10CX150YF780E6G - Cyclone 10 GX FPGA 150K LE, 780-FCBGA | Intel
MPN: 10CX150YF780E6G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $720 | $720.00 |
| 10 | $695 | $6,950.00 |
| 100 | $660 | $66,000.00 |
| 500 | $615 | $307,500.00 |
| 1,000 | $575 | $575,000.00 |
Drop-in alternatives for 10CX150YF780E6G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10CX150YF780E5G
✅ Drop-In✓ In Stock
$160 / Unit
View Datasheet →10CX105YF780E6G
✅ Drop-In✓ In Stock
$580 / Unit
View Datasheet →10CX105YF780E5G
✅ Drop-In✓ In Stock
$350 / Unit
View Datasheet →10CX150YF780E6G Maximum Ratings & Electrical Characteristics
| Series | Cyclone 10 GX |
| Family | Cyclone 10 GX |
| Process Technology | 20 nm |
| Logic Elements (LE) | 150,000 |
| Adaptive Logic Modules (ALM) | 56,480 |
| Embedded Memory | 10,907,648 bits (approximately 10.9 Mbit) |
| User I/O Pins | 284 |
| Package | 780-ball FCBGA |
| Speed Grade | -6 (E6G industrial fast) |
| Operating Temperature | -40C to +100C (Industrial) |
| Transceivers | GX up to 12.5 Gbps |
| PCIe Hard IP | PCI Express Gen2 x4 hard IP |
| DSP Blocks | Variable-precision, fixed/floating point |
| Memory Interfaces | DDR3, DDR4, LPDDR3, QDR II+ |
| Mounting Type | Surface Mount (FCBGA) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
10CX150YF780E6G 780-ball fcbga Pin Configuration Guide
Complete pinout information for 10CX150YF780E6G (780-ball fcbga package) with 284 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CX150YF780E6G.
Refer to the datasheet for full pin configuration.
Estimated pin count: 284 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10CX150YF780E6G is suitable for 6 applications: Industrial Machine Vision Camera Processing, Broadcast Video Bridge and Processing, PCIe Gen2 Acceleration Card, Factory Automation Controller, Wireless Backhaul Low-Density Modem, Sensor Aggregation Hub.
Industrial Machine Vision Camera Processing
The 10CX150YF780E6G is well suited for industrial machine vision cameras because it combines 150K logic elements with up to 12.5 Gbps GX transceivers and PCIe Gen2 hard IP. Vision pipelines typically need parallel pixel processing at 60-120 fps, which the variable-precision DSP blocks handle efficiently. Compared with a CPU-based vision system, this FPGA reduces latency by 5-10x and keeps the 780-FCBGA footprint compact enough for camera-head PCBs while supporting -40C to +100C industrial operation.
Recommended
Broadcast Video Bridge and Processing
The 10CX150YF780E6G fits broadcast video bridge applications by providing sufficient logic (150K LE) and 10.9 Mbits of embedded memory to buffer HD/4K frames in real time. The transceiver channels at 12.5 Gbps support SMPTE ST 425 / ST 2081 / ST 2082 coaxial interfaces when paired with external SDI PHY. The DDR4 memory controller hard IP allows high-bandwidth frame store with minimal soft logic overhead, making it a strong fit for broadcast routers and up/down/cross converters.
Recommended
PCIe Gen2 Acceleration Card
The 10CX150YF780E6G includes a hard PCI Express Gen2 x4 IP block that reduces soft-logic utilization by approximately 15K LEs compared to soft PCIe implementations. For a low-density acceleration card targeting 2-4 Gbps host link, this FPGA delivers deterministic latency under 200 ns while freeing DSP blocks for actual workload acceleration. Industrial temperature grade (-40C to +100C) suits edge-server and ruggedized deployments.
Recommended
Factory Automation Controller
In factory automation, the 10CX150YF780E6G aggregates sensor data from EtherCAT, PROFINET, or Modbus TCP industrial Ethernet links. Its 284 user I/O pins accommodate multiple isolated GPIO plus serial interfaces, while the 12.5 Gbps transceivers handle high-speed backplane or point-to-point links between controllers. The industrial -40C to +100C temperature range and 780-FCBGA package suit sealed control cabinet environments.
Recommended
Wireless Backhaul Low-Density Modem
The 10CX150YF780E6G supports low-density wireless backhaul modems where CPRI or JESD204B links are paired with moderate DSP for baseband processing. The 12.5 Gbps transceivers comfortably carry CPRI option 3-5 rates, while variable-precision DSP blocks implement FFT, channel estimation, and FEC. The compact 780-FCBGA enables integration into small-form-factor radio units, and the industrial temperature grade handles outdoor cabinet deployments.
Recommended
Sensor Aggregation Hub
The 10CX150YF780E6G works as a sensor aggregation hub for multi-modal sensor systems, combining 150K LEs for stream multiplexing, 284 I/O pins for multi-sensor attachment, and 12.5 Gbps transceivers for high-speed uplink to a host processor. Variable-precision DSP blocks handle sensor pre-processing such as noise filtering and feature extraction, while the DDR4 interface acts as a high-bandwidth buffer between aggregated streams and the host. The industrial temperature range supports harsh-environment deployments.
Recommended
Recommended Products Summary
Engineering reference data for 10CX150YF780E6G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CX150YF780E5G | 10CX105YF780E6G | 10CX105YF780E5G |
|---|---|---|---|---|
| Package | 780-ball FCBGA | 780-ball FCBGA | 780-ball FCBGA | 780-ball FCBGA |
| Brand | Intel | Intel | Intel | Intel |
| Series | Cyclone 10 GX | Cyclone 10 GX | Cyclone 10 GX | Cyclone 10 GX |
| Logic Elements | 150,000 | 150,000 | 105,000 | 105,000 |
| Speed Grade | -6 (E6G) | -5 (E5G) | -6 (E6G) | -5 (E5G) |
| User I/O Pins | 284 | 284 | 284 | 284 |
| Embedded Memory | 10.9 Mbit | 10.9 Mbit | 7.6 Mbit | 7.6 Mbit |
| Transceiver Speed | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps |
| Operating Temperature | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C |
Key Differentiators
- Highest LE density in Cyclone 10 GX 780-FCBGA family (vs 10CX105YF780E6G)
- Fastest commercial speed grade in the same footprint (vs 10CX150YF780E5G)
- Integrated 12.5 Gbps transceivers and PCIe Gen2 hard IP (vs 10CL120YF780I7G)
Design Notes
Estimated: At full transceiver utilization (12.5 Gbps x 6 channels) plus 80% logic utilization, the 10CX150YF780E6G can dissipate 6-8 W. The 780-FCBGA package requires a thermal via array under the central die pad and at least 4 signal layers with stitched ground pour. For ambient temperatures above 70C, add forced airflow of at least 200 LFM to keep junction temperature below 100C, since the industrial-grade part is rated to +100C Tj.
The 780-ball FCBGA package uses 1.0 mm ball pitch; route signals on inner layers with 4-mil trace/space rules. Place decoupling capacitors on the top layer within 100 mils of the power balls: 0.1 uF and 10 uF combinations per power rail. Use Intel's Cyclone 10 GX pin connection guidelines for ball map and bank voltage assignments. High-speed transceiver channels require matched-length routing within 5 mil tolerance and ground shielding.
For 12.5 Gbps GX transceiver channels, use a 100-ohm differential impedance stackup with Megtron 6 or similar low-loss dielectric. Reference the Intel Cyclone 10 GX transceiver user guide for pre-emphasis and equalization settings. Place external AC-coupling capacitors within 250 mils of the transmitter ball pair and avoid any layer transitions on the channel path. Perform 3D EM simulation on breakout via structures to optimize return loss.
Compliance Information
RoHS and lead-free compliant per Intel product page. Not AEC-Q100 qualified - this is an industrial-grade FPGA, not an automotive-qualified part. Halogen-free status not explicitly stated in verified data.
