EPF10K200EBC600-3 vs EPF10K200EBC600-1 Comparison

Detailed side-by-side comparison of EPF10K200EBC600-3 by Intel and EPF10K200EBC600-1 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K200EBC600-3 EPF10K200EBC600-1
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $575.00 $322.17
Family FLEX 10KE β€”
Series FLEX-10KE β€”
System Gates 200,000 β€”
Logic Elements / Cells 9,984 β€”
Logic Array Blocks (LABs) 1248 β€”
Embedded Memory (EABs) 24,576 bits β€”
Maximum User I/O 470 β€”
Number of PLLs 4 β€”
Core Voltage 2.5 V (2.375 V to 2.625 V) β€”
Process Technology 0.22 micrometer SRAM β€”
Speed Grade -3 (commercial) β€”
Package 600-ball FineLine BGA, 45 x 45 mm 600-BGA
Mounting Type Surface Mount β€”
Operating Temperature 0C to +70C (commercial) β€”
JTAG Support Yes (IEEE 1149.1 boundary-scan) β€”
RoHS Status [DATA_NEEDED: RoHS compliance status] unknown
Product Type β€” Field Programmable Gate Array (FPGA)
Device Family β€” FLEX-10KE
Logic Elements β€” 9,984
Embedded Memory β€” 98,304 bits
Logic Array Blocks β€” 1,248 LABs
I/O Count β€” 470 I/O
Supply Voltage β€” 2.5 V
Technology β€” Mixed CMOS
Commercial Temperature β€” 85 C
Propagation Delay β€” 0.4 ns
Embedded Array β€” Enhanced embedded array
Memory Feature β€” Dual-port memory
Configuration Interface β€” [DATA_NEEDED: configuration interface]
Package Dimensions β€” [DATA_NEEDED: package dimensions]
Operating Current β€” [DATA_NEEDED: operating current]
Pinout β€” [DATA_NEEDED: 600-BGA ball map]
Moisture Sensitivity Level β€” [DATA_NEEDED: MSL level]

Datasheets & Resources

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