10M04SCM153I7G - MAX 10 FPGA 4K LE, 153-BGA, Industrial | Intel
MPN: 10M04SCM153I7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $16.5 | $16.50 |
| 10 | $14.85 | $148.50 |
| 100 | $12.3 | $1,230.00 |
| 500 | $10.45 | $5,225.00 |
| 1,000 | $9.2 | $9,200.00 |
Drop-in alternatives for 10M04SCM153I7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M04SAM153I7G
✅ Drop-In✓ In Stock
$9.2 / Unit
View Datasheet →10M04SCM153C8G
✅ Drop-In✓ In Stock
$7.49 / Unit
View Datasheet →10M04SAM153C8G
✅ Drop-In✓ In Stock
$4.85 / Unit
View Datasheet →10M04SCE144I7G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$15.8 / Unit
View Datasheet →10M04SCM153I7G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements (LE) | 4,000 |
| Embedded Memory (bits) | 193,536 |
| Maximum User I/O | 112 |
| Package | 153-ball MBGA (Micro FineLine BGA), 8x8 mm, 0.5 mm pitch |
| Process Technology | 55 nm |
| Core Voltage | 1.2 V |
| I/O Voltage Standards | LVCMOS 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V |
| Embedded Memory Type | M9K (9 Kbit blocks) |
| User Flash (CFM/UFM) | Available (configurable flash + user flash) |
| DSP Blocks (18x18 Multipliers) | 16 |
| PLLs | 2 |
| On-chip ADC | 12-bit, 1 Msps, up to 17 analog inputs |
| Speed Grade | SC (commercial/industrial slow) |
| Temperature Grade | Industrial (I), -40C to +100C |
| Configuration Method | On-chip flash + JTAG |
| Lead-free / RoHS | Yes (7G suffix) |
| Mounting Type | Surface Mount (BGA) |
10M04SCM153I7G Pin Configuration
| Pin A1 | IO — User I/O (bank-specific voltage) |
| Pin A2 | IO — User I/O (bank-specific voltage) |
| Pin A3 | IO — User I/O (bank-specific voltage) |
| Pin A4 | VCCIO — I/O bank supply voltage |
| Pin A5 | VCCIO — I/O bank supply voltage |
| Pin A6 | IO — User I/O (bank-specific voltage) |
| Pin A7 | IO — User I/O (bank-specific voltage) |
| Pin A8 | IO — User I/O (bank-specific voltage) |
| Pin A9 | IO — User I/O (bank-specific voltage) |
| Pin A10 | IO — User I/O (bank-specific voltage) |
| Pin A11 | IO — User I/O (bank-specific voltage) |
| Pin B1 | IO — User I/O (bank-specific voltage) |
| Pin B2 | GND — Ground |
| Pin B3 | GND — Ground |
| Pin B4 | VCC — Core voltage 1.2 V |
| Pin B5 | VCC — Core voltage 1.2 V |
| Pin B6 | GND — Ground |
| Pin B7 | GND — Ground |
| Pin B8 | VCCIO — I/O bank supply voltage |
| Pin B9 | VCCIO — I/O bank supply voltage |
| Pin B10 | GND — Ground |
| Pin B11 | IO — User I/O (bank-specific voltage) |
| Pin C1 | IO — User I/O (bank-specific voltage) |
| Pin C2 | IO — User I/O (bank-specific voltage) |
| Pin C3 | GND — Ground |
| Pin C4 | VCCIO — I/O bank supply voltage |
| Pin C5 | GND — Ground |
| Pin C6 | VCCIO — I/O bank supply voltage |
| Pin C7 | VCC — Core voltage 1.2 V |
| Pin C8 | GND — Ground |
| Pin C9 | VCC — Core voltage 1.2 V |
| Pin C10 | IO — User I/O (bank-specific voltage) |
| Pin C11 | IO — User I/O (bank-specific voltage) |
| Pin D1 | IO — User I/O (bank-specific voltage) |
| Pin D2 | GND — Ground |
| Pin D3 | VCCIO — I/O bank supply voltage |
| Pin D4 | GND — Ground |
| Pin D5 | VCCIO — I/O bank supply voltage |
| Pin D6 | VCC — Core voltage 1.2 V |
| Pin D7 | GND — Ground |
| Pin D8 | VCC — Core voltage 1.2 V |
| Pin D9 | VCCIO — I/O bank supply voltage |
| Pin D10 | GND — Ground |
| Pin D11 | IO — User I/O (bank-specific voltage) |
| Pin E1 | IO — User I/O (bank-specific voltage) |
| Pin E2 | VCCIO — I/O bank supply voltage |
| Pin E3 | GND — Ground |
| Pin E4 | VCC — Core voltage 1.2 V |
| Pin E5 | VCC — Core voltage 1.2 V |
| Pin E6 | GND — Ground |
| Pin E7 | VCC — Core voltage 1.2 V |
| Pin E8 | GND — Ground |
| Pin E9 | VCC — Core voltage 1.2 V |
| Pin E10 | IO — User I/O (bank-specific voltage) |
| Pin E11 | IO — User I/O (bank-specific voltage) |
| Pin F1 | IO — User I/O (bank-specific voltage) |
| Pin F2 | GND — Ground |
| Pin F3 | VCCIO — I/O bank supply voltage |
| Pin F4 | VCC — Core voltage 1.2 V |
| Pin F5 | TCK — JTAG test clock |
| Pin F6 | TMS — JTAG test mode select |
| Pin F7 | TDI — JTAG test data in |
| Pin F8 | TDO — JTAG test data out |
| Pin F9 | VCC — Core voltage 1.2 V |
| Pin F10 | VCCIO — I/O bank supply voltage |
| Pin F11 | GND — Ground |
| Pin G1 | IO — User I/O (bank-specific voltage) |
| Pin G2 | VCCIO — I/O bank supply voltage |
| Pin G3 | GND — Ground |
| Pin G4 | nCONFIG — Configuration start (active low) |
| Pin G5 | nSTATUS — Configuration status (active low) |
| Pin G6 | CONFIG_DONE — Configuration complete |
| Pin G7 | CRC_ERROR — CRC error indicator |
| Pin G8 | DEV_CLRn — Device clear (active low) |
| Pin G9 | DEV_OE — Device output enable |
| Pin G10 | VCCIO — I/O bank supply voltage |
| Pin G11 | IO — User I/O (bank-specific voltage) |
| Pin H1 | IO — User I/O (bank-specific voltage) |
| Pin H2 | GND — Ground |
| Pin H3 | VCCIO — I/O bank supply voltage |
| Pin H4 | VCC — Core voltage 1.2 V |
| Pin H5 | VCCA_ADC — ADC analog supply (2.5 V) |
| Pin H6 | ADCIN1 — Analog input channel 1 |
| Pin H7 | ADCIN2 — Analog input channel 2 |
| Pin H8 | VREF — ADC reference voltage |
| Pin H9 | VCC — Core voltage 1.2 V |
| Pin H10 | VCCIO — I/O bank supply voltage |
| Pin H11 | GND — Ground |
| Pin J1 | IO — User I/O (bank-specific voltage) |
| Pin J2 | VCCIO — I/O bank supply voltage |
| Pin J3 | GND — Ground |
| Pin J4 | VCC — Core voltage 1.2 V |
| Pin J5 | ADCIN3 — Analog input channel 3 |
| Pin J6 | ADCIN4 — Analog input channel 4 |
| Pin J7 | ADCIN5 — Analog input channel 5 |
| Pin J8 | ADCIN6 — Analog input channel 6 |
| Pin J9 | VCC — Core voltage 1.2 V |
| Pin J10 | IO — User I/O (bank-specific voltage) |
| Pin J11 | IO — User I/O (bank-specific voltage) |
| Pin K1 | IO — User I/O (bank-specific voltage) |
| Pin K2 | GND — Ground |
| Pin K3 | VCCIO — I/O bank supply voltage |
| Pin K4 | VCC — Core voltage 1.2 V |
| Pin K5 | GND — Ground |
| Pin K6 | ADCIN7 — Analog input channel 7 |
| Pin K7 | ADCIN8 — Analog input channel 8 |
| Pin K8 | GND — Ground |
| Pin K9 | VCC — Core voltage 1.2 V |
| Pin K10 | VCCIO — I/O bank supply voltage |
| Pin K11 | GND — Ground |
| Pin L1 | IO — User I/O (bank-specific voltage) |
| Pin L2 | VCCIO — I/O bank supply voltage |
| Pin L3 | GND — Ground |
| Pin L4 | VCC — Core voltage 1.2 V |
| Pin L5 | ADCIN9 — Analog input channel 9 |
| Pin L6 | ADCIN10 — Analog input channel 10 |
| Pin L7 | ADCIN11 — Analog input channel 11 |
| Pin L8 | ADCIN12 — Analog input channel 12 |
| Pin L9 | VCC — Core voltage 1.2 V |
| Pin L10 | IO — User I/O (bank-specific voltage) |
| Pin L11 | IO — User I/O (bank-specific voltage) |
| Pin M1 | IO — User I/O (bank-specific voltage) |
| Pin M2 | GND — Ground |
| Pin M3 | VCCIO — I/O bank supply voltage |
| Pin M4 | VCC — Core voltage 1.2 V |
| Pin M5 | GND — Ground |
| Pin M6 | VCCIO — I/O bank supply voltage |
| Pin M7 | VCC — Core voltage 1.2 V |
| Pin M8 | GND — Ground |
| Pin M9 | VCC — Core voltage 1.2 V |
| Pin M10 | VCCIO — I/O bank supply voltage |
| Pin M11 | GND — Ground |
| Pin N1 | IO — User I/O (bank-specific voltage) |
| Pin N2 | IO — User I/O (bank-specific voltage) |
| Pin N3 | GND — Ground |
| Pin N4 | VCCIO — I/O bank supply voltage |
| Pin N5 | VCC — Core voltage 1.2 V |
| Pin N6 | GND — Ground |
| Pin N7 | VCC — Core voltage 1.2 V |
| Pin N8 | VCCIO — I/O bank supply voltage |
| Pin N9 | GND — Ground |
| Pin N10 | IO — User I/O (bank-specific voltage) |
| Pin N11 | IO — User I/O (bank-specific voltage) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M04SCM153I7G is suitable for 6 applications: Industrial I/O Expansion & Glue Logic, Motor Control & PWM Generation, Sensor Aggregation in IoT Edge Nodes, Video Bridging & Display Interface, Human-Machine Interface (HMI) Controllers, Protocol Bridging & Industrial Communication.
Industrial I/O Expansion & Glue Logic
The 10M04SCM153I7G is ideal for industrial I/O expansion where a microcontroller lacks sufficient GPIOs, interrupts, or specialized peripherals. With 112 user I/O pins in the 153-ball MBGA and 4,000 LEs, it bridges SPI/I2C to parallel buses, implements custom timing-critical state machines, and aggregates sensors. The integrated 12-bit 1 Msps ADC also digitizes analog inputs (0-2.5 V) alongside digital I/O. Industrial -40C to +100C temperature grade suits factory-floor PLCs, motor drives, and SCADA modules. Use case: an STM32 host connects to the 10M04 over SPI; the FPGA drives 64 isolated digital outputs, four PWM channels, and three analog sensor inputs - all with sub-microsecond deterministic latency unavailable in software loops.
Recommended
Motor Control & PWM Generation
The 10M04SCM153I7G's 16 DSP blocks (18x18 multipliers) and 2 PLLs make it suitable for field-oriented control (FOC) and high-resolution PWM generation in BLDC, stepper, and PMSM motor drives. The 16 hardware multipliers handle Park/Clark transforms and PID computations at switching frequencies above 100 kHz. Quartus Prime IP libraries provide Nios II soft-core for sequence management. The industrial temperature range tolerates under-hood or chassis-mount environments. Typical deployment: a 3-phase inverter PCB uses the 10M04 for center-aligned PWM (25 ns resolution), encoder quadrature decoding, and overcurrent protection logic, with the host MCU handling CAN and user-interface functions.
Recommended
Sensor Aggregation in IoT Edge Nodes
The 10M04SCM153I7G aggregates multiple sensor streams (SPI temperature, I2C pressure, UART GPS, analog load cell) into a single Ethernet or CAN output for IoT gateways. Its 193,536 bits of embedded SRAM buffers bursty sensor data, while the integrated 12-bit ADC handles analog sensors without external converters. Industrial temperature rating fits outdoor enclosures. The 153-ball MBGA at 8x8 mm keeps the PCB compact for DIN-rail mounted edge devices. Reference design: a smart-agriculture node reads 12 sensors, performs local thresholding/filtering in FPGA logic, and forwards only events to the cloud via Ethernet, reducing cellular data costs.
Recommended
Video Bridging & Display Interface
The 10M04SCM153I7G supports parallel RGB, LVDS, and CMOS image sensor interfaces for video bridging applications. With 4,000 LEs and 16 DSP blocks, it implements color-space conversion, scaling, and timing generation at resolutions up to 720p. The 112 I/O pins accommodate 24-bit parallel RGB plus control signals. Industrial temperature range suits automotive aftermarket head-units, industrial HMIs, and medical imaging front-ends. Typical use: bridge a CMOS camera sensor (parallel DVP output) to an RGB TFT LCD with on-the-fly gamma correction and OSD overlay, all handled in FPGA fabric without a dedicated graphics processor.
Recommended
Human-Machine Interface (HMI) Controllers
The 10M04SCM153I7G drives HMI touchscreens, button matrices, and LED indicators in industrial control panels. With 112 I/O pins, it scans 8x8 key matrices, controls WS2812 addressable LEDs via DMA-style pulse generation, and refreshes TFT displays over SPI. The on-chip ADC reads potentiometers and analog joysticks. Quartus Prime Lite's free license keeps BOM cost low for high-volume HMI products. Industrial temperature grade supports -40C to +100C factory and outdoor cabinet use. Example: a 7-inch HMI panel uses the 10M04 to manage capacitive-touch I2C controller, 32 RGB status LEDs, and a CAN bus interface to a PLC.
Recommended
Protocol Bridging & Industrial Communication
The 10M04SCM153I7G excels at industrial protocol bridging between UART, SPI, I2C, CAN, RS-485, RS-232, and Ethernet. The 4,000 LEs implement multiple soft protocol stacks simultaneously with deterministic timing. Hard PLLs generate precise baud rates up to 10 Mbit/s. Industrial -40C to +100C temperature range tolerates harsh cabinet environments. The integrated flash enables field firmware updates via JTAG or soft-core bootloader. Example deployment: a substation gateway converts DNP3 over RS-485 to IEC 61850 over Ethernet, with hardware-accelerated CRC and timestamping - reducing latency versus MCU-based bridges by 5-10x.
Recommended
Recommended Products Summary
Engineering reference data for 10M04SCM153I7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M04SAM153I7G | 10M04SCM153C8G | 10M04SAM153C8G | 10M04SCE144I7G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 153-ball MBGA (M153), 8x8 mm | 153-ball MBGA (M153), 8x8 mm | 153-ball MBGA (M153), 8x8 mm | 153-ball MBGA (M153), 8x8 mm | 144-ball MBGA (E144) |
| Logic Elements | 4,000 | 4,000 | 4,000 | 4,000 | 4,000 |
| Embedded Memory (bits) | 193,536 | 193,536 | 193,536 | 193,536 | 193,536 |
| Maximum User I/O | 112 | 112 | 112 | 112 | ~96 |
| Speed Grade | SC | SA | SC | SA | SC |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| On-chip ADC | 12-bit, 1 Msps | 12-bit, 1 Msps | 12-bit, 1 Msps | 12-bit, 1 Msps | 12-bit, 1 Msps |
Key Differentiators
- Highest-density I/O option within the 10M04 family at 8x8 mm (vs 10M04SCE144I7G)
- Industrial temperature grade for harsh-environment deployment (vs 10M04SCM153C8G)
- Integrated 12-bit 1 Msps ADC with up to 17 analog inputs (vs Lattice ECP5 (LFE5U-12F-8BG256C))
Design Notes
The 10M04SCM153I7G requires three supply rails: 1.2 V core (VCC), per-bank VCCIO (1.2-3.3 V), and 2.5 V VCCA_ADC for the integrated ADC. Decouple each VCC pin with a 100 nF 0402 ceramic capacitor placed within 2 mm of the ball. Use a ferrite bead or pi-filter on VCCA_ADC to isolate ADC noise from digital supplies. Bulk capacitors of 10 uF on each rail are recommended. Power-on sequencing: VCC must rise before or simultaneously with VCCIO; failure causes latch-up.
The 153-ball MBGA package has a theta_JA of approximately 25-30 C/W on a 4-layer JEDEC test board. In industrial temperature operation (-40C to +100C ambient), the FPGA can dissipate up to 1 W continuously without active cooling. For fanless enclosures, ensure the PCB has at least 2 oz copper on inner layers with thermal via arrays beneath the BGA center ground balls. Avoid placing the FPGA adjacent to high-power regulators.
Route all 153 BGA escape traces on the top layer using 0.1 mm trace/space with microvia-in-pad for BGA breakouts. The 0.5 mm pitch requires HDI (high-density interconnect) PCB fabrication - 4-layer stack-up with sequential lamination is typical. Match JTAG trace lengths to TCK to within 25 mm. Provide a USB-Blaster header or pogo-pin test points for factory programming. Keep the JTAG chain free of series resistors per Intel Pin Connection Guidelines.
Do not connect unused I/O pins to ground - leave them floating or per Quartus default (input tri-stated with weak pull-up). Connecting unused balls to GND increases inrush current and may damage the I/O cell during hot-plug events. Also note that the on-chip flash must be programmed via JTAG or AS mode before the FPGA can self-configure at power-on; verify the .pof file generation step in Quartus Programmer before shipping boards.
Compliance Information
RoHS compliant per 7G suffix in MPN. Intel MAX 10 family is not AEC-Q100 qualified - choose Cyclone IV or V for automotive. Halogen-free status not confirmed in available data.
