A3PE3000-2FG324I - ProASIC3E Flash FPGA 35K LEs | Microchip
MPN: A3PE3000-2FG324I ✓ Active| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
Drop-in alternatives for A3PE3000-2FG324I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →A3PE3000-2FG324I Maximum Ratings & Electrical Characteristics
| Manufacturer | Microchip Technology (Microsemi) |
| Family | ProASIC3E |
| Logic Elements (LEs) | 35000 LEs |
| System Gates | 3M gates |
| Maximum System Performance | 310 MHz |
| Process Technology | 130 nm flash |
| Core Supply Voltage | 1.5 V |
| Number of I/Os | 221 I/O |
| Package / Case | 324-Ball FBGA |
| Mounting Style | SMD/SMT |
| Operating Temperature (Min) | -40 C |
| Operating Temperature (Max) | +85 C |
| Speed Grade | -2 |
| Temperature Grade | Industrial (I) |
| Configuration Memory | Non-volatile Flash (single chip) |
| Packaging | Tray |
| Product Series | A3PE3000 |
A3PE3000-2FG324I 324-ball fbga Pin Configuration Guide
Complete pinout information for A3PE3000-2FG324I (324-ball fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE3000-2FG324I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE3000-2FG324I is suitable for 6 applications: Industrial Automation and Control, Aerospace and Defense Subsystems, Medical Instrumentation, Communications Bridge and Line-Card Logic, Secure and Anti-Cloning Designs, Instant-On Embedded Systems.
Industrial Automation and Control
The A3PE3000-2FG324I fits industrial automation because its 221 user I/Os absorb the mixed-signal glue logic of PLC backplanes, motor-control interfaces, and fieldbus bridges, while the industrial -40C to +85C rating covers unconditioned cabinet environments. Its 3 million gates and 310 MHz speed grade 2 fabric implement state machines, encoders, and protocol translation without external logic. Because configuration lives in on-chip non-volatile flash, the system is operational within microseconds of power-up - no configuration device to fail - and the fabric can be reprogrammed in the field for control-logic updates. Place it behind a 1.5V core rail with I/O banks set to match 3.3V or 2.5V field signals, and budget headroom in Libero timing closure for long routing paths in large state machines.
Recommended
Aerospace and Defense Subsystems
Defense and aerospace boards benefit from the flash-based fabric of the A3PE3000-2FG324I: the non-volatile configuration is inherently more robust than SRAM configuration against power interruption, exposes no bitstream on an external bus for a reduced attack surface, and comes from a Microchip/Microsemi product line with a long lifecycle suited to multi-year programs. The 35,000 LEs and 221 I/Os handle bus interfaces, telemetry formatting, and bridge logic between processors and custom peripherals, while 310 MHz-class performance covers high-rate serial formatting tasks. Designers should verify the specific environmental qualification level required by the program - the standard I-grade covers -40C to +85C, and defense programs often procure via authorized channels with traceability. Reuse the FG324 footprint across speed grades to derate or upgrade without respinning the PCB.
Recommended
Medical Instrumentation
Medical devices such as imaging front ends, patient-monitoring base stations, and lab analyzers use the A3PE3000-2FG324I as a reprogrammable interface controller between sensors, ADCs, and host processors. Its instant-on flash configuration shortens boot time - valuable in devices that must become operational quickly at power-up - and the single-chip design removes an external configuration memory whose failure would otherwise be a regulatory reliability concern. With 3 million gates, 35,000 LEs, and 221 I/Os, it implements timing generators, data formatting, and safety interlock logic, while the 310 MHz rating accommodates demanding acquisition pipelines. The industrial temperature range and SMD/SMT 324-FBGA mounting support compact, fanless enclosures typical of clinical hardware; in-field flash reprogramming enables controlled firmware updates across installed fleets.
Recommended
Communications Bridge and Line-Card Logic
In networking equipment, the A3PE3000-2FG324I serves as bridge logic between MACs, PHYs, backplane connectors, and system controllers. Speed grade 2 supports system performance up to 310 MHz, sufficient for parallel data-path retiming and protocol adaptation at line-card rates, and the 221 I/Os terminate multiple parallel buses with independent I/O-bank voltages. The flash fabric's instant-on behavior lets boards participate in the backplane immediately at power-up, simplifying bring-up sequencing in rack systems, and on-chip configuration removes the boot-device availability concern in high-availability designs. Designers should plan I/O bank assignments so mixed-voltage interfaces do not constrain floorplanning, and use Libero power estimation early since high I/O toggle rates dominate the power budget beyond the 1.5V core draw.
Recommended
Secure and Anti-Cloning Designs
The A3PE3000-2FG324I strengthens anti-cloning and IP-protection strategies because its configuration is stored in on-chip flash cells that are never exposed on an external configuration bus, unlike SRAM FPGAs whose bitstream can be intercepted during load. This makes the 3M-gate ProASIC3E a common home for proprietary algorithms, authentication state machines, and key-handling logic in commercial and defense products. The 35,000 LEs provide ample room to combine security logic with functional bridge logic on one chip, reducing the attack surface further, and the 310 MHz fabric keeps authentication overhead out of critical paths. For strongest protection, combine flash FPGA configuration with design-level measures such as readback-disabled programming and lifecycle management through Microchip's programming tools in the production flow.
Recommended
Instant-On Embedded Systems
Systems that must be functional within milliseconds of power application - camera trigger controllers, test-fixture sequencers, sensor hubs, and industrial gateways - exploit the defining property of the A3PE3000-2FG324I: non-volatile flash configuration with no external boot device. There is no configuration load time, so 3 million gates of custom logic begin operating essentially at power-good, eliminating the hundreds of milliseconds SRAM FPGAs spend loading from external flash. With 35,000 LEs, 221 I/Os, and a 1.5V core on a 130 nm flash process, the device implements substantial control planes while the I suffix guarantees -40C to +85C operation. Design tip: still sequence I/O banks deliberately relative to the core rail, because instant-on logic can drive pins before connected processors are ready.
Recommended
Recommended Products Summary
Engineering reference data for A3PE3000-2FG324I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE3000-2FG324 | A3PE3000-FG324I | A3PE3000-2FGG324 | A3PE3000L-1FG324I |
|---|---|---|---|---|---|
| Package | 324-Ball FBGA | 324-Ball FBGA - same | 324-Ball FBGA - same | 324-Ball FBGA - same | 324-Ball FBGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Speed Grade | -2 (310 MHz) | -2 (310 MHz) | -1 (slower) | -2 (310 MHz) | -1 (slower) |
| Temperature Range | -40C to +85C (Industrial) | Commercial | -40C to +85C (Industrial) | Commercial | -40C to +85C (Industrial) |
| System Gates | 3M gates | 3M gates | 3M gates | 3M gates | 3M gates |
| Logic Elements | 35000 LEs | 35000 LEs | 35000 LEs | 35000 LEs | 35000 LEs |
| User I/Os | 221 | 221 | 221 | 221 | 221 |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.2V-1.5V (flexible, L family) |
| Power Optimization | Standard ProASIC3E | Standard ProASIC3E | Standard ProASIC3E | Standard ProASIC3E | Flash*Freeze: ~40% lower dynamic / ~50% lower static power |
Key Differentiators
- Fastest standard speed grade in the FG324 footprint (vs A3PE3000-FG324I)
- Industrial temperature qualification (vs A3PE3000-2FG324)
- Full performance versus low-power option (vs A3PE3000L-1FG324I)
- Non-volatile single-chip flash configuration (vs SRAM FPGAs (cross-family))
Design Notes
Budget the 1.5V core rail using Libero SoC power estimation with your actual utilization and toggle-rate assumptions, not the family maximum. ProASIC3E power is dominated by core switching at speed grade 2 and by I/O bank current when many of the 221 I/Os toggle. Decouple each VCC/VCCI bank with bulk and high-frequency ceramics near the balls, and sequence core before or per the datasheet power-up requirements to avoid latch-up during hot insertion. For battery or thermally limited builds, consider the pin-compatible A3PE3000L-1FG324I, which adds Flash*Freeze and cuts dynamic power about 40% and static power about 50% versus the standard die.
The 324-ball FBGA requires a defined land pattern and careful escape routing; download the verified footprint from SnapEDA or the Microchip library rather than deriving one, and export to Altium, KiCad, or Allegro as needed. Plan I/O bank voltage assignment early: each VCCI bank must match its connected bus standard (e.g., 3.3V or 2.5V), and bank boundaries constrain which balls can serve which interface. Reserve programming access per the ProASIC3E datasheet programming chapter, and keep configuration/programming traces short and referenced to a solid ground plane. Verify ball-map symmetry across FG324 and FGG324 variants so alternate speed grades remain footprint-compatible.
Three recurring mistakes with this part: (1) assuming all A3PE3000 324-ball suffixes are identical - the -I suffix means industrial -40C to +85C and the -2 means speed grade 2; substituting a commercial or slower part silently degrades timing and temperature margins. (2) Skipping static timing analysis after swapping speed grades; re-run STA in Libero SoC because a grade-1 replacement may fail paths that closed at 310 MHz. (3) Forgetting that instant-on flash logic drives I/Os immediately at power-up - add pull resistors or output-enable control so external devices are not driven before the host is ready.
Compliance Information
The FG suffix denotes the standard FBGA package; FGG-suffixed siblings (e.g., A3PE3000-FGG324I) denote Microchip green/lead-free packaging. Confirm RoHS/REACH status on the official Microchip product page for the exact ordering code.
