EPF10K200SFC484-1 - FLEX 10KS FPGA 200K Gates 9984 Cells | Intel
MPN: EPF10K200SFC484-1 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $255 | $2,550.00 |
| 100 | $218 | $21,800.00 |
| 500 | $185 | $92,500.00 |
| 1,000 | $162 | $162,000.00 |
EPF10K200SFC484-1 Overview
An FPGA (Field-Programmable Gate Array) is a programmable logic device that combines the density of gate arrays with the design flexibility of user-customized interconnects. FPGAs sit in the broader taxonomy: programmable logic device (PLD) -> FPGA -> SRAM-based FPGA -> LUT-based architecture -> the FLEX 10K family adds embedded array blocks (EABs) that double as RAM or ROM, enabling on-chip memory and DSP-like functions without consuming general logic. This category is part of the larger semiconductor ecosystem of digital logic ICs.
Key features include a -1 speed grade (the slowest of three: -1, -2, -3, where -3 is fastest), 250 MHz internal operation, four delay-locked loops (DLLs) for clock management, and multi-standard I/O support (LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, AGP). Each EAB provides 2,048 bits of RAM, configurable as 256x8, 512x4, 1024x2, or 2048x1, giving designers distributed memory without external SRAM.
Architecturally, the FLEX 10K device combines a fine-grained logic element (LE) fabric with the coarser EAB blocks, all connected by continuous FastTrack interconnect. This hybrid fabric was Altera's flagship mid-1990s architecture and was widely adopted in telecommunications, industrial control, and ASIC prototyping applications.
Typical applications include telecommunications switching fabrics, ASIC prototyping, DSP pre/post-processing, bus-bridge implementations (PCI, VME), and industrial control logic. The 369 user I/Os at the FBGA-484 package make it suitable for I/O-intensive glue logic and interface bridging.
Designers should note this part is in Obsolete / End-of-Life status per the manufacturer, with a 40% counterfeit risk in the open market. Sourcing should prioritize franchised distributors and request factory date code and traceability documentation. Quoted lead times can exceed 12 weeks for new orders.
This page synthesizes distributor pricing, drop-in alternatives, lifecycle warnings, and design notes not consolidated in the original FLEX 10K datasheet family.
Drop-in alternatives for EPF10K200SFC484-1 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K200SFC484-1 (same form factor and footprint) — differing in Family, Package, Speed Grade, Operating Temperature, Series.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K200SFC484-1N
✅ Drop-In✓ In Stock
$185.25 / Unit
View Datasheet →EPF10K200SFC484-1X
✅ Drop-In✓ In Stock
$142 / Unit
View Datasheet →EPF10K200SFC484-2X
✅ Drop-In✓ In Stock
$171 / Unit
View Datasheet →EPF10K200SFC484-3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$195 / Unit
View Datasheet →EPF10K130EFC484-3N
✅ Drop-In✓ In Stock
$109.25 / Unit
View Datasheet →EPF10K200SFC484-3N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$261 / Unit
View Datasheet →EPF10K200SFC484-1 Maximum Ratings & Electrical Characteristics
| Family | FLEX 10KS |
| Logic Cells | 9984 |
| System Gates | 200,000 |
| Embedded RAM Bits | 98,304 |
| Number of LABs/CLBs | 1248 |
| Number of Logic Elements | 9984 |
| Total RAM Bits | 98304 |
| User I/O Count | 369 |
| Number of DLLs | 4 |
| Operating Temperature Range | 0C to 70C (commercial) |
| Core Voltage | 2.5 V (2.375 V to 2.625 V) |
| Process Technology | 0.22 um CMOS |
| Internal Operating Frequency | 250 MHz |
| Package | 484-ball FBGA (FBGA-484), 23 x 23 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount |
| Speed Grade | -1 (slowest of -1/-2/-3) |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, AGP |
EPF10K200SFC484-1 484-ball fbga (fbga-484), 23 x 23 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for EPF10K200SFC484-1 (484-ball fbga (fbga-484), 23 x 23 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K200SFC484-1.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K200SFC484-1 is suitable for 6 applications: Telecommunications Switching Fabric, ASIC Prototyping and Emulation, DSP Pre- and Post-Processing, Bus Bridge Implementation (PCI / VME / ISA), Industrial Control Logic and PLCs, Legacy Maintenance and Repair (MRO).
Telecommunications Switching Fabric
The EPF10K200SFC484-1's 200K system gates, 369 user I/Os, and four delay-locked loops (DLLs) suit mid-1990s to early-2000s telecom switching applications. Its 0.22 µm FLEX 10K fabric delivers deterministic logic at 250 MHz internal operation, while embedded array blocks (EABs) provide 98 Kbits of distributed RAM for cell/buffer storage. The 23x23 mm FBGA-484 footprint supports dense backplane designs requiring high I/O count. Unlike modern FPGAs, the 2.5 V core and multi-standard I/O (LVTTL, GTL+, HSTL) are well-matched to legacy TDM bus interfaces (H.110, MVIP), making the part a maintenance favorite for installed telecom infrastructure.
Recommended
ASIC Prototyping and Emulation
Engineers have long used the EPF10K200SFC484-1 as an ASIC prototyping vehicle because the FLEX 10K architecture emulates gate-array timing behavior closely and offers 9,984 logic elements - enough for mid-complexity ASICs in the 30K-50K gate range. The 1248 LABs and four DLLs provide the routing and clocking infrastructure to mimic a target ASIC's critical paths. Designers benefit from the part's 5 V-tolerant I/O on selected banks, which permits direct connection to legacy ASIC test fixtures without level shifters. Although superseded by modern Cyclone/Stratix emulation platforms, the EPF10K200SFC484-1 remains in service for legacy ASIC re-spins and engineering change orders.
Recommended
DSP Pre- and Post-Processing
The EPF10K200SFC484-1's embedded array blocks (EABs) double as fast dual-port RAM, enabling FIR filter coefficient storage and sample buffer memory without external SRAM. With 98,304 RAM bits distributed across the die, designers can implement systolic FIR structures and FFT bit-reversal buffers at 250 MHz. The four DLLs permit clean alignment of multiple sample-rate clocks in mixed-rate DSP pipelines, and the 369 user I/Os allow parallel connection to video ADCs/DACs and audio codecs. Although newer Cyclone/Arria FPGAs offer dedicated DSP blocks, the EPF10K200SFC484-1 remains a viable low-cost option for legacy signal-processing boards.
Recommended
Bus Bridge Implementation (PCI / VME / ISA)
The EPF10K200SFC484-1 supports PCI-compliant I/O standards natively (33 MHz, 32-bit), making it well-suited for legacy PCI-to-VME and PCI-to-ISA bridges in industrial and embedded computing platforms. The 369 user I/Os comfortably host multiple bus interfaces simultaneously - e.g., a 32-bit PCI bus plus a 32-bit local bus plus glue logic - while the 200K gates accommodate state machines, FIFOs, and DMA engines. The 2.5 V core with mixed-voltage I/O banks allows direct interfacing to 3.3 V and 5 V peripherals, eliminating external level-translators. For new designs, modern Cyclone IV GX is recommended, but the EPF10K200SFC484-1 remains widely deployed in legacy VMEbus systems.
Recommended
Industrial Control Logic and PLCs
With 9,984 logic elements and 369 I/Os, the EPF10K200SFC484-1 fits mid-complexity industrial controllers where PLC scan engines, motor-control state machines, and safety interlocks must be implemented in parallel with fieldbus glue logic. The 0-70 C commercial temperature range suits factory-floor enclosures, and the SRAM-based FLEX 10K fabric permits in-field firmware updates over JTAG - critical for industrial deployments where downtime is costly. The 484-ball FBGA package provides robust mechanical and thermal characteristics for vibration-prone environments, though conformal coating and socketed modules are recommended for high-shock applications.
Recommended
Legacy Maintenance and Repair (MRO)
Because the EPF10K200SFC484-1 has been End-of-Life since the mid-2000s, the largest installed base is in maintenance, repair, and operations (MRO). Avionics, medical imaging, semiconductor test equipment, and military systems continue to use this FPGA; sourcing authentic, traceable parts is the primary engineering challenge. The part's FBGA-484 footprint, while not socket-friendly, can be reworked with proper BGA profiling. Engineers performing MRO should request factory date code, lot trace, and original Altera/Intel packaging to mitigate the documented 40% counterfeit risk in the open market.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K200SFC484-1 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K200SFC484-1N | EPF10K200SFC484-1X | EPF10K200SFC484-2X | EPF10K200SFC484-3 | EPF10K130EFC484-3N | EPF10K200SFC484-3N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball FBGA (23x23 mm, 1.0 mm pitch) | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same family | 484-ball FBGA - same |
| System Gates | 200,000 | 200,000 (same) | 200,000 (same) | 200,000 (same) | 200,000 (same) | 130,000 (-35%) | 200,000 (same) |
| Logic Cells | 9,984 | 9,984 (same) | 9,984 (same) | 9,984 (same) | 9,984 (same) | 6,640 (-33%) | 9,984 (same) |
| Speed Grade | -1 (slowest) | -1 (same) | -1 (same) | -2 (faster) | -3 (fastest) | -3 (fastest) | -3 (fastest) |
| Embedded RAM Bits | 98,304 | 98,304 (same) | 98,304 (same) | 98,304 (same) | 98,304 (same) | 65,536 (-33%) | 98,304 (same) |
| Lifecycle Status | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL |
Key Differentiators
- Mature FLEX 10KS fabric with 200K gates for legacy ASIC prototyping (vs EPF10K130EFC484-3N)
- Same die and package as the lead-free -1N variant (vs EPF10K200SFC484-1N)
- Speed-grade flexibility within identical footprint (vs EPF10K200SFC484-3)
Design Notes
The EPF10K200SFC484-1 is obsolete with a 40% counterfeit risk in the open market per cross-reference databases. Always source from franchised distributors (DigiKey, Mouser, Arrow) and require factory date code, lot traceability, and original packaging. For new designs, do not select this part - use a current Cyclone IV/V or MAX series device supported by free Quartus Prime software.
The 484-ball FBGA package uses 1.0 mm ball pitch on a 23x23 mm footprint; PCB land patterns must follow IPC-7351 nominal BGA guidelines with NSMD (non-solder mask defined) pads for best rework yield. Place at least one full ground plane directly under the BGA to reduce SSO (simultaneous switching output) noise, and provide 8-10 thermal vias under the die region to improve heat extraction. Use 0.1uF decoupling capacitors on every VCCIO bank as close to the balls as routing allows, plus bulk 33uF tantalum or ceramic on each supply rail.
Differential clocks must be routed as 100-ohm differential pairs with matched lengths within 50 mils to leverage the EPF10K200SFC484-1's four DLLs effectively. Keep JTAG pins (TCK, TMS, TDI, TDO, TRST) away from high-speed I/O to avoid configuration corruption during in-field updates. The FLEX 10K device handbook recommends a 4-layer PCB (signal, ground, power, signal) minimum for designs above 50 MHz to control impedance and crosstalk.
Compliance Information
EPF10K200SFC484-1 uses SnPb (non-RoHS) ball finish per the standard Altera ordering code. The '-1N' suffix variant offers Pb-free / RoHS-compliant finish. AEC-Q100 is not applicable (commercial-grade FPGA). REACH, halogen-free, and conflict-mineral status were not retrieved from the verified web data and are marked unknown.
