EPF10K200EBI600-2N vs EPF10K200EBI600-2 Comparison

Detailed side-by-side comparison of EPF10K200EBI600-2N by Intel and EPF10K200EBI600-2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EPF10K200EBI600-2N EPF10K200EBI600-2N - 200K Gates FLEX 10KE FPGA | Intel

EPF10K200EBI600-2N - 200K Gates FLEX 10KE FPGA | Intel

EPF10K200EBI600-2N Obsolete

Specification Comparison

Parameter EPF10K200EBI600-2N EPF10K200EBI600-2
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $140.00 $198.00
Family FLEX 10KE FLEX 10KE
Typical Gates 200,000 β€”
Maximum System Gates 513,000 β€”
Logic Elements (LEs) 9,984 9,984
Embedded Array Blocks (EABs) 12 12 (typical for this density)
Total RAM Bits 98,304 β€”
User I/O Pins 470 470
Dedicated Inputs 6 β€”
Package 600-ball BGA (45 mm x 45 mm, 1.27 mm pitch) BGA-600, 45 x 45 mm, 1.27 mm pitch
Technology / Process 0.22 Β΅m CMOS SRAM β€”
Core Supply Voltage 2.5 V (2.3 V to 2.7 V) β€”
I/O Supply Voltage 2.5 V / 3.3 V (5 V tolerant I/O available) β€”
Propagation Delay 0.4 ns to 0.6 ns (per LE) 0.4 ns (per -2 speed grade)
Maximum Internal Frequency 200 MHz β€”
Operating Temperature 0 Β°C to +70 Β°C (commercial) 0 C to 70 C (commercial)
Configuration Method SRAM, JTAG (IEEE 1149.1), serial configuration EPROM JTAG / ByteBlaster (SRAM configuration)
MSL Level [DATA_NEEDED: moisture sensitivity level] β€”
RoHS Status [DATA_NEEDED: RoHS compliance status] Compliant (lead-free package)
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
System Gates β€” 200,000
Logic Array Blocks (LABs) β€” 1,248
Embedded RAM β€” 98,304 bits
Supply Voltage (VCCINT) β€” 2.5 V
Logic Family β€” CMOS, SRAM-based

Datasheets & Resources

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