EPF10K130EFC484-3N vs EPF10K100EFC484-3N Comparison
Detailed side-by-side comparison of EPF10K130EFC484-3N by Intel and EPF10K100EFC484-3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPF10K130EFC484-3N
EPF10K130EFC484-3N - 130K Gates FLEX-10KE FPGA | Intel | 484-BGA
EPF10K130EFC484-3N NrndIntel
EPF10K100EFC484-3N
EPF10K100EFC484-3N - 100K Gates FLEX 10KE FPGA | Intel / Altera
EPF10K100EFC484-3N ObsoleteSpecification Comparison
| Parameter | EPF10K130EFC484-3N | EPF10K100EFC484-3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $109.25 | $142.00 |
| Series | FLEX-10KE | β |
| Number of Logic Elements / Cells | 6656 | β |
| Total RAM Bits | 65536 | β |
| Typical Gate Count | 130000 | β |
| Number of I/O | 369 | β |
| Number of LABs/CLBs | 832 | β |
| Number of Embedded Array Blocks (EABs) | 72 | β |
| Speed Grade | -3 (faster timing bin) | -3 (fastest commercial bin) |
| Operating Temperature Grade | Commercial (0C to +70C) | β |
| Core Voltage | 2.5 V | β |
| Process Technology | 0.22 Β΅m CMOS | 0.22 Β΅m CMOS |
| Package Type | 484-BBGA (FineLine BGA) | β |
| Package Dimensions | 23 x 23 mm | β |
| Ball Pitch | 1.0 mm | β |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Configuration Memory | SRAM-based (volatile, requires config device) | β |
| RoHS Status | [DATA_NEEDED: RoHS status] | β |
| Configuration Interface | JTAG / PS / PPS / Altera serial | β |
| Family | β | FLEX 10KE |
| Logic Elements / Cells | β | 4992 |
| Total Gates | β | 100,000 |
| Embedded Memory (EAB) | β | 49,152 bits (12 EABs) |
| Logic Array Blocks (LABs) | β | 624 |
| User I/Os | β | 338 |
| Core Voltage (VCCINT) | β | 2.5 V |
| I/O Voltage (VCCIO) | β | MultiVolt (2.5 V / 3.3 V / 5.0 V tolerant per bank) |
| Internal Performance | β | 200 MHz |
| Package | β | 484-ball FineLine BGA (FC484 / FBGA-484) |
| Temperature Grade | β | Commercial (0 Β°C to +70 Β°C) |
| Configuration Method | β | SRAM (external EPROM/Flash/JTAG required at power-up) |
| Lead-Free / RoHS | β | Yes (N suffix = lead-free) |