10AX115U2F45E1SG - Arria 10 GX FPGA 1.15M LE | Intel
MPN: 10AX115U2F45E1SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18500 | $18,500.00 |
| 10 | $17200 | $172,000.00 |
| 25 | $16450 | $411,250.00 |
| 100 | $14800 | $1,480,000.00 |
| 250 | $13900 | $3,475,000.00 |
Drop-in alternatives for 10AX115U2F45E1SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX115U2F45I1SG
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →10AX115U1F45E1SG
✅ Drop-In✓ In Stock
$5680 / Unit
View Datasheet →10AX115U2F45E2SG
✅ Drop-In✓ In Stock
$6920.66 / Unit
View Datasheet →10AX115N2F45E1SG
✅ Drop-In✓ In Stock
$6240 / Unit
View Datasheet →10AX090U2F45E1SG
✅ Drop-In✓ In Stock
$5895 / Unit
View Datasheet →10AX115S2F45E2SG
✅ Drop-In✓ In Stock
$6975.76 / Unit
View Datasheet →10AX115U2F45E1SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory (bits) | 68,857,600 |
| Embedded Memory (Mbits) | 68.86 Mbit |
| 18x18 Multipliers | 1,518 |
| User I/O Pins | 480 |
| Transceiver Channels | 24 |
| Max Transceiver Data Rate | 17.4 Gbps (chip-to-chip/backplane) |
| Hard Memory Controllers | 6 (DDR4/DDR3/QDRII+/RLDRAM3) |
| PCIe Hard IP | PCIe Gen3 x8 |
| Process Node | TSMC 20 nm |
| Core Voltage | 0.9 V |
| Package | 1932-ball FCBGA, 45 x 45 mm, 1.0 mm pitch |
| Grade | E1 (extended industrial, -40C to +100C) |
| RoHS Status | Compliant |
10AX115U2F45E1SG 1932-ball fcbga, 45 x 45 mm, 1.0 mm pitch Pin Configuration Guide
Complete pinout information for 10AX115U2F45E1SG (1932-ball fcbga, 45 x 45 mm, 1.0 mm pitch package) with 480 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX115U2F45E1SG.
Refer to the datasheet for full pin configuration.
Estimated pin count: 480 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX115U2F45E1SG is suitable for 6 applications: 4K/8K Broadcast Video Processing, 100G Ethernet Aggregation Switch Fabric, PCIe Gen3 x8 Acceleration Card, Radar and EW Digital Signal Processing, Software Defined Radio (SDR) Prototyping, Medical Imaging Reconstruction (CT/MRI).
4K/8K Broadcast Video Processing
The 10AX115U2F45E1SG fits 4K/8K broadcast video processing because its 1,150,000 logic elements and 1,518 hard 18x18 multipliers absorb multi-channel HEVC/H.265 encode/decode pipelines without taxing external DSP chips. The 480 user I/Os feed 12G-SDI/DisplayPort 1.4 receive and transmit PHYs in parallel, while 24 transceivers at up to 17.4 Gbps aggregate uncompressed 8K video at 60 fps. Placed as the central bridge between SDI ingest and PCIe Gen3 x8 host offload, the device dissipates ~30 W typical board power, requiring a moderate aluminum heatsink or top-side heat spreader.
Recommended
100G Ethernet Aggregation Switch Fabric
For 100G Ethernet aggregation, the 10AX115U2F45E1SG delivers 24 backplane-capable transceivers at 17.4 Gbps that, when combined across 12 lanes per port, enable two 100G (CAUI-10) ports or six 40G (XLAUI) ports per device. The hard PCIe Gen3 x8 IP provides a low-latency host control plane, while the 68.86 Mbits of embedded memory buffers line-rate traffic without external RLDRAM. The part's 0.9 V core and 25-40 W typical dissipation make it suitable for line-card designs that reuse existing Arria 10 thermal solutions.
Recommended
PCIe Gen3 x8 Acceleration Card
The 10AX115U2F45E1SG accelerates host-offloaded workloads through its hard PCIe Gen3 x8 endpoint, which delivers ~8 GT/s link bandwidth without consuming FPGA fabric. The 1,150 K LEs and 1,518 multipliers implement NVMe controller logic, deep-learning inference engines, or financial Monte-Carlo pipelines, while 24 transceivers link to companion FPGAs in a coprocessor mesh. Typical board power is 25-35 W, allowing passive heat-spreader cooling in full-height half-length PCIe cards.
Recommended
Radar and EW Digital Signal Processing
The 10AX115U2F45E1SG handles radar and electronic-warfare DSP front-ends because its hard floating-point DSP blocks perform FFT and pulse-Doppler processing at sample rates up to 400 MHz per channel. The 68.86 Mbits of embedded SRAM holds windowing and overlap-add coefficient tables, while 24 transceivers at 17.4 Gbps stream digitized antenna samples from RF ADCs. Per Intel's Arria 10 design examples, two such devices in a master-slave configuration can process 256-element phased-array data with margin.
Recommended
Software Defined Radio (SDR) Prototyping
The 10AX115U2F45E1SG's 24 transceivers support multi-band SDR prototyping from HF to 6 GHz with up to 17.4 Gbps per channel, making the device well-suited for software-defined base-station and tactical-radio research. The 1,150 K LEs host full soft-modem stacks (LTE, 5G NR, custom waveforms), while the embedded memory buffers real-time IQ samples at hundreds of MSPS. Power consumption of 25-40 W is acceptable for laboratory chassis with forced-air cooling.
Recommended
Medical Imaging Reconstruction (CT/MRI)
The 10AX115U2F45E1SG accelerates CT and MRI back-projection reconstruction because its 1,518 hard multipliers deliver the parallel MAC throughput required for filtered back-projection of 1024 x 1024 slices in real time. The 6 hard DDR4 controllers stream raw projection data at >25 GB/s aggregate, while 24 transceivers link to detector ASICs over high-speed serial. The device's -40C to +100C extended industrial grade suits imaging carts that require IEC 60601 thermal margin.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115U2F45E1SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115U2F45I1SG | 10AX115U1F45E1SG | 10AX115U2F45E2SG | 10AX115N2F45E1SG | 10AX090U2F45E1SG |
|---|---|---|---|---|---|---|
| Package | 1932-ball FCBGA | 1932-ball FCBGA - same | 1932-ball FCBGA - same | 1932-ball FCBGA - same | 1932-ball FCBGA - same | 1932-ball FCBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 900,000 |
| Embedded Memory (Mbit) | 68.86 | 68.86 | 68.86 | 68.86 | 68.86 | 53.42 |
| Transceiver Channels | 24 | 24 | 24 | 24 | 24 | 24 |
| Max Transceiver Rate (Gbps) | 17.4 | 17.4 | 17.4 | 17.4 | 28.05 | 17.4 |
| Speed Grade | -2 | -2 | -1 | -2 | -2 | -2 |
| Transceiver Family | GX (17.4 Gbps) | GX | GX | GX | GT (28 Gbps) | GX |
| User I/O Pins | 480 | 480 | 480 | 480 | 480 | 480 |
| Temperature Grade | Extended Industrial (-40C to +100C) | Industrial (-40C to +100C) | Extended Industrial | Extended Industrial | Extended Industrial | Extended Industrial |
Key Differentiators
- 17.4 Gbps backplane-capable transceivers with built-in PCIe Gen3 x8 hard IP (vs 10AX115S2F45E2SG)
- Higher-density 1,150 K LE over 900 K LE sibling with same package (vs 10AX090U2F45E1SG)
- Lower-bandwidth GX vs higher-bandwidth GT for cost-optimized designs (vs 10AX115N2F45E1SG)
Design Notes
The 1932-ball FCBGA requires a 1.0 mm pitch microvia PCB stack-up (typically 1+2+1 or 2+4+2 with 100 um via-in-pad plating). Escape routing must use staggered microvias on the inner layers to maintain impedance control for transceiver lanes. Per Intel's Arria 10 PCB design guidelines, top-layer component placement should leave at least 5 mm clearance around the BGA to accommodate the heat-spreader lid and decoupling capacitors placed within 100 mils of the balls.
Estimated: at typical usage (15-20% transceiver utilization, 60% logic utilization, 400 MHz DDR4) the device dissipates 25-35 W. With a junction-to-ambient theta_JA of approximately 1.5 C/W (FCBGA with integrated heat spreader and 200 LFM airflow), the junction temperature rises 38-53 C above ambient. Mount a copper lid heat-spreader with a 1-2 mm gap filled with thermal interface material rated for at least 3 W/m-K. Without forced airflow, derate clock speeds by one speed grade to stay below 100 C Tj.
The 0.9 V core rail can draw up to 35 A peak transients during configuration and high-utilization DSP bursts; design the regulator (typically a multi-phase controller like the ISL6388 or LTM4677) with at least 30% headroom and 200 uF of bulk ceramic plus 22 uF of high-frequency decoupling within the BGA footprint. Add 0.1 uF and 1 nF X7R capacitors within 100 mils of every supply ball. Sequence rails (0.9 V core before 1.8 V transceiver PLL) using a dedicated sequencer such as the LTC2923 to avoid latch-up.
A common mistake is selecting a generic IBIS model from a third-party distributor rather than the Intel-validated IBIS-AMI files - this can mispredict transceiver eye margins by 20-30 dB. Always run channel simulation with the official Intel-provided IBIS-AMI model that matches the specific speed grade (-1 vs -2) and transceiver sub-variant (GX vs GT). Another frequent pitfall is forgetting that Arria 10 configuration files (.sof) generated with Quartus II are not compatible with Quartus Prime Pro; re-synthesize any legacy IP using the latest library to avoid bitstream load failures.
Compliance Information
RoHS and REACH compliant per Intel material declaration. Not AEC-Q100 qualified (industrial/extended industrial grade only). Halogen-free per JEDEC JS709B.
