EPF10K200SFI672-2 vs EPF10K200EFC672-3 Comparison

Detailed side-by-side comparison of EPF10K200SFI672-2 by Intel and EPF10K200EFC672-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K200SFI672-2 EPF10K200EFC672-3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $99.50 $115.00
Family FLEX 10KE β€”
Logic Elements 9984 β€”
System Gates 200000 β€”
Logic Array Blocks (LABs) 1248 β€”
User I/Os 470 β€”
Embedded Array Blocks (EABs) 24 β€”
Embedded Memory (EAB SRAM) 96 Kbit β€”
Distributed Memory 98304 bits β€”
Process Technology 0.22 Β΅m (Arrow lists 0.42 Β΅m) 0.22 Β΅m CMOS
Core Supply Voltage 2.5 V β€”
Package 672-pin FineLine BGA (FBGA) β€”
Speed Grade -2 β€”
Operating Temperature Industrial (-40C to +85C) 0 Β°C to +70 Β°C (commercial)
JTAG Boundary Scan IEEE Std. 1149.1-1990 compliant β€”
PCI Compliance PCI Local Bus Specification Rev 2.2 (3.3 V, 33/66 MHz) on -1 speed grade β€”
Programming SRAM-based, in-system programmable β€”
RoHS Status Not compliant (per Arrow EU RoHS listing) [DATA_NEEDED: rohs status]
Series β€” FLEX 10KE
Number of Logic Elements / Cells β€” 9,984
Number of LABs / CLBs β€” 1248
Total RAM Bits β€” 98,304 bits (12 EABs of 8 Kbits)
Number of I/O β€” 470
Number of Gates (typical) β€” 200,000
Supply Voltage - Operating β€” 2.3 V to 2.7 V (2.5 V nominal)
Maximum Operating Frequency β€” 166.67 MHz
Propagation Delay β€” 0.4 ns
Package / Case β€” 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA)
Mounting Type β€” Surface Mount
Configuration Memory β€” SRAM-based (volatile, requires external configuration device)
Number of PLLs β€” 4
MSL Level β€” [DATA_NEEDED: MSL level]
Lead-Free β€” [DATA_NEEDED: lead-free status]

Datasheets & Resources

Browse All Products Create BOM Request Quote