EPF10K200EBI600-2N vs EPF10K200EBC600-3 Comparison

Detailed side-by-side comparison of EPF10K200EBI600-2N by Intel and EPF10K200EBC600-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EPF10K200EBI600-2N EPF10K200EBI600-2N - 200K Gates FLEX 10KE FPGA | Intel

EPF10K200EBI600-2N - 200K Gates FLEX 10KE FPGA | Intel

EPF10K200EBI600-2N Obsolete

Specification Comparison

Parameter EPF10K200EBI600-2N EPF10K200EBC600-3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $140.00 $575.00
Family FLEX 10KE FLEX 10KE
Typical Gates 200,000 β€”
Maximum System Gates 513,000 β€”
Logic Elements (LEs) 9,984 β€”
Embedded Array Blocks (EABs) 12 β€”
Total RAM Bits 98,304 β€”
User I/O Pins 470 β€”
Dedicated Inputs 6 β€”
Package 600-ball BGA (45 mm x 45 mm, 1.27 mm pitch) 600-ball FineLine BGA, 45 x 45 mm
Technology / Process 0.22 Β΅m CMOS SRAM β€”
Core Supply Voltage 2.5 V (2.3 V to 2.7 V) β€”
I/O Supply Voltage 2.5 V / 3.3 V (5 V tolerant I/O available) β€”
Propagation Delay 0.4 ns to 0.6 ns (per LE) β€”
Maximum Internal Frequency 200 MHz β€”
Operating Temperature 0 Β°C to +70 Β°C (commercial) 0C to +70C (commercial)
Configuration Method SRAM, JTAG (IEEE 1149.1), serial configuration EPROM β€”
MSL Level [DATA_NEEDED: moisture sensitivity level] β€”
RoHS Status [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS compliance status]
Mounting Type Surface Mount (BGA) Surface Mount
Series β€” FLEX-10KE
System Gates β€” 200,000
Logic Elements / Cells β€” 9,984
Logic Array Blocks (LABs) β€” 1248
Embedded Memory (EABs) β€” 24,576 bits
Maximum User I/O β€” 470
Number of PLLs β€” 4
Core Voltage β€” 2.5 V (2.375 V to 2.625 V)
Process Technology β€” 0.22 micrometer SRAM
Speed Grade β€” -3 (commercial)
JTAG Support β€” Yes (IEEE 1149.1 boundary-scan)

Datasheets & Resources

Browse All Products Create BOM Request Quote