10M08SAU169C8G - MAX 10 FPGA, 8K Logic Elements, 169-LFBGA | Intel
MPN: 10M08SAU169C8G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.8 | $168.00 |
| 100 | $14.95 | $1,495.00 |
| 500 | $13.2 | $6,600.00 |
| 1,000 | $11.85 | $11,850.00 |
Drop-in alternatives for 10M08SAU169C8G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M08SAU169A7G
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$10.5 / Unit
View Datasheet →10M08SAM153C8G
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View Datasheet →10M08SAE144C8G
✅ Drop-In✓ In Stock
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View Datasheet →10M04SAU169C8G
✅ Drop-In📋 Reference alternative (not in catalog)
10M04SAU169I7G
✅ Drop-In✓ In Stock
$15.1 / Unit
View Datasheet →10M08SAU169C8G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements (LE) | 8000 |
| Embedded Memory (bits) | 387072 |
| User I/Os | 130 |
| Package | 169-LFBGA (UBGA-169, 11x11 mm, 0.8 mm pitch) |
| Mounting Type | Surface Mount |
| Configuration Memory | On-chip dual-configuration flash |
| PLLs | 4 analog + 2 fractional |
| ADC | On-chip ADC support |
| Operating Temperature | -40C to +100C (industrial) |
| Speed Grade | C8 (-8) |
| Process Node | 55 nm embedded flash |
| Supply Voltage | Core 1.2 V typical; I/O up to 3.3 V |
| RoHS Status | RoHS compliant |
| Configuration Interface | JTAG, Active Serial (AS) |
| DSP Blocks | Yes |
10M08SAU169C8G 169-lfbga (ubga-169, 11x11 mm, 0.8 mm pitch) Pin Configuration Guide
Complete pinout information for 10M08SAU169C8G (169-lfbga (ubga-169, 11x11 mm, 0.8 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M08SAU169C8G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M08SAU169C8G is suitable for 6 applications: Industrial Motor Control, Programmable Logic Controller (PLC), Sensor Aggregation IoT Gateway, Video Bridging and Display Controllers, Custom ASIC Prototyping, Automotive-Grade Sub-Systems (Industrial Variant).
Industrial Motor Control
The 10M08SAU169C8G's 8,000 logic elements and 130 user I/Os deliver the right balance of deterministic logic and PWM generator channels for industrial motor drives. The device can implement field-oriented control (FOC) state machines, encoder feedback logic, and safety interlocks in a single chip, replacing discrete MCU plus CPLD designs. Its on-chip flash enables instant-on behavior at less than 10 ms, critical for safety-rated servo loops that must be ready before drive enable. With 387 Kbits of embedded SRAM, the FPGA can buffer up to several hundred microseconds of ADC samples at typical 10 kHz current-loop rates, freeing the companion MCU to focus on higher-level supervisory functions. The industrial temperature rating (-40C to +100C) suits factory-floor cabinets.
Recommended
Programmable Logic Controller (PLC)
The 10M08SAU169C8G is well suited as the deterministic logic core of a PLC or remote I/O module. Its 8K logic elements can implement scan-cycle state machines, I/O debounce, and IEC 61131-3 compatible function blocks alongside an external Cortex-M host. The 130 user I/Os accommodate multi-protocol industrial buses - SPI for ADC/DAC chaining, UART for RS-485 transceivers, and GPIO for optocoupler-isolated digital I/O. On-chip dual-configuration flash enables remote firmware update with rollback, satisfying the IEC 61131-2 update requirements common in process automation. The 169-ball BGA provides ample I/O headroom for 32-64 channel digital I/O modules.
Recommended
Sensor Aggregation IoT Gateway
The 10M08SAU169C8G's on-chip ADC and 130 user I/Os enable direct interfacing with analog sensors (temperature, pressure, current) and digital buses (I2C, SPI, UART) without external glue logic. Its 8K logic elements can run lightweight protocol stacks (Modbus RTU, CAN, LoRaWAN preprocessing) on-chip. The 387 Kbits of embedded SRAM buffer aggregated telemetry before forwarding to a wireless SoC via SPI or UART, while dual-configuration flash supports secure over-the-air (OTA) firmware updates with rollback. Operating at less than 1 W typical power, the MAX 10 is attractive for solar or battery-powered edge nodes in industrial IoT.
Recommended
Video Bridging and Display Controllers
The 10M08SAU169C8G bridges legacy parallel RGB / LVDS display interfaces to modern MIPI-DSI or HDMI sinks in industrial HMIs and kiosks. Its 130 user I/Os handle wide parallel display buses and the embedded SRAM can store up to two full QVGA frames for line buffering. The on-chip PLLs generate pixel clocks up to the supported Fmax at the -8 speed grade, while the Quartus IP catalog provides ready-made display timing controllers. Industrial temperature rating supports outdoor digital signage and factory HMI panels.
Recommended
Custom ASIC Prototyping
The 10M08SAU169C8G is widely used as a fast-turn ASIC prototype platform thanks to its reconfigurable LE fabric, embedded block RAM, and Quartus-supported synthesis from Verilog/VHDL. Engineers targeting mid-volume ASICs in the 5K-10K gate-equivalent range can validate RTL on this FPGA, then migrate the verified design to a foundry process with confidence. The 130 user I/Os and 169-ball BGA package offer real-world pin density matching the eventual ASIC pad ring. On-chip flash enables rapid design iterations without external boot PROM management.
Recommended
Automotive-Grade Sub-Systems (Industrial Variant)
While the 10M08SAU169C8G is industrial-grade (not AEC-Q100), it is used in non-safety automotive subsystems such as in-cabin infotainment assist logic, body controller pre-processing, and aftermarket telematics where the operating environment is gentler than under-hood. The industrial temperature rating covers cabin environments, and the on-chip flash simplifies BOM. Designers requiring AEC-Q100 must migrate to the explicitly automotive-qualified MAX 10 variant.
Recommended
Recommended Products Summary
Engineering reference data for 10M08SAU169C8G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M08SAU169A7G | 10M08SAM153C8G | 10M08SAE144C8G | 10M04SAU169C8G | 10M04SAU169I7G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 169-LFBGA (UBGA-169) | 169-LFBGA (UBGA-169) | 153-MBGA | 144-EQFP | 169-LFBGA (UBGA-169) | 169-LFBGA (UBGA-169) |
| Logic Elements | 8000 | 8000 | 8000 | 8000 | 4000 | 4000 |
| Embedded Memory (bits) | 387072 | 387072 | 387072 | 387072 | 189440 | 189440 |
| User I/Os | 130 | 130 | 112 | 101 | 130 | 130 |
| Speed Grade | C8 (-8) | A7 (-7, faster) | C8 (-8) | C8 (-8) | C8 (-8) | I7 (-7) |
| Operating Temperature | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C |
| Configuration Memory | On-chip dual flash | On-chip dual flash | On-chip dual flash | On-chip dual flash | On-chip dual flash | On-chip dual flash |
Key Differentiators
- 8K logic elements with on-chip flash in 169-ball BGA (vs 10M04SAU169C8G)
- Instant-on from on-chip flash (vs Lattice MachXO2-1200)
- Faster A7 speed grade available in identical package (vs 10M08SAU169C8G)
Design Notes
The 169-ball LFBGA at 0.8 mm pitch requires a 4-layer PCB at minimum, with via-in-pad or microvia construction recommended for reliable BGA assembly. Per the MAX 10 Hardware Reference Guide, place 0.1 uF and 10 uF decoupling capacitors adjacent to each power pin pair (VCCINT/VCCAUX/VCCIO), and route the GND return as a continuous plane under the BGA. Avoid routing high-speed signals across the BGA's center row to minimize stub effects on DDR3 interfaces.
Estimated: at 8K LE utilization near 70% and a 100 MHz toggle rate, the 10M08SAU169C8G core typically consumes approximately 0.4-0.7 W plus I/O power. With VCCINT = 1.2 V and VCCIO = 3.3 V, designers should budget at least 1.5 W worst-case. Use a low-dropout regulator with 3 A peak capability if DDR3 memory I/O is enabled, since DDR3 termination draws transient bursts exceeding 2 A.
Do not confuse the C8 speed grade (slower, lower cost) with the A7 speed grade (faster) when ordering - same MPN letter pattern (8G) means RoHS-compliant industrial, but speed grade C8 vs A7 affects Fmax. Also, the MAX 10 device does not support 5V tolerant I/O; voltage translators are required for legacy 5V peripherals. Finally, JTAG chain ordering matters when the MAX 10 shares a JTAG bus with a host CPU - the MAX 10 must be configured to bypass mode in the BSDL file before chain scanning.
Place the 50 MHz or 100 MHz external reference clock within 1 cm of the CLK pin to minimize jitter. Keep PLL analog supplies (VCCA_PLL) isolated with a ferrite bead and 10 uF + 0.1 uF decoupling to reduce jitter on high-speed serial interfaces. Route DDR3 differential clocks (CK/CK#) with 100 ohm differential impedance and length matching within 5 mils across the byte lane.
Compliance Information
RoHS compliance per product page G-suffix designation; not AEC-Q100 qualified (industrial grade only). REACH compliance not explicitly stated in verified data - marked unknown.
