10AX115N4F40I3SG - Arria 10 GX 1150K LE FPGA | Intel | 1517-FCBGA
MPN: 10AX115N4F40I3SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4850 | $4,850.00 |
| 10 | $4550 | $45,500.00 |
| 100 | $4180 | $418,000.00 |
| 500 | $3820 | $1,910,000.00 |
| 1,000 | $3500 | $3,500,000.00 |
Drop-in alternatives for 10AX115N4F40I3SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →10AX115N4F40I3SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 |
| Embedded Memory Bits | 68,857,856 |
| Maximum User I/O | 600 |
| Maximum Transceiver Data Rate | 17.4 Gbps |
| Process Node | 20 nm |
| Package | 1517-BBGA, FCBGA (F40), 40 x 40 mm, 1.00 mm pitch |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature | -40C to +100C (Industrial) |
| Configuration | Serial, Parallel, and Avalon-ST supported |
| MSL Level | 3 (per JEDEC J-STD-020) |
| RoHS Status | Compliant |
| Hardened IP | PCIe Gen3, 100G Ethernet MAC (per Quartus IP library) |
| Device Family Position | Mid-range 20 nm transceiver FPGA |
10AX115N4F40I3SG 1517-bbga, fcbga (f40), 40 x 40 mm, 1.00 mm pitch Pin Configuration Guide
Complete pinout information for 10AX115N4F40I3SG (1517-bbga, fcbga (f40), 40 x 40 mm, 1.00 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX115N4F40I3SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX115N4F40I3SG is suitable for 6 applications: 100G Ethernet MAC and Framer, Broadcast Video Processing 4K/8K, Radar and Electronic Warfare Baseband, PCIe Gen3 Endpoint Card, 5G Baseband Processing, High-Speed Test and Measurement.
100G Ethernet MAC and Framer
The 10AX115N4F40I3SG's 1,150,000 logic elements and up to 17.4 Gbps transceivers make it ideal for 100G Ethernet MAC, framer, and PCS implementations in carrier-grade line cards. With 600 user I/O pins available on the F40 FCBGA package, the device can drive multiple QSFP28 cages through on-chip SERDES, while hardened PCIe Gen3 IP blocks enable direct attachment to host processors without external bridge chips. The industrial temperature grade supports outdoor deployments in central offices, mobile backhaul aggregation nodes, and data-center top-of-rack switches. Estimated resource utilization for a 100G MAC with OTN framing typically consumes approximately 250K LE and 150 transceivers, leaving substantial headroom for additional features such as FEC, QoS classification, and traffic management.
Recommended
Broadcast Video Processing 4K/8K
The 10AX115N4F40I3SG delivers the DSP block density and high-bandwidth transceiver capability required for 4K and 8K video processing applications such as real-time HEVC/H.265 encoding, multi-stream transcoding, and broadcast IP-to-SDI gateway cards. The Arria 10 hard floating-point DSP blocks accelerate transform and motion-estimation kernels, while on-chip SRAM (68 Mbits) buffers compressed video frames for low-latency processing. The 600 user I/O pins support multiple 12G-SDI receive/transmit chains plus 100G Ethernet egress, enabling single-board designs that previously required multiple FPGAs. Typical power consumption for a 4-channel 4K HEVC encoder is around 30 W, well within the Arria 10 power envelope.
Recommended
Radar and Electronic Warfare Baseband
Defense and aerospace platforms leverage the 10AX115N4F40I3SG's industrial temperature range (-40C to +100C junction) and high DSP throughput for radar baseband processing, electronic countermeasures (ECM), and signals intelligence (SIGINT) systems. The 20 nm process provides favorable performance-per-watt for SWaP-constrained platforms, while hardened floating-point DSP blocks accelerate FFT, pulse compression, and digital beamforming kernels. The 1517-FCBGA F40 package supports high-density PCB designs with controlled-impedance signal traces for RF sampling ADCs/DACs at multi-GSPS rates. A typical phased-array radar beamforming design uses approximately 400K LE for 64-element array processing, leaving headroom for adaptive nulling and tracking algorithms.
Recommended
PCIe Gen3 Endpoint Card
The 10AX115N4F40I3SG's hardened PCIe Gen3 IP block enables single-chip endpoint implementations for FPGA-based accelerator cards in servers and high-performance computing platforms. With PCIe Gen3 x8 supporting approximately 8 GB/s host-to-FPGA bandwidth, the device can host DSP, machine learning inference, network processing, or storage offload workloads. The Arria 10's 600 user I/O and 17.4 Gbps transceivers support DDR4 external memory (up to 2666 Mbps), QSFP28 networking, and high-speed expansion connectors. A typical PCIe Gen3 x8 accelerator design consumes approximately 600K LE and operates at 20-25 W core power, suitable for passive or low-airflow server slots.
Recommended
5G Baseband Processing
Mobile network infrastructure including 5G NR baseband units, fronthaul gateways, and small-cell base stations leverage the 10AX115N4F40I3SG for PHY-layer processing, LDPC/Polar encoding, and massive-MIMO beamforming. The high DSP count accelerates FFT/iFFT and channel coding kernels required for sub-6 GHz and mmWave fronthaul interface implementations (eCPRI, ORAN). The industrial temperature grade supports outdoor cabinet deployments at cell tower base stations. The 600 user I/O enable multiple radio units (RUs) to be connected over CPRI or eCPRI, with on-chip SERDES supporting up to 17.4 Gbps per link.
Recommended
High-Speed Test and Measurement
Test and measurement instrumentation such as oscilloscopes, logic analyzers, BERT (bit-error-rate testers), and protocol analyzers leverage the 10AX115N4F40I3SG for high-speed signal acquisition, pattern generation, and protocol decoding. The high transceiver count and 17.4 Gbps per-channel capability enable 100G+ test heads for production-line qualification of networking equipment. Hardened floating-point DSP blocks accelerate FFT and statistical analysis on captured waveforms, while on-chip SRAM (68 Mbits) buffers deep acquisition traces. Industrial temperature grade supports laboratory, production-floor, and field-test environments without derating.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115N4F40I3SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115N4F40I3LG | 10AX115N4F40E3LG | 10AX115N3F40I2SG | 10AX115N2F40I2SG | 10AX115N3F45I2SG | 10AX115R4F40I3SG |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-FCBGA (F40) 40x40 mm | 1517-FCBGA (F40) 40x40 mm - same | 1517-FCBGA (F40) 40x40 mm - same | 1517-FCBGA (F40) 40x40 mm - same | 1517-FCBGA (F40) 40x40 mm - same | 1517-FCBGA (F45) 45x45 mm - larger | 1517-FCBGA (F40) 40x40 mm - same |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Speed Grade | -3 (fastest) | -3 (same) | -3 (same) | -2 (slower) | -2 (slower) | -2 (slower) | -3 (same) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (same) | Extended (wider range) | Industrial (same) | Industrial (same) | Industrial (same) | Industrial (same) |
| Transceiver Max Rate | 17.4 Gbps (Arria 10 GX) | 17.4 Gbps (same) | 17.4 Gbps (same) | 17.4 Gbps (same) | 17.4 Gbps (same) | 17.4 Gbps (same) | 28.05 Gbps (+61%) |
| Embedded Memory (Mbits) | 68 | 68 (same) | 68 (same) | 68 (same) | 68 (same) | 68 (same) | 68 (same) |
| Maximum User I/O | 600 | 600 (same) | 600 (same) | 600 (same) | 600 (same) | 600 (same) | 600 (same) |
| Pb-Free / RoHS | RoHS compliant (SG suffix) | Pb-free (LG suffix) | Pb-free (LG suffix) | RoHS (same) | RoHS (same) | RoHS (same) | RoHS (same) |
| Approximate Unit Price (USD, qty-1) | $4,850 | $4,850 (same) | $5,200 (extended temp premium) | $3,950 (-19%) | $3,750 (-23%) | $4,100 (-15%) | $5,800 (+20%, GT premium) |
Key Differentiators
- Hardened PCIe Gen3 IP eliminates external bridge chip cost (vs Xilinx XCKU060 Kintex UltraScale)
- Industrial temperature grade availability across the speed grade range (vs 10AX115R4F40I3SG (Arria 10 GT))
- Mature Quartus Prime toolchain with hardened floating-point DSP blocks (vs Generic mid-range FPGAs)
Design Notes
Estimated: The 1517-BGA at 1.00 mm pitch requires 8-12 PCB layers with stacked microvia (HDI) technology for breakout. Use 0.20 mm via-pad with 0.40 mm antipad on inner layers; signal traces on outer layers should be 100 um width with controlled 100 ohm differential impedance for SERDES lanes. Continuous GND planes beneath the BGA are critical for power delivery and return path. Intel's Arria 10 PCB Design Guidelines document specifies minimum via-in-pad plating thickness of 20 um copper.
Estimated: At typical 25 W power dissipation in a 40 x 40 mm F40 FCBGA, junction-to-ambient thermal resistance (theta_JA) is approximately 8 C/W with 25 CFM airflow and 1.0 mm PCB thickness. Maximum junction temperature for industrial grade is 100 C, allowing ambient operation up to 75 C with adequate airflow. Mounting the device with a heat spreader or thermal interface material to a chassis wall enables passive cooling for low-power configurations under 15 W.
Common pitfalls for 10AX115N4F40I3SG designs: (1) Do not use a non-BGA-compatible PCB stack-up; the 1.00 mm pitch requires laser-drilled vias. (2) Always include JTAG chain connectivity even in production - field upgrades require it. (3) Be careful with multi-vendor SERDES IP selection - Intel hard SERDES require custom analog calibration sequences that differ from soft IP. (4) The configuration scheme (passive serial, Avalon-ST, JTAG) must match the chosen boot PROM selection.
Estimated: Route high-speed SERDES lanes as 100 ohm differential pairs with intra-pair skew below 5 ps and inter-pair skew below 50 ps. Reference clock traces must be length-matched to within 25 mil of corresponding SERDES lanes. Place the configuration EEPROM within 2 inches of the FPGA's configuration pins to minimize boot-time signal integrity issues. Use Intel's pin connection guidelines document for proper pull-up and pull-down resistor recommendations on all configuration and JTAG pins.
Compliance Information
RoHS compliant per Intel product page (SG suffix). Industrial temperature grade per JEDEC. AEC-Q100 not applicable (FPGA, not automotive standard logic). Confirm halogen-free status with Intel datasheet as it is not explicitly listed in the provided data.
