EPF10K200EBI600-2 vs EPF10K200EGC599-2 Comparison
Detailed side-by-side comparison of EPF10K200EBI600-2 by Intel and EPF10K200EGC599-2 by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPF10K200EBI600-2 - FLEX 10KE FPGA 200K Gates 9984 LEs BGA-600 | Intel
EPF10K200EBI600-2 Obsolete
Specification Comparison
| Parameter | EPF10K200EBI600-2 | EPF10K200EGC599-2 |
|---|---|---|
| Brand | Intel | Altera |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $198.00 | $185.00 |
| Family | FLEX 10KE | FLEX 10KE |
| System Gates | 200,000 | β |
| Logic Elements (LEs) | 9,984 | β |
| Logic Array Blocks (LABs) | 1,248 | β |
| Embedded RAM | 98,304 bits | β |
| Embedded Array Blocks (EABs) | 12 (typical for this density) | β |
| User I/O Pins | 470 | β |
| Supply Voltage (VCCINT) | 2.5 V | β |
| Propagation Delay | 0.4 ns (per -2 speed grade) | β |
| Operating Temperature | 0 C to 70 C (commercial) | β |
| Package | BGA-600, 45 x 45 mm, 1.27 mm pitch | β |
| Logic Family | CMOS, SRAM-based | β |
| Mounting Type | Surface Mount (BGA) | Through Hole |
| Configuration Method | JTAG / ByteBlaster (SRAM configuration) | β |
| RoHS Status | Compliant (lead-free package) | Non-compliant (lead-bearing CPGA) |
| Series | β | FLEX 10KE |
| Logic Elements | β | 9984 |
| Total RAM Bits | β | 98304 |
| Number of I/O | β | 470 |
| Number of Logic Gates | β | 200000 |
| Supply Voltage - Core | β | 2.375 V to 2.625 V |
| Pin-to-Pin Logic Delay | β | 0.6 ns |
| Package / Case | β | 599-BCPGA (62.48 x 62.48 mm) |
| Supplier Device Package | β | 599-CPGA |
| Operating Temperature Grade | β | Commercial |
| Technology / Process | β | CMOS, SRAM-based configuration |
| Programmability Type | β | SRAM (in-system reconfigurable) |
| Configuration Interface | β | JTAG (IEEE 1149.1) / EPC serial |