A3PE3000-1FG484I - ProASIC3E Flash FPGA 3M Gates | Microchip
MPN: A3PE3000-1FG484I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $175 | $175.00 |
| 10 | $162.5 | $1,625.00 |
| 100 | $148 | $14,800.00 |
| 500 | $136 | $68,000.00 |
| 1,000 | $125 | $125,000.00 |
Drop-in alternatives for A3PE3000-1FG484I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A3PE3000-1FGG484I
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View Datasheet →A3PE3000L-1FG484I
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View Datasheet →A3PE3000-1FG484I Maximum Ratings & Electrical Characteristics
| Family | ProASIC3E Flash FPGA |
| System Gates | 3,000,000 |
| User I/Os | 341 |
| Embedded Memory | 516096 bits (504 kbits) true dual-port SRAM |
| Speed Grade | -1 |
| Maximum System Frequency | 272 MHz |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm, 7-layer metal (6 copper) flash-based CMOS |
| Configuration | Flash-based, non-volatile, live at power-up (Level 0) |
| Soft CPU Support | Optional soft ARM support |
| Package | 484-ball FBGA, 1 mm pitch |
| Mounting Type | Surface Mount |
| Packaging | Tray |
| Logic Family | CMOS |
| Temperature Grade Suffix | I (Industrial) |
A3PE3000-1FG484I 484-ball fbga, 1 mm pitch Pin Configuration Guide
Complete pinout information for A3PE3000-1FG484I (484-ball fbga, 1 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE3000-1FG484I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE3000-1FG484I is suitable for 6 applications: Industrial Automation and Motor Control, Aerospace and Defense Subsystems, Communications and Networking Line Cards, Test and Measurement Instrumentation, Medical Equipment Control Logic, Secure Embedded Control and Bridge Logic.
Industrial Automation and Motor Control
Flash-based instant-on configuration makes the A3PE3000-1FG484I a strong fit for industrial automation controllers and multi-axis motor drive logic, where deterministic startup without a bootloader or external configuration device reduces boot time to milliseconds. The 3M-gate fabric integrates PWM generators, quadrature encoder interfaces, and safety interlock logic, while 504 kbits of true dual-port SRAM buffers motion profiles between a host CPU and drive stages. With 341 user I/Os at industrial temperature rating, the device handles dense sensor and actuator interfacing on a single chip. Placed as the main sequencer between a PLC processor and power stages, it adds no configuration boot latency but designers should budget the 1.5V core rail current against the design's toggle rate.
Recommended
Aerospace and Defense Subsystems
The A3PE3000-1FG484I suits aerospace and defense payloads because ProASIC3E flash cells are non-volatile and highly secure - there is no external bitstream readback or load phase to attack, and the device is live at power-up (Level 0), which matters for time-critical telemetry and flight-control interfaces. The 3M system gates implement protocol bridges, CRC/checksum engines, and reconfigurable interface logic, while industrial temperature grading and hermetic-friendly FBGA packaging support harsh-environment boards. In a typical architecture the FPGA sits between mission processors and sensor or bus interfaces, providing glue logic that can be reprogrammed in the field. The trade-off versus rad-tolerant families is radiation performance - designers must assess mission-level radiation requirements separately.
Recommended
Communications and Networking Line Cards
Line-card and backplane-interface designs benefit from the A3PE3000-1FG484I's combination of 272 MHz -1 speed grade timing, 504 kbits of true dual-port SRAM for FIFO and packet-buffer functions, and 341 flexible I/Os for multiple signaling standards on a single device. Flash configuration means a line card enumerates instantly after power good, simplifying hot-swap sequencing versus SRAM FPGAs that must load a bitstream. Typical usage places the device between MAC/PHY devices and a backplane interface, implementing rate adaptation, framing, and statistics counters in fabric. The true dual-port SRAM allows simultaneous ingress and egress buffering at independent clock domains. Designers should verify timing closure on the fastest interface paths at the -1 grade in Libero SoC before committing.
Recommended
Test and Measurement Instrumentation
Bench and modular instruments use the A3PE3000-1FG484I as a reconfigurable timing, trigger, and acquisition engine. The 3M-gate fabric implements time-stamping counters, trigger state machines, and data formatting, while 504 kbits of true dual-port SRAM capture waveform segments or hold calibration tables. The instant-on flash configuration ensures the instrument's acquisition hardware is ready as soon as power settles - an advantage in rack systems with strict boot-time specifications. With 341 user I/Os, one device can interface acquisition front ends, display logic, and host bus connections. Because instrument designs evolve through firmware updates, the flash-based reprogrammability allows in-field feature upgrades via Microchip's Libero toolchain without changing hardware.
Recommended
Medical Equipment Control Logic
Medical imaging and diagnostic platforms value the A3PE3000-1FG484I for its single-chip, secure, non-volatile configuration - flash cells eliminate the external bitstream path that can complicate design assurance documentation, and instant-on operation meets interlock and safety-logic requirements that must be active immediately at power-up. The 3M gates implement sensor timing, detector readout sequencing, and host interface bridging, with 504 kbits of dual-port SRAM handling sample buffers. Industrial-grade temperature rating provides margin for equipment with elevated internal ambient temperatures near power electronics. In a typical architecture the FPGA orchestrates detector timing while a host processor runs the application UI, communicating over standard bus interfaces implemented in fabric.
Recommended
Secure Embedded Control and Bridge Logic
Secure single-chip control and protocol-bridge designs are a natural fit for the A3PE3000-1FG484I because the flash fabric stores configuration internally with no bitstream download at boot, reducing attack surface compared to SRAM FPGAs that expose configuration data externally. The optional soft ARM support noted by Microchip allows an embedded processor core in fabric alongside custom security logic, enabling self-contained controllers. The 341 user I/Os span multiple standards, letting one device bridge legacy parallel buses to serial interfaces while enforcing protocol checks. The design trade-off: soft-core performance is modest at the 272 MHz fabric limit, so security-critical datapaths rather than high-throughput processing should dominate the utilization plan.
Recommended
Recommended Products Summary
Engineering reference data for A3PE3000-1FG484I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE3000-1FGG484I | A3PE3000-2FGG484I | A3PE3000-FG484I | A3PE3000-1FGG484 | A3PE3000L-1FG484I |
|---|---|---|---|---|---|---|
| Package | 484-ball FBGA (FG484) | 484-ball FBGA (FGG484, green) - same footprint | 484-ball FBGA (FGG484, green) - same footprint | 484-ball FBGA (FG484) - same footprint | 484-ball FBGA (FGG484, green) - same footprint | 484-ball FBGA (FG484) - same footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| Speed Grade / Max Frequency | -1 / 272 MHz | -1 / 272 MHz | -2 / higher than -1 (faster) | standard / 231 MHz | -1 / 272 MHz | -1 (ProASIC3L) |
| User I/Os | 341 | 341 | 341 | 341 | 341 | 341 |
| Embedded SRAM | 504 kbits (516096 bits) | 504 kbits | 504 kbits | 504 kbits | 504 kbits | 504 kbits |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V (low-power core) |
| Temperature Grade | Industrial (I) | Industrial (I) | Industrial (I) | Industrial (I) | Commercial | Industrial (I) |
| Power Profile | Standard ProASIC3E | Standard ProASIC3E | Standard ProASIC3E (higher dynamic at speed) | Standard ProASIC3E | Standard ProASIC3E | Low-power ProASIC3L |
Key Differentiators
- Fastest standard speed grade in the 484-ball footprint (vs A3PE3000-FG484I)
- Industrial temperature rating (vs A3PE3000-1FGG484)
- Lower-power fabric option at identical footprint (vs A3PE3000L-1FG484I)
Design Notes
Budget the 1.5V core rail using Libero SoC SmartPower analysis with realistic toggle rates rather than worst-case defaults - ProASIC3E dynamic power scales directly with switching activity, and flash-based fabric eliminates configuration surge current but not steady-state core current. Estimated: a heavily-utilized 3M-gate design toggling at typical rates can draw significant core current, so verify your regulator's thermal capability at maximum utilization. Separate clean analog supplies for sensitive I/O banks where the design interfaces precision signals.
The 484-ball FBGA at 1 mm pitch requires via-in-pad or dogbone fanout with controlled impedance on high-speed I/O banks. Follow Microchip's ProASIC3E PCB layout application guidance: decouple each VCC/VCCA bank with 0.1 uF ceramics placed within 2 mm of the ball, add bulk 10 uF per rail, and reference high-speed signals to solid ground planes. Choose FGG484 (green) package variants for lead-free reflow profiles compliant with RoHS assembly lines.
Do not swap between FG484 and FGG484 suffixes without confirming your assembly process: both share an identical ball map, but the green package reflow profile differs from older leaded profiles. Also confirm speed grade before migration - A3PE3000-FG484I (231 MHz) cannot close timing on designs verified at the -1 grade (272 MHz). Re-run static timing analysis in Libero SoC after any speed-grade or temperature-grade substitution.
Compliance Information
RoHS status not stated in provided data for the FG484 variant; green FGG484 package variants are Microchip's lead-free/halogen-free options. Verify compliance certificates on the Microchip product page before procurement.
