EPF10K250EFC672-3 vs EPF10K200EFC672-3 Comparison
Detailed side-by-side comparison of EPF10K250EFC672-3 by Intel and EPF10K200EFC672-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPF10K200EFC672-3 - FLEX 10KE FPGA 9984 Cells 470 I/O BGA-672 | Intel
EPF10K200EFC672-3 ObsoleteSpecification Comparison
| Parameter | EPF10K250EFC672-3 | EPF10K200EFC672-3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $99.50 | $115.00 |
| Product Type | FPGA (Field Programmable Gate Array) | β |
| Family | FLEX 10KE | β |
| Maximum Typical Gates | 250,000 | β |
| Logic Elements (LEs) | 12,160 | β |
| Embedded Memory (EAB) | 655,360 bits (80 EABs x 2,048 bits each) | β |
| Logic Array Blocks (LABs) | 392 (8 LEs per LAB) | β |
| User I/O Pins | 470 | β |
| Core Supply Voltage | 2.5 V | β |
| I/O Supply Voltage | MultiVolt: 1.5 V / 1.8 V / 2.5 V / 3.3 V | β |
| Speed Grade | -3 (fastest) | β |
| Temperature Grade | Commercial (0C to +70C) | β |
| Package | 672-ball FineLine BGA (FC) | β |
| Ball Pitch | 1.0 mm | β |
| Configuration Mode | JTAG (IEEE 1149.1) ISP / serial / parallel, external EPCx PROM | β |
| Process Technology | 0.25 um CMOS, 5-layer metal | 0.22 Β΅m CMOS |
| Mounting Type | Surface Mount | Surface Mount |
| RoHS Status | [DATA_NEEDED: RoHS status - 672-FBGA part is non-RoHS per Fly-Wing listing] | [DATA_NEEDED: rohs status] |
| Lead-Free | [DATA_NEEDED: lead-free status] | [DATA_NEEDED: lead-free status] |
| Series | β | FLEX 10KE |
| Number of Logic Elements / Cells | β | 9,984 |
| Number of LABs / CLBs | β | 1248 |
| Total RAM Bits | β | 98,304 bits (12 EABs of 8 Kbits) |
| Number of I/O | β | 470 |
| Number of Gates (typical) | β | 200,000 |
| Supply Voltage - Operating | β | 2.3 V to 2.7 V (2.5 V nominal) |
| Maximum Operating Frequency | β | 166.67 MHz |
| Propagation Delay | β | 0.4 ns |
| Package / Case | β | 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA) |
| Operating Temperature | β | 0 Β°C to +70 Β°C (commercial) |
| Configuration Memory | β | SRAM-based (volatile, requires external configuration device) |
| Number of PLLs | β | 4 |
| MSL Level | β | [DATA_NEEDED: MSL level] |