EPF10K200EBI600-2 vs EPF10K200EBC600-1 Comparison

Detailed side-by-side comparison of EPF10K200EBI600-2 by Intel and EPF10K200EBC600-1 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K200EBI600-2 EPF10K200EBC600-1
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $198.00 $322.17
Family FLEX 10KE β€”
System Gates 200,000 β€”
Logic Elements (LEs) 9,984 β€”
Logic Array Blocks (LABs) 1,248 β€”
Embedded RAM 98,304 bits β€”
Embedded Array Blocks (EABs) 12 (typical for this density) β€”
User I/O Pins 470 β€”
Supply Voltage (VCCINT) 2.5 V β€”
Propagation Delay 0.4 ns (per -2 speed grade) 0.4 ns
Operating Temperature 0 C to 70 C (commercial) β€”
Package BGA-600, 45 x 45 mm, 1.27 mm pitch 600-BGA
Logic Family CMOS, SRAM-based β€”
Mounting Type Surface Mount (BGA) β€”
Configuration Method JTAG / ByteBlaster (SRAM configuration) β€”
RoHS Status Compliant (lead-free package) unknown
Product Type β€” Field Programmable Gate Array (FPGA)
Device Family β€” FLEX-10KE
Logic Elements β€” 9,984
Embedded Memory β€” 98,304 bits
Logic Array Blocks β€” 1,248 LABs
I/O Count β€” 470 I/O
Supply Voltage β€” 2.5 V
Technology β€” Mixed CMOS
Commercial Temperature β€” 85 C
Embedded Array β€” Enhanced embedded array
Memory Feature β€” Dual-port memory
Configuration Interface β€” [DATA_NEEDED: configuration interface]
Package Dimensions β€” [DATA_NEEDED: package dimensions]
Operating Current β€” [DATA_NEEDED: operating current]
Pinout β€” [DATA_NEEDED: 600-BGA ball map]
Moisture Sensitivity Level β€” [DATA_NEEDED: MSL level]

Datasheets & Resources

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