping for the chosen configuration scheme. Failing to strap CONFIG_SEL pins correctly is a frequent cause of board bring-up failures. Refer to the Stratix IV configuration handbook for AS, PS, JTAG, and FPP mode details.
Compliance Information
Trailing 'G' suffix indicates lead-free per Altera/Intel ordering code. RoHS compliance verified per DigiKey product listing. Not AEC-Q100 qualified; FPGAs are not generally AEC-Q100 screened.
