EPF10K200SFI672-2 - FLEX 10KE FPGA 200K Gates 672-BBGA | Intel
MPN: EPF10K200SFI672-2 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132.5 | $1,325.00 |
| 100 | $119 | $11,900.00 |
| 500 | $108.75 | $54,375.00 |
| 1,000 | $99.5 | $99,500.00 |
EPF10K200SFI672-2 Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that engineers can reconfigure after manufacturing to implement custom digital logic, glue logic, or complete system-on-chip prototypes. The FLEX 10KE family extends the original FLEX 10K architecture by adding embedded array blocks (EABs) that double as synchronous SRAM, making it a hybrid logic-plus-memory fabric rather than a pure logic device.
Key features of the EPF10K200SFI672-2 include 470 user I/Os, 1248 Logic Array Blocks (LABs), 24 Embedded Array Blocks (EABs) providing 96 Kbit of total embedded SRAM, and built-in Joint Test Action Group (JTAG) boundary-scan test circuitry compliant with IEEE Std. 1149.1-1990. The device integrates 98,304 bits of distributed memory and supports in-system programmability via the Altera MAX+PLUS II or Quartus design tools through EDIF 2 0 0 / 3 0 0, LPM, VHDL, and Verilog HDL interfaces.
The FLEX 10KE architecture combines a fine-grained logic fabric with row/column interconnects and column-based I/O structures that interface to off-chip signals at multiple I/O standards (LVTTL, LVCMOS, PCI, GTL). The -2 speed grade denotes a mid-tier performance bin within the FLEX 10KE family, trading off maximum toggle frequency versus cost. The 672-pin FBGA package uses the FineLine BGA pitch for high-density board mounting with controlled-impedance signal integrity.
Typical applications include telecommunications line cards, industrial control glue logic, PCI bus interfaces, and legacy digital signal processing glue layers in telecom and instrumentation chassis. The embedded EABs simplify FIFO, dual-port RAM, and ROM substitution tasks. The wide I/O count also suits parallel bus bridging between microprocessors and ASICs. The legacy FLEX 10KE family has been an Altera workhorse for 32-bit PCI designs since the late 1990s.
When designing with this part, verify that your Quartus / MAX+PLUS II toolchain still supports the FLEX 10KE device family because Intel has migrated its development tools to newer device families. Plan for end-of-life (EOL) risk because this part is reported as obsolete by major distributors. Confirm lead time and last-time-buy windows before committing to a new design.
This page synthesizes distributor pricing, drop-in alternatives from the FLEX 10K/10KE family, and practical design notes for engineers maintaining legacy FLEX 10KE designs or planning last-time-buys.
Drop-in alternatives for EPF10K200SFI672-2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K200SFI672-2 (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, RoHS Status, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K200SFC672-2
✅ Drop-In✓ In Stock
$320 / Unit
View Datasheet →EPF10K200SFC672-1X
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$135 / Unit
View Datasheet →EPF10K200SFC672-1
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$138.75 / Unit
View Datasheet →EPF10K200EFC672-2
✅ Drop-In✓ In Stock
$210 / Unit
View Datasheet →EPF10K200EFC672-1
✅ Drop-In✓ In Stock
$198 / Unit
View Datasheet →EPF10K200EFC672-3
✅ Drop-In✓ In Stock
$115 / Unit
View Datasheet →EPF10K200SFI672-2 Maximum Ratings & Electrical Characteristics
| Family | FLEX 10KE |
| Logic Elements | 9984 |
| System Gates | 200000 |
| Logic Array Blocks (LABs) | 1248 |
| User I/Os | 470 |
| Embedded Array Blocks (EABs) | 24 |
| Embedded Memory (EAB SRAM) | 96 Kbit |
| Distributed Memory | 98304 bits |
| Process Technology | 0.22 µm (Arrow lists 0.42 µm) |
| Core Supply Voltage | 2.5 V |
| Package | 672-pin FineLine BGA (FBGA) |
| Speed Grade | -2 |
| Operating Temperature | Industrial (-40C to +85C) |
| JTAG Boundary Scan | IEEE Std. 1149.1-1990 compliant |
| PCI Compliance | PCI Local Bus Specification Rev 2.2 (3.3 V, 33/66 MHz) on -1 speed grade |
| Programming | SRAM-based, in-system programmable |
| RoHS Status | Not compliant (per Arrow EU RoHS listing) |
EPF10K200SFI672-2 672-pin fineline bga (fbga) Pin Configuration Guide
Pin configuration for EPF10K200SFI672-2 (672-pin fineline bga (fbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K200SFI672-2.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K200SFI672-2 is suitable for 6 applications: PCI Bus Interface Card, Telecom Line Card Glue Logic, Industrial Control PLC Backplane, Test and Measurement Instrumentation, Legacy ASIC Prototyping, Medical Imaging Signal Pipeline.
PCI Bus Interface Card
The EPF10K200SFI672-2 is well-suited to legacy 32-bit PCI adapter cards because its -1 speed grade variant supports PCI Local Bus Specification Revision 2.2 at 3.3 V / 33 MHz and 5.0 V operation. With 470 user I/Os and 200K system gates, the device can absorb the PCI target or master state machine plus DMA, interrupt, and configuration register logic in a single chip. The 1248 LABs provide ample capacity for FIFOs bridging between PCI and local buses, and the 24 EABs (96 Kbit total) implement scatter-gather descriptor tables without external SRAM. Compared with newer Cyclone devices, the FLEX 10KE keeps pin-compatibility with hundreds of deployed PCI designs in telecom and industrial backplanes, easing maintenance of installed bases.
Recommended
Telecom Line Card Glue Logic
In telecom line-card and channel-bank chassis the EPF10K200SFI672-2 historically bridged TDM time-slot interconnects between framers, LIUs, and network processors. The 200K system gates and 470 I/Os accommodate multi-port TDM buses, HDLC controllers, and alarm/status aggregation logic that legacy ASICs would have absorbed. The 24 EABs (96 Kbit) implement elastic stores and small lookup tables, while JTAG IEEE 1149.1 boundary scan simplifies board-level test in high-density backplanes. Industrial -40C to +85C temperature range ensures operation in controlled-environment central offices. Engineers maintaining T1/E1, T3/E3, or early-ATM line cards continue to specify this part because the FLEX 10KE pinout matches existing layout files.
Recommended
Industrial Control PLC Backplane
Factory automation PLCs and motor-drive controllers used the EPF10K200SFI672-2 as a configurable glue layer between microcontrollers, encoder counters, and fieldbus transceivers. The 470 I/Os handle 24 V-tolerant signaling through external resistor networks, while the 1248 LABs implement PWM generators, quadrature decoders, and safety-interlock state machines. Industrial -40C to +85C operation tolerates cabinet temperatures without derating. The 96 Kbit of EAB SRAM provides lookup tables for PID coefficients and S-curve profiles. Long-term availability through distributors' obsolete stock and Altera legacy support makes this device a continuing choice for factory-floor retrofits where PCB redesign cost dominates BOM savings.
Recommended
Test and Measurement Instrumentation
Bench-top instruments such as logic analyzers, protocol testers, and arbitrary waveform generators relied on the EPF10K200SFI672-2 to implement deep trigger sequencers, pattern generators, and timing engines. The 9,984 logic elements allow multi-state trigger machines with hundreds of sequence steps, while the 96 Kbit EAB SRAM stores pre-computed stimulus patterns. The 470 I/Os drive multiple channel buffers and acquisition paths in parallel, reducing component count versus discrete TTL designs. The fine-grain logic fabric supports high toggle rates for timing-critical paths. The JTAG boundary scan assists factory-test coverage on dense instrument PCBs, and the SRAM-based programmability lets manufacturers ship firmware updates without re-spinning the board.
Recommended
Legacy ASIC Prototyping
Pre-silicon ASIC prototyping used the EPF10K200SFI672-2 as a hardware emulator because its 200K system gates approximated mid-complexity ASICs and the FLEX 10KE architecture supported multi-clock-domain designs. Engineers mapped RTL into the 1248 LABs and 24 EABs, validated system timing at the -2 speed grade, and refined firmware before committing to mask sets. The 470 I/Os exposed internal ASIC buses to logic analyzers and pattern generators. SRAM-based programmability enabled rapid RTL revisions within hours. Although newer Cyclone V or Cyclone 10 devices offer far higher logic density, FLEX 10KE retains a role in maintaining field-deployed prototypes and pre-production hardware.
Recommended
Medical Imaging Signal Pipeline
Ultrasound and patient-monitoring front-ends used the EPF10K200SFI672-2 to implement beamformers, FIR filters, and timing controllers ahead of the host CPU. The 24 EABs deliver 96 Kbit of synchronous SRAM for coefficient storage in adaptive beamforming, and the 9,984 logic elements implement 32-tap FIR channels at clinical sample rates. Industrial -40C to +85C operation handles the thermal envelope of fan-less medical chassis. JTAG IEEE 1149.1 boundary scan accelerates manufacturing test of densely populated imaging boards. The PCI-compliant -1 speed grade variant eases integration into legacy PCI-based ultrasound back-ends, preserving OEM service inventory and field-replacement procedures.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K200SFI672-2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K200SFC672-2 | EPF10K200SFC672-1X | EPF10K200SFC672-1 | EPF10K200EFC672-2 | EPF10K200EFC672-1 | EPF10K200EFC672-3 |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-FBGA (FineLine BGA) | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same |
| Speed Grade | -2 | -2 | -1 | -1 | -2 | -1 | -3 |
| Temperature Range | Industrial -40C to +85C | Commercial 0C to +70C | Commercial 0C to +70C | Commercial 0C to +70C | Commercial 0C to +70C | Commercial 0C to +70C | Commercial 0C to +70C |
| Logic Elements | 9984 | 9984 | 9984 | 9984 | 9984 | 9984 | 9984 |
| User I/Os | 470 | 470 | 470 | 470 | 470 | 470 | 470 |
| Embedded Memory | 96 Kbit (24 EABs) | 96 Kbit | 96 Kbit | 96 Kbit | 96 Kbit | 96 Kbit | 96 Kbit |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Industrial temperature range in 672-FBGA (vs EPF10K200SFC672-2)
- Higher performance speed grade available in same package (vs EPF10K200EFC672-1)
- Same-family density and embedded memory block count (vs EPF10K200SFC672-1)
Design Notes
The FLEX 10KE family is end-of-life per the verified Arrow listing dated 2026-09-11. New designs should migrate to a Cyclone series device (Cyclone IV or Cyclone 10) because Quartus II legacy support for FLEX 10KE is constrained to older Quartus versions that may not be compatible with modern host operating systems. For maintenance of installed systems, qualify second-source obsolete-stock distributors and lock in a last-time-buy commitment now.
The 672-pin FineLine BGA uses a 1.0 mm ball pitch per the Altera FLEX 10KE datasheet. PCB layout requires microvia or 0.4 mm laser-drilled via-in-pad technology for the inner rows; standard 0.6 mm mechanical vias may be used for the outer two rows. Apply a 4 or 6-layer stackup with continuous ground planes under the BGA to control impedance for the 470 user I/O signals, and escape the inner balls through dog-bone fanouts with matched length tuning on DDR/PCI byte lanes.
Estimated: at 100% logic utilization toggling at 100 MHz with 2.5 V core, the FLEX 10KE 200K device dissipates approximately 1.5 to 2.0 W typical. The 672-FBGA package has a theta_JA around 12-15 C/W on a standard JEDEC 4-layer test board with no airflow, so junction-to-ambient temperature rise is roughly 18-30 C. For sealed industrial enclosures, derate clock frequency or reduce toggle activity to keep Tj below 125 C; consult the FLEX 10KE datasheet DC Characteristics section for exact ICC numbers per configuration bitstream.
The EPF10K200SFI672-2 supports multi-standard I/O including LVTTL, LVCMOS, PCI, and GTL. Per the FLEX 10KE datasheet, configure each I/O bank for the correct VCCIO supply (3.3 V for PCI/LVTTL, 2.5 V for GTL+) before generating the configuration bitstream. Drive unused I/O banks to logic-low through internal pull-downs to prevent floating input oscillations that increase ICC and inject noise into adjacent analog blocks.
Compliance Information
EU RoHS not compliant per verified Arrow listing dated 2026-09-11. REACH, halogen-free, and conflict-mineral status were not provided in the verified web data. AEC-Q100 not applicable because this is a commercial/industrial FPGA, not an automotive-grade IC.
