EPF10K200EBI600-2 vs EPF10K200EBC600-3 Comparison
Detailed side-by-side comparison of EPF10K200EBI600-2 by Intel and EPF10K200EBC600-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPF10K200EBI600-2 - FLEX 10KE FPGA 200K Gates 9984 LEs BGA-600 | Intel
EPF10K200EBI600-2 ObsoleteIntel
EPF10K200EBC600-3 - 200K Gate FLEX 10KE FPGA, 600-BGA | Intel / Altera
EPF10K200EBC600-3 ObsoleteSpecification Comparison
| Parameter | EPF10K200EBI600-2 | EPF10K200EBC600-3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $198.00 | $575.00 |
| Family | FLEX 10KE | FLEX 10KE |
| System Gates | 200,000 | 200,000 |
| Logic Elements (LEs) | 9,984 | β |
| Logic Array Blocks (LABs) | 1,248 | 1248 |
| Embedded RAM | 98,304 bits | β |
| Embedded Array Blocks (EABs) | 12 (typical for this density) | β |
| User I/O Pins | 470 | β |
| Supply Voltage (VCCINT) | 2.5 V | β |
| Propagation Delay | 0.4 ns (per -2 speed grade) | β |
| Operating Temperature | 0 C to 70 C (commercial) | 0C to +70C (commercial) |
| Package | BGA-600, 45 x 45 mm, 1.27 mm pitch | 600-ball FineLine BGA, 45 x 45 mm |
| Logic Family | CMOS, SRAM-based | β |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Configuration Method | JTAG / ByteBlaster (SRAM configuration) | β |
| RoHS Status | Compliant (lead-free package) | [DATA_NEEDED: RoHS compliance status] |
| Series | β | FLEX-10KE |
| Logic Elements / Cells | β | 9,984 |
| Embedded Memory (EABs) | β | 24,576 bits |
| Maximum User I/O | β | 470 |
| Number of PLLs | β | 4 |
| Core Voltage | β | 2.5 V (2.375 V to 2.625 V) |
| Process Technology | β | 0.22 micrometer SRAM |
| Speed Grade | β | -3 (commercial) |
| JTAG Support | β | Yes (IEEE 1149.1 boundary-scan) |