EPF10K200EFC672-2 vs EPF10K200EFC672-3 Comparison

Detailed side-by-side comparison of EPF10K200EFC672-2 by Intel and EPF10K200EFC672-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K200EFC672-2 EPF10K200EFC672-3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $210.00 $115.00
Family FLEX 10KE β€”
Logic Elements 9,984 β€”
Typical Gates 200,000 β€”
Maximum User I/Os 470 β€”
Embedded Memory 98,304 bits β€”
Embedded Array Blocks (EABs) 12 β€”
Logic Array Blocks (LABs) 624 β€”
Package 672-BBGA (FineLine BGA) β€”
Package Dimensions 45 x 45 mm β€”
Ball Pitch 1.27 mm β€”
Process Technology 0.22 um CMOS 0.22 Β΅m CMOS
Speed Grade -2 β€”
Propagation Delay 0.4 ns 0.4 ns
Operating Temperature 0 C to 70 C 0 Β°C to +70 Β°C (commercial)
Supply Voltage (Core) [DATA_NEEDED: core Vcc] β€”
Programmability JTAG (IEEE 1149.1) / in-system β€”
RoHS Status Compliant (per distributor listing) [DATA_NEEDED: rohs status]
Logic Family CMOS β€”
Series β€” FLEX 10KE
Number of Logic Elements / Cells β€” 9,984
Number of LABs / CLBs β€” 1248
Total RAM Bits β€” 98,304 bits (12 EABs of 8 Kbits)
Number of I/O β€” 470
Number of Gates (typical) β€” 200,000
Supply Voltage - Operating β€” 2.3 V to 2.7 V (2.5 V nominal)
Maximum Operating Frequency β€” 166.67 MHz
Package / Case β€” 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA)
Mounting Type β€” Surface Mount
Configuration Memory β€” SRAM-based (volatile, requires external configuration device)
Number of PLLs β€” 4
MSL Level β€” [DATA_NEEDED: MSL level]
Lead-Free β€” [DATA_NEEDED: lead-free status]

Datasheets & Resources

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