EP4SGX70HF35I3G vs EP4SGX70DF29I3G Comparison
Detailed side-by-side comparison of EP4SGX70HF35I3G by Intel and EP4SGX70DF29I3G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4SGX70HF35I3G | EP4SGX70DF29I3G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,250.00 | $1,080.00 |
| Series | Stratix IV GX | Stratix IV GX |
| Logic Elements | 72,600 LE | β |
| Adaptive Logic Modules (ALMs) | 29,040 ALM | β |
| Embedded Memory | 7.20 Mbit (7,564,880 bits) | β |
| User I/Os | 480 | β |
| Transceivers | 9 channels up to 8.5 Gbps (GX) | β |
| 18x18 Multipliers | 488 | β |
| PLLs | 4 per quadrant | β |
| Process Technology | 40 nm TSMC | 40 nm |
| Core Supply Voltage | 950 mV | 0.87 V to 0.93 V |
| Operating Temperature | -40C to +100C (Industrial) | β |
| Speed Grade | I3 | -3 |
| Package | 1152-ball FCBGA, 35x35 mm, 1.0 mm pitch | β |
| Mounting Type | Surface Mount (Flip-Chip BGA) | Surface Mount (BGA) |
| Packaging | Tray | β |
| Logic Elements (LE) | β | 72,600 |
| Embedded Memory Bits | β | 7,564,880 (about 7.5 Mbit) |
| Embedded Memory Blocks | β | 72600 |
| Number of Logic Cells / Arrays | β | 372 |
| Number of User I/O Pins | β | 372 |
| Number of Transceiver Channels | β | [DATA_NEEDED: exact channel count for this device] |
| Transceiver Data Rate | β | [DATA_NEEDED: per-channel data rate] |
| Package Type | β | 780-Ball FCBGA (Fine-pitch Chip-Scale BGA, flip-chip) |
| Package Code | β | DF29 |
| Operating Temperature Grade | β | Industrial (I3) |
| Junction Temperature Range | β | -40C to +100C |
| MSL Level | β | [DATA_NEEDED: MSL rating] |
| RoHS Status | β | Compliant |
| Halogen-Free | β | [DATA_NEEDED: halogen-free claim] |