5CGXBC5C7U19C8N - Cyclone V GX FPGA, 77K LE, 484-FBGA | Intel
MPN: 5CGXBC5C7U19C8N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $165 | $165.00 |
| 10 | $152.5 | $1,525.00 |
| 100 | $138 | $13,800.00 |
| 500 | $124.5 | $62,250.00 |
| 1,000 | $112 | $112,000.00 |
Drop-in alternatives for 5CGXBC5C7U19C8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →5CGXBC5C7U19C8N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V GX |
| Series | 5CGXBC5 |
| Logic Elements (LE) | 77000 |
| Embedded Memory | 5001216 bits (approx. 4889 Kbits) |
| Maximum User I/O | 224 |
| Process Technology | 28 nm |
| Core Voltage | 1.1 V |
| Transceivers | Integrated (Cyclone V GX family supports up to 3.125 Gbps) |
| Package | 484-FBGA (UBGA, 22x22 mm, 1.0 mm pitch) |
| Pin/Package Count | 484 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +85C (commercial) |
| Speed Grade | C8 |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Configuration Method | AS / PS (supported by Cyclone V family) |
5CGXBC5C7U19C8N 484 Pin Configuration Guide
Complete pinout information for 5CGXBC5C7U19C8N (484 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CGXBC5C7U19C8N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CGXBC5C7U19C8N is suitable for 7 applications: Industrial Machine Vision and Image Processing, Low-Cost PCIe Gen2 Endpoint Cards, Telecom Line Cards and Protocol Bridging, Broadcast Video Processing and Pro-AV I/O, Automotive Infotainment and Driver-Assistance Pre-Processing, Industrial Wireless Baseband and SDR Front-Ends, Test and Measurement Instrumentation.
Industrial Machine Vision and Image Processing
The 5CGXBC5C7U19C8N's 77K logic elements and variable-precision DSP blocks provide the parallel arithmetic throughput required for real-time image processing pipelines such as Bayer demosaicing, edge detection, and histogram equalization. Its 224 user I/Os comfortably accommodate parallel Camera Link or LVDS image-sensor interfaces plus GPIO for trigger and lighting control, while the integrated transceivers stream processed video over Gigabit Ethernet to a host PC. The Cyclone V GX 28 nm process keeps typical fabric power low enough for fan-less industrial PCs.
Recommended
Low-Cost PCIe Gen2 Endpoint Cards
The 5CGXBC5C7U19C8N integrates hardened PCIe Gen2 IP cores with multi-gigabit transceivers, enabling low-cost x1 or x4 PCIe endpoint designs without external PHY chips. The 484-UBGA package exposes enough transceiver channels for x1/x2 lanes while leaving room for application logic, DMA engines, and driver interfaces. Compared with soft PCIe on smaller FPGAs, the hard IP dramatically reduces compile time and LUT overhead.
Recommended
Telecom Line Cards and Protocol Bridging
The 5CGXBC5C7U19C8N's multi-gigabit transceivers support CPRI, Serial RapidIO, and Gigabit Ethernet, making it well-suited for telecom line cards that bridge between baseband processors and remote radio heads. The 4.46 Mbits of embedded block RAM buffers payload data between domains, while 224 user I/Os provide ample parallel connectivity to backplane SERDES, sync Ethernet clocks, and external memory. Quartus Prime IP cores accelerate CPRI and SRIO integration.
Recommended
Broadcast Video Processing and Pro-AV I/O
The 5CGXBC5C7U19C8N is widely deployed in broadcast video routers, format converters, and pro-AV I/O extenders where SDI and HDMI streams must be processed in real time. Its DSP blocks handle chroma upsampling and scaling, while the transceivers carry 3G-SDI or HDMI over coax/fiber with low deterministic latency. The commercial temperature grade suits studio and OB-van environments, and the 484-UBGA package supports dense PCB layouts behind BNC connectors.
Recommended
Automotive Infotainment and Driver-Assistance Pre-Processing
Although the commercial-temperature 5CGXBC5C7U19C8N is not AEC-Q100 qualified, the same 484-UBGA footprint is available in the automotive-grade 5CGXBC5C7U19A7N variant, which shares the FPGA fabric. Design teams use the commercial part for early prototyping and software bring-up, then migrate to the A7 variant for production. The integrated transceivers carry LVDS camera and automotive Ethernet streams, and the 28 nm process keeps power low for in-cabin electronics.
Recommended
Industrial Wireless Baseband and SDR Front-Ends
The 5CGXBC5C7U19C8N's DSP blocks, embedded memory, and transceivers form a flexible baseband processing engine for software-defined radio and industrial wireless protocols such as Wi-Fi, LoRa, and private LTE. Up to 224 user I/Os connect to RF front-end modules, ADC/DAC channels, and host processors, while Quartus Prime DSP Builder accelerates FIR filter and FFT implementation. The 28 nm low-power process suits fan-less outdoor enclosures.
Recommended
Test and Measurement Instrumentation
The 5CGXBC5C7U19C8N's parallel processing fabric, high-speed transceivers, and abundant memory make it a strong choice for protocol-aware test instruments such as logic analyzers, protocol exercisers, and Bit Error Rate Testers. The device can simultaneously drive multiple test channels, capture and timestamp data, and stream results over PCIe or Ethernet to host software. The 484-UBGA package is large enough to support pin-compatible migration to higher-density Cyclone V GX parts as feature sets grow.
Recommended
Recommended Products Summary
Engineering reference data for 5CGXBC5C7U19C8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CGXBC5C7U19I7N | 5CGXBC5C7U19A7N | 5CEFA9F27C7N | 5CGTFD7D5F27I7N | 5CGTFD9A5U19A7N | 5CEBA4F23C8N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-UBGA (U19) | 484-UBGA (U19) | 484-UBGA (U19) | 484-FBGA | 484-FBGA | 484-UBGA (U19) | 484-FBGA |
| Family | Cyclone V GX | Cyclone V GX | Cyclone V GX | Cyclone V E | Cyclone V GT | Cyclone V GT | Cyclone V E |
| Logic Elements | 77000 | 77000 | 77000 | ~9400 | ~150000 | ~300000 | ~49000 |
| Embedded Memory | 5001216 bits | 5001216 bits | 5001216 bits | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Maximum User I/O | 224 | 224 | 224 | ~224 | ~290 | ~224 | ~224 |
| Transceivers | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | None (Cyclone V E) | Up to 6.144 Gbps | Up to 6.144 Gbps | None (Cyclone V E) |
| Temperature Grade | Commercial (0C to +85C) | Industrial (-40C to +100C) | Automotive (-40C to +125C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Automotive (-40C to +125C) | Commercial (0C to +85C) |
| Speed Grade | C8 | I7 | A7 | C7 | I7 | A7 | C8 |
Key Differentiators
- Industrial temperature variant shares exact 484-UBGA footprint (vs 5CGXBC5C7U19I7N)
- Higher-density Cyclone V GT option exists in same 484-UBGA footprint (vs 5CGTFD9A5U19A7N)
- Lower-cost Cyclone V E option in pin-compatible footprint (vs 5CEBA4F23C8N)
Design Notes
Cyclone V GX devices require multiple independent power rails: VCC (1.1 V core), VCCAUX (2.5 V), VCCAUX_RX, VCCAUX_TX, VCCPLL (1.1 V or 2.5 V), VCCPD (2.5 V/3.0 V/3.3 V), and per-bank VCCIO for each I/O bank. Power-on and power-off sequencing must follow the manufacturer's Power-Up and Power-Down Sequences section in the device handbook; failure to sequence correctly can latch-up I/O buffers. Use a multi-rail power IC with programmable ramp rates and PG signals to enforce sequencing. Decoupling should follow the reference design - typically 100 nF X7R per power pin plus 10 uF and 100 uF bulk caps near the supply pins.
Although the 28 nm process keeps static power modest, dynamic power scales with toggle rate and clock frequency. Estimated: at 80% utilization and 250 MHz fabric clock, total power dissipation is typically 3-5 W on a 77K-LE Cyclone V GX design. The 484-UBGA package relies primarily on PCB copper pour for heat removal; allocate at least 4 square inches of 2 oz copper on top and inner layers connected to the central ground pad. For high-toggling or high-transceiver-throughput designs, an internal heat spreader or bottom-mounted heat sink may be required.
The 484-UBGA has a 1.0 mm ball pitch, which is achievable with 4-layer or 6-layer HDI PCB processes (micro-via or laser-drilled stacked vias preferred). Use the manufacturer's pinout guidelines to assign high-speed transceiver channels to the correct ball locations - moving a channel even one ball breaks the AC matching. Provide 100-ohm differential routing for all transceiver pairs, with length matching within 150 mils across a channel. Place AC-coupling capacitors as close to the FPGA transmit pins as the AC-coupling plan requires.
Three common mistakes when designing with the 5CGXBC5C7U19C8N: (1) using a non-AEC-Q100 part in safety-critical automotive designs - migrate to the A7 suffix; (2) forgetting that the C8 speed grade is the slowest commercial grade - designs that need higher Fmax must migrate to C7 or I7; (3) attempting to migrate a U19 484-UBGA design to an F27 672-FBGA without re-running pin assignments - the additional balls expose more I/Os but the ball map is not a superset. Always re-run pin assignment and timing closure in Quartus Prime after any package migration.
Place configuration devices (EPCS/EPCQ flash) within 4 inches of the FPGA configuration pins to avoid signal integrity issues on the AS data line. The JTAG chain should include a 10 kohm pull-up on TCK, TDI, and TMS per the JTAG specification, and a buffer on TDO if the chain is longer than 6 inches. For high-speed designs, dedicate an entire inner PCB layer to GND directly under the FPGA BGA field to provide a low-impedance return path and to control impedance for break-out traces.
Compliance Information
RoHS and lead-free per Intel product declarations. Commercial temperature grade (0C to +85C) - not AEC-Q100 qualified; choose 5CGXBC5C7U19A7N for automotive. REACH and conflict-minerals compliance per Intel's published CMRT and declaration documents.
