5M1270ZF324A5N - MAX V 980-Macrocell CPLD 1.8V FBGA-324 | Altera
MPN: 5M1270ZF324A5N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $26.75 | $267.50 |
| 100 | $23.4 | $2,340.00 |
| 500 | $20.1 | $10,050.00 |
| 1,000 | $17.85 | $17,850.00 |
Drop-in alternatives for 5M1270ZF324A5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5M1270ZF324C5N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$7.5 / Unit
View Datasheet →5M1270ZF324I5N
✅ Drop-In✓ In Stock
$13.95 / Unit
View Datasheet →5M1270ZF256A5N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$24.1 / Unit
View Datasheet →5M1270ZF256I5N
✅ Drop-In✓ In Stock
$7.55 / Unit
View Datasheet →5M1270ZF324A5N Maximum Ratings & Electrical Characteristics
| Family | MAX V CPLD |
| Macrocells | 980 |
| User I/Os | 271 |
| Logic Elements (approx) | 1280 |
| User Flash Memory | 8 Kbits |
| Propagation Delay | 10 ns |
| Internal Frequency (max) | 201.1 MHz |
| Core Supply Voltage | 1.8 V |
| Core Current (typ) | 2 mA |
| I/O Standards | LVTTL, LVCMOS (1.5/1.8/2.5/3.3 V) |
| Package | FBGA-324 (324-ball), 19x19 mm, 1.0 mm pitch |
| Operating Temperature | -40 C to +85 C (industrial) |
| Configuration Technology | Flash (non-volatile, instant-on) |
| Programming Interface | JTAG (IEEE 1149.1), IEEE 1532 ISP |
| Mounting Type | Surface Mount |
| MSL Level | 3 (168 hours) |
| RoHS Status | Compliant |
5M1270ZF324A5N fbga-324 (324-ball), 19x19 mm, 1.0 mm pitch Pin Configuration Guide
Complete pinout information for 5M1270ZF324A5N (fbga-324 (324-ball), 19x19 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5M1270ZF324A5N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5M1270ZF324A5N is suitable for 6 applications: Microcontroller I/O Expansion & Bus Bridging, Power-Sequence & Reset Controller, Industrial Control & Factory Automation, LED Display Driver & Signage Controller, Communication Interface Bridging, Automotive Driver-Assistance Subsystems.
Microcontroller I/O Expansion & Bus Bridging
The 5M1270ZF324A5N's 271 user I/Os and 980 macrocells make it ideal for expanding microcontroller or low-pin-count processor I/O, enabling parallel bus bridging, address decoding, and signal multiplexing. Its 10 ns propagation delay ensures sub-50 ns latency for register-read and interrupt-handling paths, while 1.8 V core operation at 2 mA typical keeps power dissipation under 4 mW. Compared with FPGAs, the instant-on flash configuration eliminates external boot memory and shortens system startup, a critical benefit in industrial controllers and POS terminals.
Recommended
Power-Sequence & Reset Controller
The 5M1270ZF324A5N excels as a multi-rail power-sequence and reset controller in server, telecom, and industrial systems. Its 980 macrocells implement complex state machines that sequence 3-8 voltage rails with programmable delays, monitor PG (power-good) feedback, and generate reset pulses to downstream processors. The 10 ns propagation delay and 201.1 MHz fMAX support fast fault-detection and supervisory response times below 100 ns. The non-volatile flash configuration ensures the sequencing logic is active immediately at power-up, before any digital controller boots.
Recommended
Industrial Control & Factory Automation
With its industrial -40 to +85 C temperature rating, 271 I/Os, and 8 Kbits of user flash, the 5M1270ZF324A5N is well suited for factory-automation I/O modules, PLCs, and motor-control interfaces. The device aggregates field-bus signals (24 V digital inputs, encoder outputs) and presents them to a host controller through a parallel or SPI bus. Its JTAG/IEEE 1532 ISP enables in-field firmware updates without removing modules from service. The low 2 mA core current and 1.8 V operation reduce thermal load in sealed enclosures.
Recommended
LED Display Driver & Signage Controller
The 5M1270ZF324A5N's 271 user I/Os can drive large multi-segment LED displays and matrix signage by multiplexing rows and columns at high refresh rates. The 201.1 MHz internal frequency supports PWM dimming above 1 kHz, eliminating visible flicker, while the 980 macrocells implement gamma-correction and brightness-uniformity logic per channel. Flash-based configuration stores display patterns and animation sequences without external memory, reducing BOM cost. The 1.8 V core and 2 mA quiescent current suit battery-backed digital-signage installations.
Recommended
Communication Interface Bridging
The 5M1270ZF324A5N is widely used as a glue-logic bridge between processors and peripheral buses such as I2C, SPI, UART, parallel RGB, and legacy interfaces. Its 980 macrocells implement protocol converters and bus-arbitration state machines, while the 271 I/Os provide ample fan-out to multiple peripherals. The 10 ns propagation delay is fast enough for 50 MHz parallel RGB-to-LVDS conversion in display applications. Non-volatile flash configuration ensures the bridge is operational before the host processor boots, simplifying multi-SoC designs.
Recommended
Automotive Driver-Assistance Subsystems
Although the 5M1270ZF324A5N is industrial-grade rather than AEC-Q100 qualified, it is used in non-safety automotive subsystems such as infotainment I/O expansion, instrument-cluster multiplexing, and body-control modules. Its 271 I/Os aggregate switch, sensor, and actuator signals; 980 macrocells implement LIN/CAN-like protocol handling and debounce/filter logic. The -40 to +85 C industrial temperature range covers most cabin environments. Designers targeting AEC-Q100 must validate the device against the automotive qualification matrix or migrate to AEC-Q100-qualified MAX V variants.
Recommended
Recommended Products Summary
Engineering reference data for 5M1270ZF324A5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5M1270ZF324C5N | 5M1270ZF324I5N | 5M1270ZF256A5N | 5M1270ZF256I5N |
|---|---|---|---|---|---|
| Brand | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) |
| Package | FBGA-324 (19x19 mm, 1.0 mm pitch) | FBGA-324 (same footprint) | FBGA-324 (same footprint) | FBGA-256 (different footprint, smaller) | FBGA-256 (different footprint, smaller) |
| Macrocells | 980 | 980 | 980 | 980 | 980 |
| User I/Os | 271 | 271 | 271 | 212 | 212 |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Propagation Delay | 10 ns | 10 ns | 10 ns | 10 ns | 10 ns |
| Temperature Grade | Industrial (-40 to +85 C) | Commercial (0 to +85 C) | Industrial (-40 to +85 C) | Industrial (-40 to +85 C) | Industrial (-40 to +85 C) |
| Configuration Technology | Flash (non-volatile) | Flash (non-volatile) | Flash (non-volatile) | Flash (non-volatile) | Flash (non-volatile) |
Key Differentiators
- Highest I/O count in MAX V family at 271 (vs 5M1270ZF256A5N)
- Industrial temperature range with same die (vs 5M1270ZF324C5N)
- Flash-based instant-on configuration (vs Small SRAM FPGAs (Cyclone series))
Design Notes
The FBGA-324 1.0 mm pitch requires HDI PCB stack-up with laser-drilled microvias. Use a 4-layer minimum stack-up with 1 oz copper on outer layers and 0.5 oz on inner power/ground planes. Place 0.1 uF X7R 0402 ceramic decoupling capacitors within 100 mils of every VCC and GND ball pair. Estimated: total decoupling count is approximately 30-50 capacitors for full 324-ball BGA coverage.
Estimated: At 1.8 V core and 2 mA typical current, core power dissipation is approximately 3.6 mW (1.8 V x 2 mA). Total device power including I/O switching depends on toggle rate; at 50% toggle rate across 271 LVCMOS 3.3 V outputs driving 5 pF loads, I/O power can reach 0.5-1 W. Provide a continuous ground plane directly under the BGA for thermal spreading; the FBGA-324 package does not require an explicit heatsink for industrial applications.
Do not connect 5 V signals directly to MAX V I/O without proper external components - although MAX V I/O is 5 V-tolerant with proper configuration, always consult the datasheet's absolute-maximum ratings section. When migrating between A5N (industrial) and C5N (commercial) variants, do not exceed the commercial temperature range or timing behavior may degrade. Ensure JTAG chain integrity by adding 10 kohm pull-ups on TCK and pull-downs on TMS to prevent spurious configuration in noisy industrial environments.
For high-speed LVDS or 100 MHz+ LVCMOS signals on the 5M1270ZF324A5N, perform signal-integrity simulation with the IBIS model from Altera. Match trace lengths within 100 mils for parallel buses to avoid skew. Series-terminate clock outputs with 33 ohm resistors near the driver to dampen reflections on long PCB traces. Use impedance-controlled routing (50 ohm single-ended, 100 ohm differential) on layers adjacent to a continuous ground plane.
Compliance Information
Industrial temperature grade per verified web data; not AEC-Q100 qualified. RoHS compliant per Altera/Intel product family documentation.
