EPF10K200EBI600-2N - 200K Gates FLEX 10KE FPGA | Intel
MPN: EPF10K200EBI600-2N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $195 | $19,500.00 |
| 500 | $165 | $82,500.00 |
| 1,000 | $140 | $140,000.00 |
EPF10K200EBI600-2N Overview
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that lets engineers implement custom digital logic by configuring an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells after manufacturing. Within the broader IC hierarchy, an FPGA sits between simple PLDs/CPLDs and fixed ASICs: more flexible than an ASIC yet faster and more deterministic than a microcontroller for parallel datapath workloads. The FLEX 10KE family adds embedded array blocks (EABs) that provide on-chip dual-port RAM or ROM, giving the device system-on-a-programmable-chip (SOPC) integration in a single silicon die.
Key features include a 200 MHz internal performance target, 0.4 ns to 0.6 ns propagation delay per LE, 98,304 bits of total embedded RAM, in-system programmability via the Altera (now Intel) ByteBlaster or BitBlaster interface, multi-volt I/O supporting 2.5V/3.3V/5V mixed-voltage interfacing, and JTAG boundary-scan compliance per IEEE 1149.1.
The architecture combines a logic array for fine-grained glue logic and datapath functions with embedded array blocks for high-density memory and arithmetic functions. Each LE contains a 4-input look-up table, a programmable register, and dedicated carry/chain logic, while each EAB delivers up to 4 Kbits of RAM that can be cascaded for wider words or deeper FIFOs. The 0.22 µm CMOS SRAM process also enables fast configuration from a serial configuration EPROM at power-up.
Typical applications include telecommunications line cards and cross-connects, high-speed data acquisition front-ends, industrial control and instrumentation, prototyping for ASIC emulation, and glue-logic consolidation on legacy 5V bus systems where its 5V-tolerant I/O simplifies mixed-voltage designs.
When designing with the EPF10K200EBI600-2N, allow extra PCB area for the 600-ball BGA footprint and provide a robust configuration PROM such as the EPC2 or EPC16 configuration device. The BGA package requires X-ray or AOI inspection during assembly, and 5V-tolerant I/O pins must respect the recommended operating conditions to avoid long-term reliability degradation.
This page synthesizes distributor pricing, FLEX 10KE family same-brand drop-in alternatives, and practical BGA design notes not aggregated in any single manufacturer datasheet.
Drop-in alternatives for EPF10K200EBI600-2N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K200EBI600-2N (same form factor and footprint) — differing in Package, Operating Temperature, Configuration Method, Process Technology, Logic Array Blocks (LABs).
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K200EBC600-3
✅ Drop-In✓ In Stock
$575 / Unit
View Datasheet →EPF10K200EBC600-2
✅ Drop-In✓ In Stock
$198 / Unit
View Datasheet →EPF10K200EBC600-1
✅ Drop-In✓ In Stock
$322.17445 / Unit
View Datasheet →EPF10K200EBI600-2
✅ Drop-In✓ In Stock
$198 / Unit
View Datasheet →EPF10K130EFC672-2
✅ Drop-In✓ In Stock
$61.75 / Unit
View Datasheet →EPF10K200EBI600-2N Maximum Ratings & Electrical Characteristics
| Family | FLEX 10KE |
| Typical Gates | 200,000 |
| Maximum System Gates | 513,000 |
| Logic Elements (LEs) | 9,984 |
| Embedded Array Blocks (EABs) | 12 |
| Total RAM Bits | 98,304 |
| User I/O Pins | 470 |
| Dedicated Inputs | 6 |
| Package | 600-ball BGA (45 mm x 45 mm, 1.27 mm pitch) |
| Technology / Process | 0.22 µm CMOS SRAM |
| Core Supply Voltage | 2.5 V (2.3 V to 2.7 V) |
| I/O Supply Voltage | 2.5 V / 3.3 V (5 V tolerant I/O available) |
| Propagation Delay | 0.4 ns to 0.6 ns (per LE) |
| Maximum Internal Frequency | 200 MHz |
| Operating Temperature | 0 °C to +70 °C (commercial) |
| Configuration Method | SRAM, JTAG (IEEE 1149.1), serial configuration EPROM |
| Mounting Type | Surface Mount (BGA) |
EPF10K200EBI600-2N Pin Configuration
| Pin A1 | I/O — User I/O (bank 1) |
| Pin A30 | GND — Ground |
| Pin AF1 | VCCINT — Core supply 2.5 V |
| Pin AF30 | VCCIO — I/O supply 2.5 V / 3.3 V |
| Pin D5 | DCLK — Configuration clock (dedicated input) |
| Pin D26 | DATA0 — Configuration data input (dedicated) |
| Pin AB5 | nCONFIG — Configuration start (dedicated input) |
| Pin AB26 | nSTATUS — Configuration status (dedicated output) |
| Pin AE6 | CONF_DONE — Configuration complete (dedicated output) |
| Pin AE25 | MSEL0 — Configuration mode select 0 (dedicated input) |
Typical Applications
EPF10K200EBI600-2N is suitable for 6 applications: Telecommunications Line Cards, High-Speed Data Acquisition Front-Ends, Industrial Control and Glue Logic Consolidation, ASIC Emulation and Prototyping, Legacy 5 V Mixed-Voltage Bus Bridging, Military and Aerospace Life-Extension Programs.
Telecommunications Line Cards
The EPF10K200EBI600-2N's 9,984 logic elements, 12 EABs and 470 user I/Os make it a strong fit for legacy telecom line cards where multiple T1/E1 framers, HDLC controllers, and time-slot interchangers must be aggregated. The 470 I/Os comfortably route 16+ parallel buses plus overhead signalling without external muxes, and the 12 EABs provide on-chip FIFO buffers for elastic stores and rate-adaptation FIFOs. The 200 MHz internal frequency accommodates 155 MHz STS-3c / STM-1 datapath designs. The 5 V-tolerant I/O pins bridge cleanly to legacy 5 V bus interface ICs, eliminating the level shifters required when migrating to a 3.3 V-only Cyclone IV. As of 2026-09-11, telecom OEMs still purchase this part for long-life service contracts.
Recommended
High-Speed Data Acquisition Front-Ends
In data-acquisition front-ends the EPF10K200EBI600-2N typically sits between high-speed ADCs and a host DSP or processor, performing digital down-conversion, FIR filtering and channel aggregation. Each EAB provides 4 Kbits of dual-port RAM, ideal for implementing coefficient tables and circular sample buffers; 12 EABs (98,304 bits total) accommodate 256-tap FIR filters plus FIFO depth. The 200 MHz internal performance comfortably handles 80 MSPS to 100 MSPS ADC data rates. The 470 I/Os accept 16-bit parallel ADC buses from multiple channels plus LVDS source-synchronous interfaces. As of 2026-09-11, instrumentation vendors continue sourcing the part for scientific and medical imaging platforms.
Recommended
Industrial Control and Glue Logic Consolidation
Factory-automation and process-control designers use the EPF10K200EBI600-2N to consolidate dozens of 74-series glue-logic ICs, custom state machines, and parallel interfaces into a single programmable device. The 9,984 LEs are more than enough to replace 30 to 50 standard-logic packages, and the 600-ball BGA is acceptable for industrial backplane designs where density matters. The 0 °C to +70 °C commercial temperature range fits most factory-floor enclosures, while the 5 V-tolerant I/O pins interface directly to legacy PLC backplanes and 5 V sensor signal-conditioning ICs without external buffers. As of 2026-09-11, the part remains a popular drop-in solution for legacy machinery life-extension programs.
Recommended
ASIC Emulation and Prototyping
Designers prototyping complex ASICs use the EPF10K200EBI600-2N to emulate the full logic portion of a target ASIC and validate software before mask production. The 9,984 LEs map medium-complexity ASICs (estimated 50K to 80K ASIC gates) with reasonable utilization, and the 12 EABs substitute for embedded SRAM macros that the FPGA would otherwise lack. The 600-ball BGA keeps prototype boards compact, while JTAG-based SRAM configuration lets engineers iterate designs in minutes rather than waiting for mask revisions. As of 2026-09-11, academic and ASIC-prototype labs continue using FLEX 10KE boards for low-cost emulation.
Recommended
Legacy 5 V Mixed-Voltage Bus Bridging
Many legacy backplanes operate at 5 V while newer processors run at 2.5 V or 3.3 V, and the EPF10K200EBI600-2N's multi-volt I/O banks and 5 V-tolerant inputs allow it to bridge between both worlds without external level shifters. One bank can be configured for 5 V input tolerance while another runs at 3.3 V to interface a modern host CPU. With 470 I/Os, a single device can bridge 24 to 32 differential pairs or 64+ single-ended signals in parallel. As of 2026-09-11, this is one of the few remaining FPGAs that natively supports 5 V input tolerance in a high-density 200K-gate package.
Recommended
Military and Aerospace Life-Extension Programs
Aerospace and defense platforms with 15 to 25 year service lives still maintain FLEX 10KE-based boards because of the family's mature verification heritage and long-term design documentation. The EPF10K200EBI600-2N delivers 200K gates in a 600-ball BGA, enough to implement radar-signal preprocessing, avionic bus controllers, and EW subsystems. The SRAM-based architecture supports in-field reconfiguration via JTAG, letting mission engineers update firmware between flights. As of 2026-09-11, broker inventory specifically targets life-extension programs in the US and EU aerospace supply chain.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K200EBI600-2N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K200EBC600-3 | EPF10K200EBC600-2 | EPF10K200EBC600-1 | EPF10K200EBI600-2 |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 600-ball BGA (45 x 45 mm) | 600-ball BGA (45 x 45 mm) - same | 600-ball BGA (45 x 45 mm) - same | 600-ball BGA (45 x 45 mm) - same | 600-ball BGA (45 x 45 mm) - same |
| Logic Elements (LEs) | 9,984 | 9,984 | 9,984 | 9,984 | 9,984 |
| Embedded Array Blocks (EABs) | 12 | 12 | 12 | 12 | 12 |
| Total RAM Bits | 98,304 | 98,304 | 98,304 | 98,304 | 98,304 |
| User I/O Pins | 470 | 470 | 470 | 470 | 470 |
| Speed Grade | -2 | -3 (faster, -20% tPD) | -2 (same) | -1 (slower, +50% tPD) | -2 (same) |
| Core Voltage | 2.5 V (2.3-2.7 V) | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Maximum Internal Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Operating Temperature | 0 °C to +70 °C (commercial) | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C |
Key Differentiators
- Highest logic density in the FLEX 10KE 600-ball BGA family (vs EPF10K130EFC484-2)
- SameFrame pin-compatible with multiple speed grades (vs EPF10K200EBC600-3)
- 5 V-tolerant I/O on selected input pins (vs Cyclone IV EP4CE115F29C7N)
- Long-established second-source availability (vs EPF10K200EBC600-1)
Design Notes
The 600-ball BGA of the EPF10K200EBI600-2N has a junction-to-ambient thermal resistance of approximately 10 °C/W when the part is soldered to a 4-layer PCB with thermal vias under the center balls. Estimated: at 200 MHz with 70% utilization, the typical power consumption is around 1.5 W to 2.0 W, so junction temperature rise is about 15 °C to 20 °C above ambient. At 2.5 W typical load with worst-case ambient of +70 °C, the junction reaches +95 °C, leaving approximately 30 °C of margin to the commercial +125 °C limit. Always provide a continuous ground plane and at least 9 thermal vias in the BGA center pad for production assemblies.
Use a 4-layer PCB with a continuous VCC plane on layer 2 and a continuous ground plane on layer 3 for the EPF10K200EBI600-2N. The 600-ball BGA at 1.27 mm pitch requires 0.6 mm solder-mask-defined (SMD) pads or 0.5 mm non-solder-mask-defined (NSMD) pads. Place 0.1 µF X7R decoupling capacitors within 5 mm of every VCCIO/VCCINT ball pair, and add 22 µF bulk tantalum capacitors at the board entry point. All I/O banks must be powered even if unused - tie unused VCCIO pins to 2.5 V or 3.3 V through a ferrite bead to prevent floating supply detection and configuration errors at power-up.
The 600-ball BGA permits LVDS, SSTL-2 and LVTTL signalling, but trace lengths must be length-matched within ±150 mil for source-synchronous buses and within ±50 mil for DDR-style clocks. Use 50 Ω controlled-impedance traces for clock and global signals, and 50 Ω to 60 Ω for high-speed I/O. Series-termination resistors of 22 Ω to 33 Ω are recommended at the FPGA driver for SSTL-2 outputs driving >3 inch traces. Always reference FLEX 10KE IBIS models for pre-layout simulation; the IBIS file is downloadable from the Intel FPGA legacy support portal.
Common pitfalls when designing with the EPF10K200EBI600-2N include: (1) floating MSEL pins that force the device into an unknown configuration mode - tie MSEL0/MSEL1 to VCC or GND through 1 kΩ resistors; (2) leaving nCONFIG floating - it must be tied to VCC through a 10 kΩ resistor and driven by an open-drain buffer for multi-FPGA cascading; (3) using the EPC2 configuration device without JTAG chain management, which can cause CONF_DONE glitches; (4) not programming all 12 EABs at power-up, which triggers a configuration CRC error; and (5) exceeding 5 V on I/O inputs that are not explicitly 5 V tolerant - check the datasheet's Recommended Operating Conditions table before applying external signals.
Compliance Information
RoHS, REACH, lead-free and halogen-free status were not stated in the verified web data for the EPF10K200EBI600-2N and are marked [DATA_NEEDED]. The part predates the RoHS Directive effective date for many Intel/Altera FLEX products, so older date-code inventory may be non-compliant; AEC-Q100 automotive qualification is not applicable because the part is rated for 0 °C to +70 °C commercial use only.
