EPF10K200EFC672-3 vs EPF10K200EFC672-2 Comparison

Detailed side-by-side comparison of EPF10K200EFC672-3 by Intel and EPF10K200EFC672-2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K200EFC672-3 EPF10K200EFC672-2
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $115.00 $210.00
Series FLEX 10KE β€”
Number of Logic Elements / Cells 9,984 β€”
Number of LABs / CLBs 1248 β€”
Total RAM Bits 98,304 bits (12 EABs of 8 Kbits) β€”
Number of I/O 470 β€”
Number of Gates (typical) 200,000 β€”
Supply Voltage - Operating 2.3 V to 2.7 V (2.5 V nominal) β€”
Process Technology 0.22 Β΅m CMOS 0.22 um CMOS
Maximum Operating Frequency 166.67 MHz β€”
Propagation Delay 0.4 ns 0.4 ns
Package / Case 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA) β€”
Mounting Type Surface Mount β€”
Operating Temperature 0 Β°C to +70 Β°C (commercial) 0 C to 70 C
Configuration Memory SRAM-based (volatile, requires external configuration device) β€”
Number of PLLs 4 β€”
RoHS Status [DATA_NEEDED: rohs status] Compliant (per distributor listing)
MSL Level [DATA_NEEDED: MSL level] β€”
Lead-Free [DATA_NEEDED: lead-free status] β€”
Family β€” FLEX 10KE
Logic Elements β€” 9,984
Typical Gates β€” 200,000
Maximum User I/Os β€” 470
Embedded Memory β€” 98,304 bits
Embedded Array Blocks (EABs) β€” 12
Logic Array Blocks (LABs) β€” 624
Package β€” 672-BBGA (FineLine BGA)
Package Dimensions β€” 45 x 45 mm
Ball Pitch β€” 1.27 mm
Speed Grade β€” -2
Supply Voltage (Core) β€” [DATA_NEEDED: core Vcc]
Programmability β€” JTAG (IEEE 1149.1) / in-system
Logic Family β€” CMOS

Datasheets & Resources

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