10M08DAF484I7G - MAX 10 FPGA, 8K LE, 484-FBGA | Intel
MPN: 10M08DAF484I7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $38.2 | $382.00 |
| 100 | $33.75 | $3,375.00 |
| 500 | $29.4 | $14,700.00 |
| 1,000 | $25.8 | $25,800.00 |
Drop-in alternatives for 10M08DAF484I7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M08DAF484C8G
✅ Drop-In✓ In Stock
$27.65 / Unit
View Datasheet →10M08DAF484A7G
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
10M04DAF484I7G
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
10M16DAF484I7G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$60.4 / Unit
View Datasheet →10M25DAF484I7G
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
10M08DAF484I7G Maximum Ratings & Electrical Characteristics
| Series | MAX 10 |
| Family | MAX 10 FPGA |
| Logic Elements (LE) | 8000 |
| Embedded Memory (bits) | 387072 |
| Embedded Memory (Kb) | 378 |
| Number of I/Os | 250 |
| Operating Temperature | -40 °C to +100 °C (Industrial) |
| Supply Voltage - Core | 1.2 V |
| Mounting Type | Surface Mount |
| Package / Case | 484-BGA |
| Supplier Device Package | 484-FBGA (23x23 mm) |
| Process Technology | 55 nm |
| RoHS Status | Compliant |
| Lead Free | Yes |
| Configuration Memory | Internal flash (non-volatile) |
10M08DAF484I7G 484-fbga (23x23 mm) Pin Configuration Guide
Complete pinout information for 10M08DAF484I7G (484-fbga (23x23 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M08DAF484I7G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M08DAF484I7G is suitable for 6 applications: Industrial I/O Expansion & Protocol Bridging, Motor Control & Drive Interface Logic, Video Bridging & Display Aggregation, Low-Cost PCIe Endpoint Bridge / I/O Card, System Management & Housekeeping Controller, Test & Measurement Front-End Logic.
Industrial I/O Expansion & Protocol Bridging
The 10M08DAF484I7G's 8K logic elements plus 250 available user I/Os make it a strong fit for industrial I/O expansion cards and multi-protocol bridging (UART, I2C, SPI, RS-485, Modbus). According to the MAX 10 datasheet, integrated flash enables instant-on (under 10 ms), eliminating boot delay for safety-critical I/O hubs. Industrial temperature rating (-40 to +100 C) supports factory floor deployment without thermal derating, and the non-volatile bitstream removes the need for an external boot PROM, reducing BOM cost. Pair with Intel Cyclone V SoC as the host processor for a complete factory automation node.
Recommended
Motor Control & Drive Interface Logic
The MAX 10 10M08DAF484I7G is well suited to motor control glue logic: encoder decoding, PWM gating, fault aggregation, and current-sense conditioning. The 250 I/Os expose enough pins for multi-axis BLDC/PMSM control with parallel feedback paths, while 8K LEs handle the state machines and timing arithmetic. Industrial -40 to +100 C rating tolerates the thermal environment of enclosed motor cabinets. According to the MAX 10 datasheet, the device supports up to four PLLs for precise PWM generation. Companion parts: dedicated gate drivers such as TI DRV8301/DRV8320 sit downstream of the FPGA control logic.
Recommended
Video Bridging & Display Aggregation
The 10M08DAF484I7G serves as a low-cost video format bridge and timing controller, converting between LVDS, MIPI, RGB888, and HDMI/TMDS sources for industrial monitors and kiosks. The 484-ball FBGA exposes enough I/Os for parallel RGB888 plus control, and the 378 Kb of embedded SRAM stores one or more full raster lines for deinterlacing or scaling. Industrial temperature and instant-on power-up suit kiosk and signage use cases. Companion parts: TI SN65DSI84 MIPI-to-LVDS bridges and Analog Devices ADV7611/ADV7511 HDMI receivers frequently pair with MAX 10 timing controllers.
Recommended
Low-Cost PCIe Endpoint Bridge / I/O Card
The 10M08DAF484I7G in 484-FBGA can host a soft PCIe Gen1/Gen2 endpoint IP core alongside user-defined register interfaces, creating a low-cost PCIe add-in card or COM Express sidecar. The 8K LEs are sufficient for an x1 endpoint plus register mapping and a few DMA channels. According to Intel's MAX 10 PCIe support documentation, the device includes hard PCIe hard IP blocks in larger densities and supports soft IP in the 10M08. Industrial temperature and flash instant-on suit industrial PCs and edge servers. Pair with TI TPS65983 USB-PD / PCIe controller for hot-plug handling.
Recommended
System Management & Housekeeping Controller
The MAX 10 10M08DAF484I7G is widely deployed as a system management controller (BMC-like companion) that supervises power sequencing, monitors voltages/temperatures, drives LEDs and buttons, and handles strap/firmware update duties on larger host boards. The integrated flash enables instant-on housekeeping within 10 ms, ideal for sequencing host SoCs before the main CPU boots. The 250 I/Os provide ample GPIO for multi-rail sequencing and watchdog signals. Companion parts: TI INA226 current monitors and LTC2978 power managers report back to the MAX 10 over I2C/SMBus.
Recommended
Test & Measurement Front-End Logic
The 10M08DAF484I7G is a cost-effective logic front-end for production test fixtures and bench-top instruments: pattern generation, signal switching matrices, trigger logic, and protocol decoding. 8K LEs handle the state machines for IEEE 1149.x boundary-scan orchestration, plus I2C/SPI/UART sniffers, while 250 I/Os route to the device-under-test. The industrial temperature rating and the 484-BGA's robust mechanical form factor suit factory test cells. Pair with Analog Devices AD7606 16-channel ADC and TI TM4C host MCU for a complete ATE channel card.
Recommended
Recommended Products Summary
Engineering reference data for 10M08DAF484I7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M08DAF484C8G | 10M08DAF484A7G | 10M04DAF484I7G | 10M16DAF484I7G | 10M25DAF484I7G |
|---|---|---|---|---|---|---|
| Package | 484-FBGA (23x23 mm) | 484-FBGA (23x23 mm) - same | 484-FBGA (23x23 mm) - same | 484-FBGA (23x23 mm) - same | 484-FBGA (23x23 mm) - same | 484-FBGA (23x23 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements (LE) | 8000 | 8000 | 8000 | 4000 (-50%) | 16000 (+100%) | 25000 (+213%) |
| Embedded Memory (Kb) | 378 | 378 | 378 | 189 (-50%) | 549 (+45%) | 675 (+78%) |
| Maximum User I/Os | 250 | 250 | 250 | 250 | 250 | 250 |
| Operating Temperature | -40 to +100 C (Industrial) | 0 to +85 C (Commercial) | -40 to +125 C (Automotive) [DATA_NEEDED] | -40 to +100 C (Industrial) | -40 to +100 C (Industrial) | -40 to +100 C (Industrial) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Process Technology | 55 nm | 55 nm | 55 nm | 55 nm | 55 nm | 55 nm |
| Configuration Memory | Internal flash (non-volatile) | Internal flash (non-volatile) | Internal flash (non-volatile) | Internal flash (non-volatile) | Internal flash (non-volatile) | Internal flash (non-volatile) |
Key Differentiators
- Industrial-grade (-40 to +100 C) MAX 10 in 484-FBGA with 250 I/Os (vs 10M08DAF484C8G)
- 8K LEs at the F484 pinout - mid-density sweet spot (vs 10M04DAF484I7G)
- Lowest-cost density variant with F484 footprint and 250 I/Os (vs 10M16DAF484I7G)
- Non-volatile flash instant-on (under 10 ms) (vs Lattice MachXO3-4300E)
Design Notes
The 484-FBGA uses a 1.0 mm ball pitch with a 23x23 mm body. Use a minimum 4-layer PCB with continuous ground and power planes under the BGA; microvia technology (laser-drilled 0.1 mm vias) is strongly recommended to fan out the inner balls. Estimate: at 1.0 mm pitch, fan-out routing requires via-in-pad or dog-bone patterns; verify manufacturability with your PCB fab house before committing to a 4-layer stack-up. Decoupling caps (0.1 uF plus 10 uF bulk) within 100 mils of each supply pin are critical for FPGA power integrity.
MAX 10 requires multiple supply rails: 1.2 V core, 2.5 V or 3.3 V analog/auxiliary, 3.3 V I/O bank supplies, and the 1.8 V-3.3 V configuration supply. Power-on sequencing is mandatory - the MAX 10 datasheet specifies a maximum delta-V of 0.5 V between any two rails during ramp, and the device enters configuration only after all rails are stable. Use TI TPS3808 or NXP PF0100 sequencing supervisors to guarantee order; failure to sequence correctly can cause in-rush currents up to 1 A and CRC failures on the user flash.
At industrial temperatures (-40 to +100 C), the 10M08DAF484I7G may dissipate up to 2 W under heavy logic utilization. Estimate: with theta_JA of approximately 25 C/W on a 4-layer JEDEC board, 2 W dissipation results in a 50 C junction temperature rise above ambient. Within the industrial envelope, this typically keeps Tj below 125 C, but for sealed enclosures with limited airflow, derate logic utilization by 20-30% or attach a small 10x10 mm copper heatsink on the top side of the package. The device includes a thermal diode that can be read by the embedded ADC for thermal monitoring.
Common pitfalls when designing with the 10M08DAF484I7G: (1) failing to assign all VCCINT/VCCIO pins - unused bank pins still need a valid supply for ESD diodes to function; (2) tying JTAG TCK/TMS/TDO/TDI directly to a 3.3 V host without series resistors - this can damage the FPGA's input buffers during hot-plug; (3) using a long JTAG chain with TCK above 25 MHz - MAX 10 has a maximum TCK of 25 MHz in JTAG mode; (4) ignoring the dual-purpose configuration pin assignment, which can lock out JTAG if MSEL is misconfigured. Always confirm MSEL[3:0] against the chosen configuration mode before taping out the PCB.
Compliance Information
RoHS compliant per 'G' suffix in MPN (lead-free terminal finish). REACH compliant per distributor product listings. Not AEC-Q100 qualified - the I7G is industrial grade (-40 to +100 C) but not automotive-qualified. For AEC-Q100 needs, consult Intel automotive-grade MAX 10 variants. Halogen-free status not explicitly stated in the verified web data.
