A54SX32-TQ176M - 32K-Gate Anti-Fuse FPGA, TQFP-176 | Actel/Microchip
MPN: A54SX32-TQ176M ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $172.5 | $1,725.00 |
| 100 | $158 | $15,800.00 |
| 500 | $146 | $73,000.00 |
| 1,000 | $135 | $135,000.00 |
Drop-in alternatives for A54SX32-TQ176M — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A54SX32-2TQG176
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View Datasheet →A54SX32-1TQG176
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$43.6 / Unit
View Datasheet →A54SX32-2TQG176I
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$55.1 / Unit
View Datasheet →A54SX32-1TQG176I
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$45.2 / Unit
View Datasheet →A54SX32-TQG176
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$31.2 / Unit
View Datasheet →A54SX32-TQG176I
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$86.75 / Unit
View Datasheet →A54SX32-TQ176M Maximum Ratings & Electrical Characteristics
| Programmable Type | In-System Programmable (one-time) |
| Number of Gates | 32000 |
| Number of Logic Cells | 1800 |
| Number of Logic Modules (CLBs) | 2880 |
| Maximum Toggle Frequency | 240 MHz |
| Combinatorial Delay per Module | 0.6 ns |
| Process Technology | 0.35 um CMOS anti-fuse |
| Supply Voltage (Core) | 3.3 V (3.0 V to 3.6 V) |
| I/O Voltage Support | 3.3 V / 5 V |
| Programming Technology | Anti-fuse (OTP) |
| Architecture | Sea-of-modules (C-cell / R-cell) |
| Operating Temperature Range | -55C to +125C (M grade) |
| Package | 176-pin TQFP, 0.5 mm pitch |
| Mounting Type | Surface Mount |
| RoHS Status | RoHS Non-Compliant (contains lead) |
| Lead Free Status | Contains Lead |
A54SX32-TQ176M 176-pin tqfp, 0.5 mm pitch Pin Configuration Guide
Complete pinout information for A54SX32-TQ176M (176-pin tqfp, 0.5 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A54SX32-TQ176M.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A54SX32-TQ176M is suitable for 6 applications: Military and Avionics Control Logic, High-Speed Datapath and Protocol Engines, 3.3V/5V Mixed-Voltage System Integration, Secure and Instant-On Boot Logic, Legacy Industrial Platform Sustainment, Bus Interface and Bridge Logic.
Military and Avionics Control Logic
The A54SX32-TQ176M's military M-grade operating range of -55C to +125C directly aligns with avionics bay and defense electronics environments where commercial-grade silicon cannot be qualified. Its one-time-programmable anti-fuse configuration is inherently immune to configuration bitstream corruption and configuration readback, a security property SRAM FPGAs do not offer. In flight-control interfaces, MIL-STD bus bridges, and mission-computer glue logic, the 240 MHz-class performance and ~0.6 ns predictable module delays simplify static timing sign-off required for airworthiness certification. Because the anti-fuse interconnect is permanent, there is no in-flight reconfiguration risk. Designers should re-verify timing in Actel Designer at temperature corners, as the M grade is specified across the full military envelope.
Recommended
High-Speed Datapath and Protocol Engines
With up to 240 MHz toggle frequency and roughly 0.6 ns combinatorial delay per C-cell module, the A54SX32-TQ176M implements fast counters, CRC/encoding engines, FIFO control, and protocol state machines that exceed what contemporaneous SRAM FPGAs achieved at equal gate counts. The anti-fuse routing contributes low, deterministic interconnect capacitance, giving consistent timing that suits fixed-latency datapaths. In 3.3V systems interfacing to legacy 5V logic, the 5V-tolerant I/O removes the need for level-shifting glue. Designers should pipeline long routes and constrain critical paths in Actel Designer to hold timing across the -55C to +125C M-grade envelope; the OTP nature means timing must be signed off before programming, since no post-silicon fixes are possible.
Recommended
3.3V/5V Mixed-Voltage System Integration
The A54SX32-TQ176M operates its core at 3.3V (3.0V to 3.6V) while supporting 5V I/O signaling, which is why it remains popular in legacy industrial and defense platforms that mix modern 3.3V logic with 5V TTL buses. This dual-voltage capability eliminates external level translators, reducing part count and failure points in vibration-prone environments. With 32,000 gates of capacity, typical board-level glue logic - address decoders, bus arbiters, interrupt controllers, and parallel-bus bridges - consolidates into a single OTP device, shrinking board area and improving reliability. Layout should keep the 176-pin TQFP's power/ground pin pairs decoupled with 0.1 uF ceramics placed within a few millimeters of each supply pin pair to contain ground bounce at 5V I/O switching edges.
Recommended
Secure and Instant-On Boot Logic
Because the A54SX32-TQ176M's anti-fuse configuration is blown at programming time, the device is live within microseconds of power application with no external configuration PROM, no boot latency, and no bitstream to intercept or corrupt. This makes it a strong choice for power-sequencing supervisors, secure key-management shells, root-of-trust glue, and processor hold-off logic in defense systems. SRAM FPGAs require an external flash and a boot interval during which the fabric is unconfigured; the SX32 has neither weakness. The trade-off is zero reprogrammability: any logic change requires a physically new device, so production should plan programming yield and spare stock accordingly. Verify programming via Actel's programming hardware before board assembly for best workflow.
Recommended
Legacy Industrial Platform Sustainment
Many factory automation, test equipment, and telecommunication platforms designed in the late 1990s and 2000s were built around Actel SX FPGAs. The A54SX32-TQ176M, with its 32,000 gates, 240 MHz-class performance, and standard TQFP-176 0.5 mm pitch footprint, lets engineers sustain those boards without re-spinning the PCB. Pin-compatible family members at different speed and temperature grades (A54SX32-1TQG176, A54SX32-2TQG176) allow commercial builds to move to RoHS-compliant lead-free finishes while preserving the original layout, netlist, and programming files. When sourcing for sustainment, confirm speed-grade requirements against the original design's timing reports, since -1 grade parts may fail timing margins that the original grade met.
Recommended
Bus Interface and Bridge Logic
The A54SX32-TQ176M's combination of 5V-tolerant I/O, deterministic sub-nanosecond logic delays, and 32K gates of capacity makes it well suited to implementing bus arbiters, VME/PCI-era bridge interfaces, memory controllers, and backplane interface glue in defense and industrial systems. Predictable routing delay allows clean setup/hold budgeting against external bus timing specifications, which is harder to guarantee on SRAM FPGAs whose routing delay varies with each compile. Designs typically dedicate C-cells to combinatorial decode and R-cells (with registered outputs) to state machines, achieving the device's full speed potential. Because the part is OTP, freeze the interface specification and complete full simulation before committing to programming; the TQFP-176's 0.5 mm pitch requires careful reflow profiling to avoid solder bridging.
Recommended
Recommended Products Summary
Engineering reference data for A54SX32-TQ176M — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A54SX32-2TQG176 | A54SX32-1TQG176 | A54SX32-2TQG176I | A54SX32-1TQG176I |
|---|---|---|---|---|---|
| Package | TQFP-176 (0.5 mm pitch) | TQFP-176 - same | TQFP-176 - same | TQFP-176 - same | TQFP-176 - same |
| Brand | Actel / Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 32000 | 32000 | 32000 | 32000 | 32000 |
| Speed Grade | Standard (base) | -2 (fastest bin) | -1 (slowest bin) | -2 | -1 |
| Temperature Range | -55C to +125C (M) | Commercial (narrower than M grade) | Commercial | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| RoHS / Lead Finish | Non-compliant (contains lead) | Compliant (lead-free G finish) | Compliant (lead-free G finish) | Compliant (lead-free G finish) | Compliant (lead-free G finish) |
| Supply Voltage | 3.3 V (3.0-3.6 V), 5V-tolerant I/O | 3.3 V / 5 V - same | 3.3 V / 5 V - same | 3.3 V / 5 V - same | 3.3 V / 5 V - same |
| Max Toggle Frequency | 240 MHz (family class) | Up to 240 MHz class (-2 bin, highest margin) | Reduced margin (-1 bin) | Up to 240 MHz class (-2 bin) | Reduced margin (-1 bin) |
Key Differentiators
- Military-grade temperature qualification (vs A54SX32-2TQG176I)
- Fastest speed-bin margin available in same footprint (vs A54SX32-1TQG176)
- OTP anti-fuse security and instant-on boot (vs SRAM FPGAs (no pin-compatible cross-brand))
Design Notes
Decouple each VDD/VSS pin pair of the TQFP-176 with 0.1 uF X7R ceramic capacitors placed within 3-5 mm of the pins, plus bulk 10 uF at the board entry. The SX32 core runs at 3.3V (3.0-3.6V) with 5V-tolerant I/O; ensure the 5V domain is never applied to core supply pins. Anti-fuse devices draw little static core current, but simultaneous switching of many 5V I/O can cause ground bounce - keep VSS plane continuity solid under the package. Estimated: at 240 MHz-class switching with tens of outputs toggling, dynamic I/O current dominates core current, so size the 5V rail regulator for the I/O budget, not the 32K gate count.
The most common pitfall with A54SX32-TQ176M is treating it like an SRAM FPGA: it is one-time programmable (anti-fuse OTP). Any functional fix after programming requires a physically new device, so complete gate-level simulation and static timing sign-off in Actel Designer across -55C to +125C corners before blowing fuses. Second pitfall: the leaded M-grade finish is RoHS non-compliant - do not ship it into RoHS markets; select A54SX32-2TQG176 instead. Third: speed grades matter - a -1 grade substitute may miss timing margins your original compile met; re-run timing after any speed-grade change.
The TQFP-176 uses a 0.5 mm lead pitch with 0.17 mm-class lead widths, requiring a fine-pitch reflow profile and stencil apertures of roughly 0.25 x 1.5 mm with 5-8% paste reduction to prevent bridging. Fan out inner rows with 0.2 mm vias on a dog-bone pattern or use via-in-pad on the outer rows. Follow the Microchip SX datasheet package mechanical drawing for the exact 28 x 28 mm land pattern. Avoid routing critical clocks under the package to reduce crosstalk into the dense lead area, and provide thermal relief through planes - the TQFP is not a thermally enhanced package.
Anti-fuse routing gives the SX32 low, deterministic interconnect delay (~0.6 ns module delay), which is a signal-integrity asset: predictable flight times simplify bus setup/hold budgeting against 5V TTL peripherals. Still, for high-fanout clocks, drive them from the dedicated clock pins and register outputs close to the driving R-cells. Estimated: at 5V I/O edges with several-picosecond-class slew through 0.35 um output buffers, series 22-33 ohm termination resistors at the package pins control ringback on 50-ohm traces longer than about one inch.
Compliance Information
Per distributor data (ChipDig), A54SX32-TQ176M contains lead and is RoHS Non-Compliant. For RoHS builds use G-suffix lead-free family members (e.g., A54SX32-2TQG176). REACH and conflict-minerals status not stated in provided data.
