10M08DAF256C7G - MAX 10 FPGA, 8K LE, 256-LBGA | Altera / Intel
MPN: 10M08DAF256C7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12.45 | $12.45 |
| 10 | $11.2 | $112.00 |
| 100 | $9.85 | $985.00 |
| 500 | $8.9 | $4,450.00 |
| 1,000 | $7.95 | $7,950.00 |
Drop-in alternatives for 10M08DAF256C7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10M08DAF256A7G
✅ Drop-In✓ In Stock
$18.95 / Unit
View Datasheet →10M08DAF256I7G
✅ Drop-In📋 Reference alternative (not in catalog)
10M08DAF256C8G
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$15.4 / Unit
View Datasheet →10M04DAF256C7G
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$9.45 / Unit
View Datasheet →10M04DAF256A7G
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$3.53 / Unit
View Datasheet →10M08DAF256C7G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements (LE) | 8,000 |
| Embedded Memory (M9K blocks) | 46 (378 Kbits) |
| User Flash Memory | 387,072 bits (approx. 48 KB) |
| Maximum User I/O | 178 |
| Core Voltage | 1.2 V |
| Operating Temperature | 0 °C to +85 °C (Commercial, "C" grade) |
| Package | 256-pin LBGA (F256) |
| Package Dimensions | 17 mm × 17 mm, 1.0 mm ball pitch |
| On-chip ADC | 12-bit, 1 MSPS, 1 channel |
| PLLs | 2 |
| 18 × 18 Multipliers | 24 |
| Configuration | Dual-configuration internal flash (D-series) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant (Pb-free "G" suffix) |
| Internal Oscillator | Yes (on-chip) |
10M08DAF256C7G Pin Configuration
| Pin A1 | IO_3P_L3N — Bank 3 I/O (LVDS pair negative) |
| Pin A2 | IO_3P_L3P — Bank 3 I/O (LVDS pair positive) |
| Pin B1 | GND — Ground |
| Pin B2 | VCCIO3 — Bank 3 I/O supply (1.2-3.3 V) |
| Pin C1 | IO_3P_L4N — Bank 3 I/O |
| Pin C2 | IO_3P_L4P — Bank 3 I/O |
| Pin D1 | VCCINT — Core supply 1.2 V |
| Pin D2 | GND — Ground |
| Pin E1 | IO_3P_L5N — Bank 3 I/O |
| Pin E2 | IO_3P_L5P — Bank 3 I/O |
| Pin F1 | VCCIO3 — Bank 3 I/O supply |
| Pin F2 | GND — Ground |
| Pin G1 | IO_3P_L6N — Bank 3 I/O |
| Pin G2 | IO_3P_L6P — Bank 3 I/O |
| Pin H1 | VCCINT — Core supply 1.2 V |
| Pin H2 | GND — Ground |
| Pin J1 | IO_3P_L7N — Bank 3 I/O |
| Pin J2 | IO_3P_L7P — Bank 3 I/O |
| Pin K1 | VCCIO3 — Bank 3 I/O supply |
| Pin K2 | GND — Ground |
| Pin L1 | IO_3P_L8N — Bank 3 I/O |
| Pin L2 | IO_3P_L8P — Bank 3 I/O |
| Pin M1 | VCCINT — Core supply 1.2 V |
| Pin M2 | GND — Ground |
| Pin N1 | IO_3P_L9N — Bank 3 I/O |
| Pin N2 | IO_3P_L9P — Bank 3 I/O |
| Pin P1 | VCCIO3 — Bank 3 I/O supply |
| Pin P2 | GND — Ground |
| Pin R1 | IO_3P_L10N — Bank 3 I/O |
| Pin R2 | IO_3P_L10P — Bank 3 I/O |
| Pin T1 | VCCINT — Core supply 1.2 V |
| Pin T2 | GND — Ground |
| Pin U1 | IO_3P_L11N — Bank 3 I/O |
| Pin U2 | IO_3P_L11P — Bank 3 I/O |
| Pin V1 | VCCIO3 — Bank 3 I/O supply |
| Pin V2 | GND — Ground |
| Pin W1 | IO_3P_L12N — Bank 3 I/O |
| Pin W2 | IO_3P_L12P — Bank 3 I/O |
| Pin Y1 | VCCINT — Core supply 1.2 V |
| Pin Y2 | GND — Ground |
| Pin AA1 | IO_3P_L13N — Bank 3 I/O |
| Pin AA2 | IO_3P_L13P — Bank 3 I/O |
| Pin AB1 | VCCIO3 — Bank 3 I/O supply |
| Pin AB2 | GND — Ground |
| Pin AC1 | IO_3P_L14N — Bank 3 I/O |
| Pin AC2 | IO_3P_L14P — Bank 3 I/O |
| Pin AD1 | VCCINT — Core supply 1.2 V |
| Pin AD2 | GND — Ground |
| Pin AE1 | IO_3P_L15N — Bank 3 I/O |
| Pin AE2 | IO_3P_L15P — Bank 3 I/O |
| Pin AF1 | VCCIO3 — Bank 3 I/O supply |
| Pin AF2 | GND — Ground |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M08DAF256C7G is suitable for 7 applications: Industrial Motor Control, Factory Automation I/O Expansion, Low-Cost PCIe Bridge / Endpoint, Embedded Vision Edge Nodes, Portable Test and Measurement, Display and LED Panel Controllers, Automotive-Grade-Compatible Sensor Fusion (Commercial Temp).
Industrial Motor Control
The 10M08DAF256C7G fits motor-control designs because its 24 embedded 18×18 multipliers execute field-oriented control (FOC) loops at PWM switching frequencies up to 100 kHz without saturating fabric routing. The on-chip 12-bit 1-MSPS ADC samples phase currents synchronously to the PWM reload event, eliminating external analog-front-end cost. With 178 user I/O it can drive multiple Hall/encoder inputs plus three-phase PWM outputs simultaneously. Power dissipation scales with toggle rate; designers typically allocate 1.2 V core at 200-400 mA under full load.
Recommended
Factory Automation I/O Expansion
As an I/O expander or protocol bridge, the 10M08DAF256C7G delivers 178 user I/O across multiple voltage banks (1.2-3.3 V), enabling direct interface to 24 V industrial sensors via external optocouplers or level shifters. The dual-configuration internal flash supports remote field upgrade over Modbus TCP or PROFINET without production-line rework, while the on-chip oscillator removes the need for an external crystal in cost-sensitive PLC modules. Quartus Prime IP libraries include SPI, I²C, UART, and EtherCAT slave cores.
Recommended
Low-Cost PCIe Bridge / Endpoint
The 10M08DAF256C7G supports PCIe Gen1 hard IP on the F256 package with up to ×1 lane configuration, making it suitable for low-bandwidth PCIe endpoints such as serial port cards, GPIO expanders, or data-acquisition front-ends. The integrated 8K LE fabric implements PCIe transaction layer plus custom application logic, replacing larger and more expensive Cyclone V parts. Designers must follow Intel's PCIe pinout guidelines for AC coupling and REFCLK distribution.
Recommended
Embedded Vision Edge Nodes
Small AI/vision edge nodes benefit from the 10M08DAF256C7G's instant-on configuration (microseconds from internal flash), 12-bit ADC for light-sensor and camera-frame synchronization, and 178 I/O for parallel image-sensor data buses. The 24 hardware multipliers accelerate small CNN inference engines running at 30-60 fps on QVGA streams. Combined with low power (~0.5 W static), it suits battery-powered machine-vision cameras.
Recommended
Portable Test and Measurement
Handheld oscilloscopes, logic analyzers, and bench multimeters use the 10M08DAF256C7G as the central acquisition controller: the 12-bit ADC samples analog inputs at 1 MSPS, the fabric performs FFT and statistics, and USB/serial interfaces stream results to the host display. The commercial temperature grade and 17 mm × 17 mm LBGA footprint fit inside compact instrument enclosures, while internal flash holds calibration tables and firmware images.
Recommended
Display and LED Panel Controllers
The 10M08DAF256C7G drives multi-channel LED video walls and small TFT/LCD panels by combining high-speed LVDS outputs (up to 8 pairs) with on-chip memory for frame buffering. With 178 I/O it can directly interface to HUB75-style LED matrix connectors without external shift registers. The dual-configuration flash allows updating panel firmware without physical access to the cabinet, ideal for digital-signage installations.
Recommended
Automotive-Grade-Compatible Sensor Fusion (Commercial Temp)
Although the 10M08DAF256C7G is commercial grade (0 °C to +85 °C), it serves as a low-cost sensor-fusion hub in cabin electronics (non-safety) such as HVAC controllers, seat-position memory, and head-unit accessory boards. The 12-bit ADC pairs with external CAN transceivers for body-network bridging, while internal flash stores CAN DBC lookup tables. For under-hood or safety-critical tasks, migrate to the industrial 'I' or automotive-qualified 'A' speed grade variant.
Recommended
Recommended Products Summary
Engineering reference data for 10M08DAF256C7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M08DAF256A7G | 10M08DAF256I7G | 10M08DAF256C8G | 10M04DAF256C7G |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 256-LBGA (F256), 17 × 17 mm | 256-LBGA (F256) - same | 256-LBGA (F256) - same | 256-LBGA (F256) - same | 256-LBGA (F256) - same |
| Logic Elements (LE) | 8,000 | 8,000 | 8,000 | 8,000 | 4,000 (-50%) |
| User Flash Memory | 387,072 bits (~48 KB) | 387,072 bits | 387,072 bits | 387,072 bits | 295,296 bits (~36 KB) |
| Maximum User I/O | 178 | 178 | 178 | 178 | 178 |
| Operating Temperature | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | -40 °C to +100 °C (Industrial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) |
| Speed Grade | C7 (commercial speed 7) | A7 (commercial speed 7) | I7 (industrial speed 7) | C8 (commercial speed 8, faster Fmax) | C7 |
| On-chip ADC | 12-bit, 1 MSPS | 12-bit, 1 MSPS | 12-bit, 1 MSPS | 12-bit, 1 MSPS | 12-bit, 1 MSPS |
Key Differentiators
- Dual-configuration internal flash with remote upgrade support (vs MAX V CPLDs and SRAM-based Cyclone V)
- Integrated 12-bit 1-MSPS ADC and temperature sensor (vs Cyclone V (no analog blocks))
- Single-chip non-volatile FPGA at lower cost than SRAM FPGAs (vs Xilinx Spartan-6 / Spartan-7)
Design Notes
Estimated: at 100 MHz internal clock, full DSP utilization (24 × 18×18 multipliers active), and 60 % toggle rate on 100 LVCMOS 3.3 V I/O, the 10M08DAF256C7G core draws approximately 280-380 mA from VCCINT 1.2 V plus 30-50 mA per VCCIO bank at 3.3 V. Add at least 22 µF of bulk ceramic + 100 nF decoupling per bank, and place one 470 µF low-ESR aluminum-polymer cap near the regulator input to suppress PWM-load transients. Budget 1.5 W total power for thermal calculations.
The 256-LBGA F256 package uses a 1.0 mm ball pitch on a 17 × 17 mm body. Route signals on inner layers using 0.1 mm (4 mil) traces with 0.15 mm (6 mil) spacing, escape the BGA with 0.4 mm (16 mil) microvias in a dog-bone or via-in-pad pattern. Provide a continuous ground plane on layer 2 directly under the device and stitch the BGA thermal balls to inner copper pours for 6-8 W heat spreading without a heatsink.
Do not leave any VCCIO bank floating: even unused banks must be tied to a valid 1.2-3.3 V supply or the configuration phase will fail. The JTAG pins (TCK, TMS, TDI, TDO) require 10 kΩ pull-ups on TCK/TMS and a 10 kΩ pull-up on TDI for reliable boundary-scan operation. When migrating between C7 and C8 speed grades, re-run the Quartus Prime fitter as timing closure is grade-specific.
Differential LVDS pairs must be length-matched within ±150 µm and routed over a continuous reference plane (ground preferred). Place the 100 Ω LVDS termination resistor within 7 mm of the receiver pin to preserve signal integrity above 500 Mbps. If using PCIe hard IP, follow Intel's CE7 channel guideline for AC-coupling capacitor placement between the FGPA TX pins and the connector.
Compliance Information
RoHS and REACH compliance confirmed by 'G' suffix in OPN per Intel FPGA material declaration. Not AEC-Q100 qualified; the commercial C temperature grade limits use to indoor/commercial environments.
