10CL016YU256C6G - Cyclone 10 LP FPGA 16K LE | Intel | 256-UBGA
MPN: 10CL016YU256C6G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $44.5 | $44.50 |
| 10 | $39.2 | $392.00 |
| 100 | $32.85 | $3,285.00 |
| 500 | $27.4 | $13,700.00 |
| 1,000 | $23.75 | $23,750.00 |
Drop-in alternatives for 10CL016YU256C6G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10CL016YU256A7G
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View Datasheet →10CL016YU256C6G Maximum Ratings & Electrical Characteristics
| Family | Cyclone 10 LP |
| Logic Elements (LE) | 15,408 |
| Embedded Memory Bits | 516,096 bits |
| Embedded Memory Blocks (M9K) | 56 |
| Embedded 18x18 Multipliers | 56 |
| User I/O (max) | 162 |
| Package | 256-ball UBGA (U256), 17 mm x 17 mm, 1.0 mm pitch |
| Process Technology | Low-power 60 nm |
| Speed Grade | C6 (commercial, -6) |
| Operating Temperature | 0 C to +85 C (commercial) |
| Supply Voltage (core) | 1.2 V (typical) |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG |
| PLLs | 4 general-purpose PLLs |
| Global Clock Networks | 20 |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | 3 (per JEDEC J-STD-020) |
| RoHS Status | Compliant |
10CL016YU256C6G 256-ball ubga (u256), 17 mm x 17 mm, 1.0 mm pitch Pin Configuration Guide
Complete pinout information for 10CL016YU256C6G (256-ball ubga (u256), 17 mm x 17 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CL016YU256C6G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10CL016YU256C6G is suitable for 6 applications: Industrial Motor Control, Human-Machine Interface (HMI) Panels, PCIe Gen1 Endpoint Card, Video Bridging and Format Conversion, Factory Automation I/O Expansion, Portable Test and Measurement Equipment.
Industrial Motor Control
The 10CL016YU256C6G is well suited for industrial motor control drives where deterministic PWM generation and encoder feedback processing are required. Its 56 embedded 18x18 multipliers handle field-oriented control (FOC) algorithms including Clarke/Park transforms and PI loops, while the 56 M9K memory blocks provide sufficient buffering for current and position feedback. The -6 commercial speed grade delivers adequate Fmax for 100 kHz PWM switching frequencies typical of low-voltage AC drives. Quartus Prime's Qsys tool accelerates integration of encoder interfaces, PWM peripherals, and EtherCAT or Modbus slave cores. The 256-ball UBGA provides 162 user I/O - enough for three-phase gate drivers, brake control, and multiple encoder inputs without external muxing.
Recommended
Human-Machine Interface (HMI) Panels
The 10CL016YU256C6G's 15,408 logic elements and 516 Kbit embedded memory support mid-resolution TFT LCD controllers and touch-screen scanning interfaces common in industrial HMI panels. The soft Nios II embedded processor core fits within the available logic, running LVGL or emWin graphical stacks for menu rendering. The 256-ball UBGA package exposes sufficient LVDS pairs for direct 18/24-bit RGB-to-LVDS bridging, eliminating external display serializer ICs. Designers pair the FPGA with external DDR2 memory (16-bit) for frame buffering, leveraging the soft DDR2 controller IP. Cyclone 10 LP's low static power (~250 mW typical) simplifies thermal design in sealed HMI enclosures.
Recommended
PCIe Gen1 Endpoint Card
The 10CL016YU256C6G supports PCIe Gen1 (2.5 Gbps) hard IP block endpoints at x1 lane width, enabling low-cost PCIe endpoint cards for industrial PCs, test equipment, and data-acquisition boards. According to the Intel Cyclone 10 LP device overview, the integrated PCIe hard IP eliminates the soft-logic overhead that would otherwise consume 2-3K LEs. The 56 multipliers handle DSP preprocessing on incoming data, while 162 user I/O accommodate external ADC/DAC interfacing via LVDS or parallel CMOS. Designers use Quartus Prime's PCIe Avalon-MM bridge example design to reach a working endpoint in under one hour.
Recommended
Video Bridging and Format Conversion
The 10CL016YU256C6G enables HDMI-to-LVDS, MIPI-CSI-to-Parallel RGB, and other video bridge functions for industrial camera systems, digital signage, and legacy display replacements. The 56 hardware multipliers accelerate color-space conversion (YUV422 to RGB888) and chroma upsampling in real time for 720p60 streams. The 516 Kbit embedded memory holds two or three scanline buffers, removing the need for external SRAM in compact bridges. The 256-ball UBGA exposes multiple LVDS channels required for HDMI clock/data and RGB-to-LVDS display output simultaneously.
Recommended
Factory Automation I/O Expansion
Programmable logic controllers (PLCs) and distributed I/O modules use the 10CL016YU256C6G as a flexible glue-logic and protocol-conversion device. Its 162 user I/O accommodate dozens of 24 V digital inputs with opto-isolated interfaces, while soft IP cores implement EtherCAT, PROFINET, Modbus TCP, or IO-Link master stacks. The 15,408 logic elements fit protocol state machines plus diagnostic logic, and the -6 commercial speed grade meets the 100 Mbit/s Ethernet timing requirements. The BGA package's small 17 mm x 17 mm footprint keeps the module footprint compact for DIN-rail-mounted I/O slices.
Recommended
Portable Test and Measurement Equipment
Handheld oscilloscopes, logic analyzers, and field-installable protocol testers leverage the 10CL016YU256C6G's low static power (~250 mW typical) for battery-powered operation. The 56 multipliers and 56 M9K memory blocks enable real-time FFT, digital filtering, and protocol decode at sample rates up to 250 MHz using external ADCs. The 256-ball UBGA exposes LVDS pairs for high-speed ADC interfacing and JTAG for boundary-scan diagnostics. Designers use Quartus Prime's Signal Tap logic analyzer to debug in-system without halting the processor, which is critical for intermittent fault capture in field deployments.
Recommended
Recommended Products Summary
Engineering reference data for 10CL016YU256C6G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CL016YU256A7G | 10CL016YU256I7G | 10CL010YU256C6G | 10CL016YU256C8G | 10CL006YU256C6G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-ball UBGA (17x17 mm) | 256-ball UBGA (same) | 256-ball UBGA (same) | 256-ball UBGA (same) | 256-ball UBGA (same) | 256-ball UBGA (same) |
| Logic Elements | 15,408 | 15,408 | 15,408 | 10,320 | 15,408 | 6,272 |
| Embedded Memory (Kbit) | 516 | 516 | 516 | 414 | 516 | 270 |
| 18x18 Multipliers | 56 | 56 | 56 | 40 | 56 | 30 |
| Speed Grade | C6 (commercial, -6) | A7 (industrial, -7 faster) | I7 (industrial, -7 faster) | C6 (same) | C8 (commercial, -8 slower) | C6 (same) |
| Temperature Grade | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (same) | Commercial (same) | Commercial (same) |
| User I/O (max) | 162 | 162 | 162 | 162 | 162 | 162 |
| Unit Price (1 qty, USD) | $44.50 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Cost-optimized commercial temperature grade in U256 footprint (vs 10CL016YU256I7G)
- Higher logic density than 10CL010 within the same package (vs 10CL010YU256C6G)
- Larger memory and DSP than 10CL006 (vs 10CL006YU256C6G)
Design Notes
Estimated: at typical utilization (50% LE, 50% memory, 50% multipliers) with toggling rate of 12.5% and 1.2 V core supply, the 10CL016YU256C6G dissipates approximately 0.7-1.2 W. Use the Quartus Prime PowerPlay early estimator for accurate per-design figures. The 256-ball UBGA has a junction-to-ambient thermal resistance of approximately 17 C/W on a 4-layer JEDEC test board, so under 1.5 W dissipation no heatsink is required. Above 2 W, add thermal vias under the BGA and consider a small bottom-side heatsink.
The 256-ball UBGA at 1.0 mm pitch requires buried vias or micro-via stack-up on at least the top two layers of the PCB. Use 0.4 mm via-in-pad with filled and plated-over copper pads. Provide a continuous GND plane on layer 2 and a PWR plane on layer 3 to minimize inductance on core and I/O supply rails. Decouple every VCCINT and VCCA pin with 100 nF X7R 0402 capacitors placed within 1.5 mm of the BGA pad.
Do not confuse U256 (256-ball UBGA, 17x17 mm) with M164 (164-ball MBGA, 8x8 mm) or E144 (144-pin EQFP) packages of the same 10CL016 family - the pin-outs are NOT compatible and require re-pin-assignment in Quartus Prime. Also note that the C6, C8, I7, and A7 speed-grade suffixes refer to different Fmax bins; C6 and C8 share pin-outs but differ in timing, while I7 and A7 also require re-running timing closure. Finally, the C6 suffix is commercial temperature only - for industrial applications, choose I7 or A7 directly rather than testing C6 outside its qualified range.
Compliance Information
RoHS and REACH compliant per Intel product page. MSL Level 3 per JEDEC J-STD-020. C6 commercial temperature grade is NOT AEC-Q100 qualified; for AEC-Q100 automotive designs, use 10CL016YU484I7G or higher-grade speed variants. Halogen-free per Intel packaging specifications.