EPF10K100EFC484-3N - 100K Gates FLEX 10KE FPGA | Intel / Altera
MPN: EPF10K100EFC484-3N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $248 | $2,480.00 |
| 100 | $198 | $19,800.00 |
| 500 | $165 | $82,500.00 |
| 1,000 | $142 | $142,000.00 |
EPF10K100EFC484-3N Overview
A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) - an integrated circuit whose logic function is defined after manufacture by the end user. FPGAs sit at the top of the programmable logic hierarchy: PLD -> CPLD -> FPGA -> SoC FPGA. Within that hierarchy, the FLEX 10KE family belongs to the SRAM-look-up-table (LUT) based FPGA category, where configuration bits are stored in SRAM cells and the device is reprogrammable in-system.
Key features include 624 logic array blocks (LABs), 12 embedded array blocks (EABs) totaling 49,152 RAM bits, 200 MHz internal performance, pin-by-pin slew-rate control, open-drain output option, PCI pull-up clamping diode support, and MultiVolt I/O allowing the I/O bank voltage (VCCIO) to differ from the core voltage (VCCINT). The 'FC484' suffix denotes the 484-ball FineLine BGA package and 'N' indicates a lead-free, lead-free reflow-compatible device.
The FLEX 10KE architecture combines fine-grained logic elements (LEs) organized into LABs with coarse-grained EABs that efficiently implement RAM, ROM, and multiplier functions. The '-3' speed grade designates the fastest commercial speed bin available for this family. Per-pin options are configured using Altera (now Intel Quartus / MAX+plus II) logic-option settings, eliminating external glue logic.
Typical applications include high-volume glue logic consolidation, PCI bus interface bridges, telecommunications backplane controllers, industrial control and factory automation, and legacy ASIC replacement designs where the FLEX 10KE's combination of 100K gates, abundant I/O, and embedded RAM provides an optimal balance of density and flexibility.
When designing with this device, plan for SRAM-based configuration: the FPGA must be configured from an external EPROM, flash, microcontroller, or JTAG cable on every power-up. Provide decoupling per Quartus guidelines, respect I/O bank VCCIO grouping rules, and verify MultiVolt signaling against downstream ASIC voltages.
This page synthesizes distributor pricing, drop-in same-package FLEX 10KE speed-grade alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EPF10K100EFC484-3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K100EFC484-3N (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, Process Technology, Series.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K100EFC484-3
✅ Drop-In✓ In Stock
$65 / Unit
View Datasheet →EPF10K100EFC484-2X
✅ Drop-In✓ In Stock
$237.71 / Unit
View Datasheet →EPF10K100EFC484-2
✅ Drop-In✓ In Stock
$185.4 / Unit
View Datasheet →EPF10K100EFC484-1X
✅ Drop-In✓ In Stock
$349.57 / Unit
View Datasheet →EPF10K100EFC484-1N
✅ Drop-In✓ In Stock
$158 / Unit
View Datasheet →EPF10K100EFC484-1
✅ Drop-In✓ In Stock
$142 / Unit
View Datasheet →EPF10K100AFC484-2N
✅ Drop-In✓ In Stock
$152 / Unit
View Datasheet →EPF10K100EFC484-3N Maximum Ratings & Electrical Characteristics
| Family | FLEX 10KE |
| Logic Elements / Cells | 4992 |
| Total Gates | 100,000 |
| Embedded Memory (EAB) | 49,152 bits (12 EABs) |
| Logic Array Blocks (LABs) | 624 |
| User I/Os | 338 |
| Process Technology | 0.22 µm CMOS |
| Core Voltage (VCCINT) | 2.5 V |
| I/O Voltage (VCCIO) | MultiVolt (2.5 V / 3.3 V / 5.0 V tolerant per bank) |
| Internal Performance | 200 MHz |
| Speed Grade | -3 (fastest commercial bin) |
| Package | 484-ball FineLine BGA (FC484 / FBGA-484) |
| Temperature Grade | Commercial (0 °C to +70 °C) |
| Configuration Method | SRAM (external EPROM/Flash/JTAG required at power-up) |
| Lead-Free / RoHS | Yes (N suffix = lead-free) |
| Mounting Type | Surface Mount (BGA) |
EPF10K100EFC484-3N 484-ball fineline bga (fc484 / fbga-484) Pin Configuration Guide
Pin configuration for EPF10K100EFC484-3N (484-ball fineline bga (fc484 / fbga-484) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K100EFC484-3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K100EFC484-3N is suitable for 7 applications: PCI Bus Interface Bridge, Telecommunications Backplane Controller, Industrial Control and Factory Automation, Legacy ASIC Replacement, Embedded Array Block (EAB) Memory Buffer, High-Speed Glue Logic Consolidation, Test and Measurement Instrumentation.
PCI Bus Interface Bridge
The EPF10K100EFC484-3N's 338 user I/Os, 5 V-tolerant PCI input buffers, and PCI pull-up clamping diode option make it well-suited for implementing PCI 2.1 / 3.0 bus bridges and adapters. The 5 V-tolerant MultiVolt I/O banks interface directly to PCI signaling without external level shifters, while the 100K-gate density holds a full PCI target state machine plus scatter-gather DMA engine. Designers typically instantiate 32-bit / 33 MHz PCI cores from the Altera IP library and use the chip's 200 MHz internal performance to run auxiliary logic in parallel.
Recommended
Telecommunications Backplane Controller
With 49,152 bits of embedded array block (EAB) memory and 624 LABs, the EPF10K100EFC484-3N can implement deep FIFOs, look-up tables, and time-slot crossbar switches for T1/E1 / T3 / STS-1 backplane traffic grooming. The 200 MHz internal performance gives ample timing margin for 77.76 MHz STS-1 payload processing, and the 5 V-tolerant I/O banks interface cleanly to legacy bus-interface ASICs. The FineLine BGA package's fine-pitch 1.0 mm ball array also supports high-density board layouts for line-card designs.
Recommended
Industrial Control and Factory Automation
Factory-floor PLC and motion-controller designs favor the EPF10K100EFC484-3N for its combination of 338 user I/Os, MultiVolt I/O, and 100K-gate density to absorb discrete glue logic, encoder counters, and serial-protocol bridges (RS-485, CAN, SPI). The commercial temperature range suits enclosed cabinet environments, and the BGA package supports shock- and vibration-resistant mounting. The chip's 49 Kbit of block RAM is sufficient for short trajectory buffers and PID lookup tables used in motion control.
Recommended
Legacy ASIC Replacement
The EPF10K100EFC484-3N is a classic ASIC replacement target: 100K gates is in the sweet spot for mid-complexity gate-array conversions, and SRAM-based reconfiguration lets engineering teams iterate quickly while preserving the option of last-minute ECOs. Designers port existing ASIC netlists through Altera's netlist-import flow in MAX+plus II, verify against the original test vectors, and ship pre-configured boards. The MultiVolt I/O eases integration with legacy 5 V ASIC peripherals.
Recommended
Embedded Array Block (EAB) Memory Buffer
With 12 EABs totaling 49,152 bits, the EPF10K100EFC484-3N can be configured as dual-port RAM, ROM, content-addressable memory, or multiplier arrays. This makes it attractive for DSP front-end designs (FIR filters, correlators, FFT windows) and video pixel buffers where block-RAM density and 200 MHz access speed matter more than LUT count. Each EAB can be configured as 256 x 16, 512 x 8, 1024 x 4, or 2048 x 2 in any combination.
Recommended
High-Speed Glue Logic Consolidation
Design teams routinely use the EPF10K100EFC484-3N to absorb multiple discrete 74-series TTL / CMOS parts, address-decoders, and bus-arbitration logic on to a single programmable device. The 200 MHz internal performance comfortably exceeds 50 MHz TTL edge rates, and pin-by-pin slew-rate control lets designers tune 5 V PCI edges without series resistors. The result is reduced board area, lower BOM cost, and easier EMC compliance compared to discrete implementations.
Recommended
Test and Measurement Instrumentation
Test-equipment OEMs valued the EPF10K100EFC484-3N for protocol-analyzer cards, logic-analyzer probe pods, and bit-error-rate testers where 338 I/Os can capture parallel buses up to 32 bits wide. The 200 MHz internal logic combined with pin-to-pin skew control allows reliable state-machine timing at high sample rates, while the SRAM programmability supports frequent product-feature upgrades without respin. The BGA package's thermal envelope also suits sealed chassis used in lab instruments.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K100EFC484-3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K100EFC484-3 | EPF10K100EFC484-2X | EPF10K100EFC484-2 | EPF10K100EFC484-1N | EPF10K100AFC484-2N |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 484-ball FineLine BGA (FC484) | 484-ball FineLine BGA (FC484) - same | 484-ball FineLine BGA (FC484) - same | 484-ball FineLine BGA (FC484) - same | 484-ball FineLine BGA (FC484) - same | 484-ball FineLine BGA (FC484) - same |
| Family / Logic Elements | FLEX 10KE / 4992 LEs | FLEX 10KE / 4992 LEs (same die) | FLEX 10KE / 4992 LEs (same die) | FLEX 10KE / 4992 LEs (same die) | FLEX 10KE / 4992 LEs (same die) | FLEX 10KA / ~4992 LEs (predecessor family) |
| Total Gates | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 |
| User I/Os | 338 | 338 | 338 | 338 | 338 | 338 |
| Speed Grade | -3 (fastest) | -3 | -2 | -2 | -1 (slowest) | -2 |
| Core Voltage (VCCINT) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 3.3 V (FLEX 10KA difference) |
| Lead-Free / RoHS | Yes (Pb-free, 'N' suffix) | No (SnPb finish) | Yes | No (SnPb finish) | Yes | Yes |
| Lifecycle Status | Obsolete / EOL | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest-speed commercial bin for FLEX 10KE 484-ball FBGA family (vs EPF10K100EFC484-1N)
- RoHS / lead-free compliant finish (vs EPF10K100EFC484-3)
- Same-family migration path versus FLEX 10KA predecessor (vs EPF10K100AFC484-2N)
Design Notes
The 484-ball FineLine BGA uses a 1.00 mm pitch ball array; PCB land pads must follow IPC-7351 BGA guidelines with NSMD (non-solder mask defined) pads for best joint reliability. Use at least 4 PCB layers with a continuous ground plane directly under the BGA to provide reference for the VCCINT / VCCIO balls and to control supply-impedance resonances. Place all decoupling capacitors (one 0.1 µF X7R per VCCINT/VCCIO ball plus bulk 47 µF tantalum) within 100 mil of their respective balls; do not route signals through the BGA's power-ball rows.
Sequencing of VCCINT (2.5 V core) and VCCIO banks is not strictly required for the FLEX 10KE, but design margin improves if VCCINT ramps before or simultaneously with VCCIO. The on-chip Power-On-Reset (POR) circuit holds the device in reset until both rails cross threshold; a soft-start ramp of 1 ms minimum prevents inrush current from collapsing the 2.5 V rail. Estimated: at idle, VCCINT current is roughly 100 mA; fully utilized 100K-gate designs can pull 500-800 mA from VCCINT, so budget at least a 2 A regulator per device.
Do not omit the external configuration EPROM (e.g., EPC2LC20) - the FLEX 10KE is SRAM-based and will not boot without a valid configuration image on DCLK / DATA0 at every power-up. The nCONFIG pin must be pulled high through a 10 kΩ resistor to VCCIO and the nSTATUS / CONF_DONE LEDs are essential first-time-bring-up debug aids. Mixed-voltage I/O banks must each have their own VCCIO supply: shorting a 5 V bank to a 3.3 V bank destroys the LVTTL input structures.
Compliance Information
RoHS compliance inferred from the 'N' suffix in the MPN per the FLEX 10KE family datasheet ordering information; halogen-free status is not stated in the verified data and is recorded as 'unknown'. The part is not AEC-Q100 qualified - it is a commercial-temperature-grade FPGA and is not intended for automotive applications.
