EPF10K200SFC484-1 vs EPF10K200SFC484-3 Comparison

Detailed side-by-side comparison of EPF10K200SFC484-1 by Intel and EPF10K200SFC484-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K200SFC484-1 EPF10K200SFC484-3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $162.00 $195.00
Family FLEX 10KS FLEX 10K
Logic Cells 9984 9,984
System Gates 200,000 200,000
Embedded RAM Bits 98,304 β€”
Number of LABs/CLBs 1248 β€”
Number of Logic Elements 9984 β€”
Total RAM Bits 98304 β€”
User I/O Count 369 β€”
Number of DLLs 4 β€”
Operating Temperature Range 0C to 70C (commercial) β€”
Core Voltage 2.5 V (2.375 V to 2.625 V) 2.375 V to 2.625 V
Process Technology 0.22 um CMOS 0.22 Β΅m CMOS SRAM
Internal Operating Frequency 250 MHz β€”
Package 484-ball FBGA (FBGA-484), 23 x 23 mm, 1.0 mm pitch 484-Ball FineLine BGA (PBGA484)
Mounting Type Surface Mount Surface Mount
Speed Grade -1 (slowest of -1/-2/-3) β€”
RoHS Status [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS status]
I/O Standards Supported LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, AGP β€”
Series β€” FLEX-10KS
Logic Array Blocks (LABs) β€” 1,248
User I/O Pins β€” 369
Maximum Internal Frequency β€” 166.67 MHz
Embedded Memory (RAM bits) β€” 40,960 (via EABs)
Global Clock Networks β€” 4
Package Dimensions β€” 23 mm Γ— 23 mm, 1.0 mm pitch
Operating Temperature β€” 0 Β°C to +70 Β°C (Commercial)
Configuration Method β€” SRAM, JTAG, EPC2 PROM
I/O Standards β€” 3.3 V LVTTL/LVCMOS, 5.0 V PCI
Status β€” Obsolete (last shipped 2007-2010, available via brokers)

Datasheets & Resources

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