EPF10K200SFC484-1 vs EPF10K130EFC484-3N Comparison

Detailed side-by-side comparison of EPF10K200SFC484-1 by Intel and EPF10K130EFC484-3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K200SFC484-1 EPF10K130EFC484-3N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $162.00 $109.25
Family FLEX 10KS β€”
Logic Cells 9984 β€”
System Gates 200,000 β€”
Embedded RAM Bits 98,304 β€”
Number of LABs/CLBs 1248 832
Number of Logic Elements 9984 β€”
Total RAM Bits 98304 65536
User I/O Count 369 β€”
Number of DLLs 4 β€”
Operating Temperature Range 0C to 70C (commercial) β€”
Core Voltage 2.5 V (2.375 V to 2.625 V) 2.5 V
Process Technology 0.22 um CMOS 0.22 Β΅m CMOS
Internal Operating Frequency 250 MHz β€”
Package 484-ball FBGA (FBGA-484), 23 x 23 mm, 1.0 mm pitch β€”
Mounting Type Surface Mount Surface Mount
Speed Grade -1 (slowest of -1/-2/-3) -3 (faster timing bin)
RoHS Status [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS status]
I/O Standards Supported LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, AGP β€”
Series β€” FLEX-10KE
Number of Logic Elements / Cells β€” 6656
Typical Gate Count β€” 130000
Number of I/O β€” 369
Number of Embedded Array Blocks (EABs) β€” 72
Operating Temperature Grade β€” Commercial (0C to +70C)
Package Type β€” 484-BBGA (FineLine BGA)
Package Dimensions β€” 23 x 23 mm
Ball Pitch β€” 1.0 mm
Configuration Memory β€” SRAM-based (volatile, requires config device)
Configuration Interface β€” JTAG / PS / PPS / Altera serial

Datasheets & Resources

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