Intel

EP4SGX70HF35I3G - 72.6K LE Stratix IV GX FPGA, FCBGA-1152 | Intel

MPN: EP4SGX70HF35I3G ✗ End of Life

In Stock Ships in 1-3 business days

950 mV Vdss 1152-ball FCBGA, 35x35 mm, 1.0 mm pitch Package I3 Speed 7.20 Mbit (7,564,880 bits) Memory

From $1250 USD / Unit

MOQ: 1 |

Price updated: 2026-09-10

Volume Pricing

Qty	Unit Price	Extended
1	$1850	$1,850.00
10	$1680	$16,800.00
100	$1520	$152,000.00
500	$1380	$690,000.00
1,000	$1250	$1,250,000.00

ℹ️ All prices are in USD

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EP4SGX70HF35I3G Overview

The Intel EP4SGX70HF35I3G is a high-density Stratix IV GX field-programmable gate array (FPGA) with 72,600 logic elements, 7,564,880 bits of embedded memory, and 29,040 adaptive logic modules (ALMs), housed in a 1152-ball flip-chip BGA (FCBGA) package. It integrates up to 480 user I/Os, multi-gigabit transceivers, and 488 (18x18) multipliers, all manufactured on TSMC's 40 nm process node with a core supply of 950 mV.

An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic functionality is defined by customer configuration after manufacturing, rather than at the fab. FPGAs sit in the hierarchy of programmable logic devices (PLD) -> CPLD -> FPGA -> structured ASIC, and serve as the highest-density programmable platform for digital signal processing, high-speed serial I/O, and parallel datapath designs. The Stratix IV family specifically targets high-performance, transceiver-rich applications such as wireline telecom, military radar, and high-end test and measurement.

Key features of the EP4SGX70HF35I3G include 9 integrated transceivers capable of up to 8.5 Gbps data rates (GX variant), 7.20 Mbit of embedded SRAM organized as M9K and M144K blocks, support for DDR/DDR2/DDR3/QDR II/QDR II+ external memory interfaces, and 4 phase-locked loops (PLLs) per device quadrant. The I3 speed grade and -40C to +100C industrial temperature range make it suitable for harsh-environment deployments while still meeting demanding timing budgets.

Architecture-wise, the device uses Altera's Logic Array Blocks (LABs) containing 8 ALMs each, with routing driven by MultiTrack interconnect and DirectDrive technology. Transceiver tiles are arranged adjacent to the I/O banks on the device periphery, with PCS and PMA blocks supporting protocols such as PCIe Gen1/Gen2, XAUI, CPRI, and Serial RapidIO. The 1152-ball FCBGA utilizes a 35 mm x 35 mm substrate with 1.0 mm ball pitch, requiring high-density PCB manufacturing.

Typical applications include 10G Ethernet line cards, baseband processing for wireless infrastructure, video broadcast and imaging pipelines, military secure-communication modems, and high-channel-count data acquisition systems. Its combination of transceivers, DSP blocks, and large memory makes it especially effective for signal-processing pipelines requiring both packet handling and parallel arithmetic.

When designing with this FPGA, prioritize signal-integrity-aware stackup design for the FCBGA footprint, allocate sufficient decoupling (typically 0.1 uF, 1 uF, and bulk capacitance) around each transceiver tile power pin, and validate pin assignments against the Quartus II pin-out file before layout commit. Industrial-grade I3 silicon requires proper thermal management to keep junction temperature below 100C at full transceiver utilization.

This page synthesizes distributor pricing, same-family pin-compatible alternatives, and practical design notes not found in the manufacturer datasheet alone.

Drop-in alternatives for EP4SGX70HF35I3G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP4SGX70HF35I3G (same form factor and footprint) — differing in Package, Speed Grade, Process Technology, Mounting Type, Logic Elements.

EP4SGX110HF35I3G

Intel

Package: 1152-ball FC-FBGA (HF35), 35 x 35 mm, 1.0 mm pitch

Process Technology: 40 nm low-power CMOS

Logic Elements: 105,600