EP4SGX70DF29I3G - Stratix IV GX FPGA 72.6K LE | Intel
MPN: EP4SGX70DF29I3G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1620 | $1,620.00 |
| 10 | $1485 | $14,850.00 |
| 100 | $1350 | $135,000.00 |
| 500 | $1215 | $607,500.00 |
| 1,000 | $1080 | $1,080,000.00 |
EP4SGX70DF29I3G Overview
An FPGA (field-programmable gate array) is a programmable logic device containing an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric and surrounded by peripheral I/O and hard IP blocks. In modern systems the FPGA sits below ASICs and below dedicated processors in the silicon hierarchy: it offers custom-hardware parallelism without the NRE cost of an ASIC while delivering deterministic latency and throughput that microcontrollers cannot match. Stratix IV GX devices specifically add multi-gigabit transceivers and physical coding sublayer (PCS) hard IP to the FPGA fabric, placing them in the high-end signal-processing and connectivity tier above Cyclone and below Arria/Stratix V families.
Key differentiating features include 8 transceiver channels at up to 8.5 Gbps (chip-dependent), 372 general-purpose user I/O pins, dedicated DSP blocks for fixed- and floating-point operations, and embedded memory blocks supporting true dual-port and FIFO modes. The -3 speed grade balances timing margin against power consumption, and the industrial temperature rating (I3 suffix) suits outdoor, in-cabin, and ruggedized designs.
Typical applications span high-end telecommunications line cards (40G/100G framer and MAC bridging), high-speed serial backplane aggregation, ASIC prototyping, real-time DSP for radar and beamforming, and PCIe Gen2 endpoint or rootport designs. The hard PCIe Gen2 IP block and 8.5 Gbps transceivers make this family a frequent choice for line cards requiring both packet processing and high-speed serial I/O.
When designing with the EP4SGX70DF29I3G, pay close attention to PCB BGA breakout: the 780-ball FCBGA package typically uses 1.0 mm ball pitch and demands a multilayer stack-up with microvia or HDI technology. Power-rail sequencing must follow the Stratix IV Power Management Guide to avoid latch-up; the 0.9 V core rail should ramp before or simultaneously with the 1.1 V transceiver analog rail, and never exceed the absolute maximum values stated in the datasheet.
This page synthesizes distributor pricing, drop-in equivalents, and design notes that complement - but do not replace - the manufacturer datasheet for sourcing decisions.
Drop-in alternatives for EP4SGX70DF29I3G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX70DF29I3G (same form factor and footprint) — differing in Package, Speed Grade, Mounting Type, Transceivers, Operating Temperature Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4SGX70DF29I3N
✅ Drop-In📋 Reference alternative (not in catalog)
EP4SGX70DF29C4G
✅ Drop-In✓ In Stock
$196.99 / Unit
View Datasheet →EP4SGX70DF29C3G
✅ Drop-In✓ In Stock
$1425 / Unit
View Datasheet →EP4SGX70DF29C2XN
✅ Drop-In✓ In Stock
$2450 / Unit
View Datasheet →EP4SGX70DF29C2XG
✅ Drop-In✓ In Stock
$1295 / Unit
View Datasheet →EP4CGX110DF29I3G
✅ Drop-In📋 Reference alternative (not in catalog)
EP4SGX70DF29I3G Maximum Ratings & Electrical Characteristics
| Series | Stratix IV GX |
| Process Technology | 40 nm |
| Logic Elements (LE) | 72,600 |
| Embedded Memory Bits | 7,564,880 (about 7.5 Mbit) |
| Embedded Memory Blocks | 72600 |
| Number of Logic Cells / Arrays | 372 |
| Number of User I/O Pins | 372 |
| Package Type | 780-Ball FCBGA (Fine-pitch Chip-Scale BGA, flip-chip) |
| Package Code | DF29 |
| Operating Temperature Grade | Industrial (I3) |
| Junction Temperature Range | -40C to +100C |
| Core Supply Voltage | 0.87 V to 0.93 V |
| Speed Grade | -3 |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
EP4SGX70DF29I3G df29 Pin Configuration Guide
Pin configuration for EP4SGX70DF29I3G (df29 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4SGX70DF29I3G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4SGX70DF29I3G is suitable for 6 applications: 40G/100G Telecom Line Card, ASIC Prototyping Platform, Radar and Beamforming DSP, High-Speed Test and Measurement Instrumentation, PCIe Gen2 Endpoint / Rootport Card, Industrial Video Processing and Broadcast.
40G/100G Telecom Line Card
The EP4SGX70DF29I3G targets high-density line cards where 40G and 100G Ethernet framer and MAC bridging must coexist with multi-gigabit serial backplane I/O. With 72,600 logic elements and 7.5 Mbit of embedded memory, the device absorbs framer/MAC state, look-up tables, and shallow packet buffers without external SRAM. The integrated multi-gigabit transceivers in the Stratix IV GX family operate up to 8.5 Gbps per channel, enough to feed SFP+ or backplane SerDes at typical telecom data rates. Placed alongside a network processor, the FPGA offloads classification, queue management, and OAM (operations, administration, maintenance) functions, leaving the NPU free for forwarding. A typical board uses eight transceiver lanes from the FPGA to a backplane connector plus 16 GMII lanes to the NPU. The -3 speed grade provides adequate timing margin for 156.25 MHz and 161.13 MHz reference clocks used in OTU and Ethernet applications.
Recommended
ASIC Prototyping Platform
Engineers use the EP4SGX70DF29I3G as an ASIC prototype vehicle for designs that will eventually tape out as 28 nm or 40 nm standard-cell ASICs. Its 72,600 logic elements roughly correspond to 1.5-2 million ASIC gates, suitable for validating mid-complexity SoC designs. The 7.5 Mbit of embedded block RAM models on-chip SRAM, while the multi-gigabit transceivers replicate the high-speed SERDES of the target ASIC. Logic designers partition the ASIC RTL into the FPGA fabric, compile with Quartus Prime, and iterate with near-real-time turnaround compared to ASIC tape-out cycles of 8-12 weeks. Typical use cases include pre-silicon validation of PCIe Gen2 endpoints, DDR3 controller logic, and custom accelerator blocks. The 780-ball FCBGA package offers sufficient I/O and power pins for prototyping boards that include DDR3 SODIMM sockets, FMC connectors, and SMA clock inputs.
Recommended
Radar and Beamforming DSP
The EP4SGX70DF29I3G is well suited to radar baseband processing and digital beamforming because it combines dedicated DSP blocks with high transceiver throughput. Each Stratix IV GX DSP block supports 18x18 multiplication plus accumulation, allowing efficient FFT and matrix-multiply kernels for phased-array beamforming. With 8.5 Gbps transceivers, multiple ADCs can stream data into the FPGA over JESD204B or proprietary LVDS links at aggregate rates above 5 Gbps. The 7.5 Mbit of embedded memory serves as FFT working storage for windows of 1024-4096 complex samples, while external DDR3 provides long-term capture buffers. Beamforming designs typically instantiate 4-16 beams simultaneously, with weight vectors loaded over Ethernet or SPI from a host processor. The industrial temperature rating of the I3 suffix supports outdoor radar installations including weather, marine, and defense surveillance systems.
Recommended
High-Speed Test and Measurement Instrumentation
Test equipment manufacturers deploy the EP4SGX70DF29I3G in oscilloscope acquisition paths, logic analyzer capture cards, and protocol analyzers where deterministic latency and parallel DSP matter. Its 372 user I/O pins accept hundreds of LVDS or LVCMOS probe signals, while the 7.5 Mbit embedded memory stores trigger pattern look-up tables. The integrated transceivers enable direct 6 Gbps or 8 Gbps SATA/SAS/PCIe protocol analysis without external PHY chips. Designers of BERT (bit-error-rate-tester) instruments leverage the FPGA fabric to implement custom pattern generation, error counting, and eye-diagram post-processing. Real-time jitter analysis benefits from the deterministic clock trees of Stratix IV GX devices and the -3 speed grade timing margin. Industrial temperature rating supports lab and field-deployed test gear used in outdoor cell-tower commissioning and automotive EMC chambers.
Recommended
PCIe Gen2 Endpoint / Rootport Card
The EP4SGX70DF29I3G integrates a hard PCIe Gen2 IP block that supports x1, x2, and x4 endpoint and rootport configurations at 5 Gbps line rate. Storage and accelerator card designers use this block to implement NVMe SSD controllers, FPGA-based data acquisition cards, and HPC accelerator boards. The hard IP block handles the PCIe physical layer, data link layer, and transaction layer in dedicated silicon, freeing the FPGA fabric for application logic. With 72,600 logic elements and 7.5 Mbit of memory, the device can absorb DMA engines, command queues, and shallow data buffers. A typical board implements four PCIe lanes routed to an edge connector, two DDR3 SODIMM slots for working memory, and 8.5 Gbps transceivers for additional external connectivity. The -3 speed grade closes timing at the 250 MHz PCIe Gen2 clock with margin for signal-integrity losses across standard FR-4 backplanes.
Recommended
Industrial Video Processing and Broadcast
Broadcast equipment vendors use the EP4SGX70DF29I3G for SDI (Serial-Digital Interface) routing, video format conversion, and real-time overlay processing. Its multi-gigabit transceivers accept SDI rates up to 3 Gbps (SMPTE 424M) directly, while the FPGA fabric implements color-space conversion, scaling, and genlocking. The 372 user I/O pins support multiple parallel DVI/HDMI/DisplayPort input ports alongside the serial SDI streams. Embedded block RAM provides line buffers for deinterlacing and frame-rate conversion, while external DDR3 stores multi-frame buffers for picture-in-picture and logo overlay. Industrial temperature rating supports broadcast equipment deployed in outdoor venues, mobile production trucks, and stadium scoreboard systems. Typical channel count is 4-8 simultaneous SDI streams processed in real time, with control and metadata exchanged over Ethernet or RS-422 to a host controller.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX70DF29I3G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX70DF29I3N | EP4SGX70DF29C4G | EP4SGX70DF29C3G | EP4SGX70DF29C2XN | EP4CGX110DF29I3G |
|---|---|---|---|---|---|---|
| Package | 780-Ball FCBGA (DF29) | 780-Ball FCBGA (DF29) - same | 780-Ball FCBGA (DF29) - same | 780-Ball FCBGA (DF29) - same | 780-Ball FCBGA (DF29) - same | 780-Ball FCBGA (DF29) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | Stratix IV GX | Stratix IV GX | Stratix IV GX | Stratix IV GX | Stratix IV GX | Cyclone IV GX |
| Logic Elements | 72,600 | 72,600 | 72,600 | 72,600 | 72,600 | 109,424 |
| Embedded Memory (bits) | 7,564,880 | 7,564,880 | 7,564,880 | 7,564,880 | 7,564,880 | 4,881,408 |
| Speed Grade | -3 | -3 | -4 | -3 | -2 | -3 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial |
| Finish | Lead-free (Pb-free) | Leaded (Pb) | Lead-free | Lead-free | Leaded | Lead-free |
Key Differentiators
- Industrial temperature grade with -3 speed grade (vs EP4SGX70DF29C4G)
- Lead-free (RoHS) finish (vs EP4SGX70DF29I3N)
- Mid-density 72.6K LE positioning in Stratix IV GX family (vs EP4SGX230DF29I3N)
Design Notes
The 780-ball FCBGA DF29 package uses 1.0 mm ball pitch, requiring a multilayer PCB stack-up with HDI microvia technology. Design escape routing for inner balls should be planned in a daisy-chain or dogbone pattern with at least 4-6 routing layers between BGA and PCB edge. Maintain a continuous ground plane under the BGA and stitch vias around the perimeter every 2-3 mm to control return-path inductance for the multi-gigabit transceivers. Use the manufacturer's reference designators in the Stratix IV GX handbook as a starting point.
Stratix IV GX devices require a controlled power-up sequence. The 0.9 V VCC rail must ramp to within specification before or simultaneously with the 1.1 V transceiver analog supply (VCCR_GXB / VCCT_GXB) and the 2.5 V/3.0 V auxiliary supplies. Use the SmartVoltage Controller or discrete sequencer with PG (power-good) feedback from each rail. Reverse sequencing during power-down can latch the device and require a full POR cycle to recover. Decoupling: place 0402 or 0201 X5R ceramics within 100 mils of every supply ball, with bulk polymer or tantalum capacitors on each supply island.
Multi-gigabit transceiver channels at 8.5 Gbps demand controlled-impedance differential routing (typically 100 ohm differential). Maintain pair-to-pair length matching within 5 mils and intra-pair skew under 1 ps. Use Acac-coupled PCB materials (e.g. Isola FR408HR, Rogers RO4350B) for backplane channels exceeding 15 inches. Reference clock routing must be impedance-controlled and isolated from switching power-supply traces by at least 5W (3W for inner layers). Add AC-coupling capacitors of 100 nF X7R 0402 in line with each TX/RX lane near the FPGA ball.
Estimated: At full utilization with all transceivers active, the EP4SGX70DF29I3G can dissipate 10-15 W. With a typical FCBGA junction-to-ambient thermal resistance of 8-12 C/W (depending on PCB design), the junction temperature can approach 150C in a sealed enclosure without airflow. A heatsink with thermal interface material and 200-400 LFM airflow is recommended for industrial applications. For outdoor telecom enclosures without active cooling, derate the device by reducing transceiver count or user I/O toggle rate.
Do not assume Cyclone IV GX and Stratix IV GX parts with the same DF29 package are interchangeable - they differ in transceiver counts, DSP block counts, and PCIe Gen2 hard IP configuration. Before substitution, always re-validate the Quartus Prime pin assignments, the transceiver reference clocking scheme, and the configuration scheme (AS, PS, JTAG, FPP). Mis-programming the MSEL pins results in configuration failure that mimics a bad board. Always tie CONF_DONE high with a 10 kohm pull-up and check nSTATUS at power-up before issuing the first JTAG instruction.
Compliance Information
RoHS compliance inferred from 'G' suffix per Stratix IV datasheet markings. AEC-Q100 not applicable (FPGA is not a discrete automotive IC).
