A54SX32A-FGG144 - 48K Gate SX-A FPGA, 144-FBGA | Microchip
MPN: A54SX32A-FGG144 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $68.5 | $68.50 |
| 10 | $63.2 | $632.00 |
| 100 | $58.4 | $5,840.00 |
| 500 | $54.1 | $27,050.00 |
| 1,000 | $49.9 | $49,900.00 |
Drop-in alternatives for A54SX32A-FGG144 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A54SX32A-FGG144I
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View Datasheet →A54SX32A-FGG144 Maximum Ratings & Electrical Characteristics
| Family | SX-A (Actel/Microsemi antifuse FPGA) |
| System Gates | 48000 gates |
| Logic Cells | 1800 cells |
| Logic Array Blocks (LABs) | 2880 |
| User I/O | 111 |
| Maximum System Frequency | 238 MHz |
| Process Technology | 0.25 um |
| Core Supply Voltage | 2.5 V |
| Supply Voltage Range | 2.25 V to 5.25 V |
| Propagation Delay | 1.2 ns |
| Package | 144-LBGA / 144-FBGA (13 x 13 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0 C to +70 C |
| Programming Technology | Antifuse (one-time programmable) |
| Number of Balls | 144 |
| Packaging | Tray |
A54SX32A-FGG144 144-lbga / 144-fbga (13 x 13 mm) Pin Configuration Guide
Complete pinout information for A54SX32A-FGG144 (144-lbga / 144-fbga (13 x 13 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A54SX32A-FGG144.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A54SX32A-FGG144 is suitable for 6 applications: Defense and Avionics Sustainment, Industrial Control Glue Logic, Secure State Machines and Design Protection, Communication Interface Bridging, Test and Measurement Instrumentation, Legacy SRAM FPGA Displacement.
Defense and Avionics Sustainment
The A54SX32A-FGG144 fits defense and avionics sustainment programs because its antifuse configuration is physically burned into silicon, providing resistance to configuration readback and single-event upsets that threaten SRAM FPGAs. The 48K-gate capacity and 111 user I/Os are sufficient for bus interfaces, Mil-Std glue logic, and voter/comparator functions common in legacy avionics line-replaceable units. Designs are re-created deterministically in Designer/Libero, and the 238 MHz rating covers most legacy timing budgets. Since these platforms change rarely, one-time programmability is a feature rather than a limitation, and the mature SX-A family supports long-term procurement.
Recommended
Industrial Control Glue Logic
In industrial control and factory automation, the A54SX32A-FGG144 replaces dozens of discrete 74-series devices with a single 2.5 V, low-static-power chip. Its 1800 logic cells and 2880 LABs integrate address decoders, bus arbiters, interrupt controllers, and sequencing state machines, while 111 I/Os interface 5 V-tolerant-class board logic within the listed 2.25 V to 5.25 V supply range. The 238 MHz performance and 1.2 ns-class flip-flop timing comfortably exceed typical PLC backplane timing needs. Instant-on antifuse configuration means the logic is active at power-up with no configuration controller, improving fault behavior in machinery that must initialize immediately.
Recommended
Secure State Machines and Design Protection
Wherever proprietary algorithms must not be extracted, the A54SX32A-FGG144 provides hardware-level design security: the antifuse bitstream cannot be read back, unlike SRAM FPGAs whose configuration flash can be dumped. Applications include license-key engines, encryption key handling front-ends, anti-counterfeiting checks, and secure boot comparators. The 32K system gates and 111 I/Os support DES/AES-class datapaths of modest size, and the 2.5 V core reduces dynamic power in always-on security functions. Designers should partition only the secret logic into the antifuse device and keep non-sensitive interfacing elsewhere, since one-time programmability makes post-deployment bug fixes impossible.
Recommended
Communication Interface Bridging
The A54SX32A-FGG144 serves as a protocol bridge between legacy backplanes and newer processors, mapping buses such as parallel peripheral interfaces, UART streams, or custom serial links. The 238 MHz system frequency and dedicated carry chains handle counters, CRC generators, and FIFO control logic, while 111 user I/Os provide the wide parallel buses that modern MCUs no longer expose. Its 2.25 V to 5.25 V supply tolerance eases integration on mixed-voltage legacy boards. Because the antifuse configuration loads instantly, bridged links are available at the first clock edge after power-up - important for systems where a CPU polls the interface within milliseconds of reset.
Recommended
Test and Measurement Instrumentation
Bench and rack instrumentation uses the A54SX32A-FGG144 for trigger engines, timing generators, and front-panel glue logic. The 1.2 ns-class flip-flop timing and 238 MHz toggle rating support sub-10 ns trigger resolution, while the deterministic antifuse routing ensures timing does not shift between units - valuable for instruments requiring repeatable channel-to-channel behavior. The 0 C to +70 C commercial rating matches laboratory environments, and low static power keeps internal temperatures stable for measurement accuracy. In production-test fixtures, one-time programming is acceptable because test stimulus logic is fixed, and instant-on operation shortens fixture initialization time during high-volume manufacturing runs.
Recommended
Legacy SRAM FPGA Displacement
Teams replacing failing or unobtainable SRAM FPGAs in cost-sensitive boards can consolidate up to 32K gates of legacy programmable logic into the A54SX32A-FGG144, eliminating the external configuration PROM and its power-up sequencing requirements. The 111 I/Os cover most legacy glue-logic pin counts, and the 2.25 V to 5.25 V supply range simplifies retrofit onto 3.3 V or 5 V boards. Typical usage includes coprocessor control, address translation, and I/O expansion. The trade-off is one-time programmability: designs must be frozen and fully simulated at the 238 MHz timing grade before committing silicon, making this approach best for mature, stable products.
Recommended
Recommended Products Summary
Engineering reference data for A54SX32A-FGG144 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A54SX32A-FGG144I |
|---|---|---|
| Package | 144-FBGA (13 x 13 mm) | 144-FBGA (13 x 13 mm) - same |
| Brand | Microsemi (Microchip Technology) | Microsemi (Microchip Technology) |
| System Gates | 48000 gates | 48000 gates |
| Logic Cells | 1800 cells | 1800 cells |
| User I/O | 111 | 111 |
| Maximum Frequency | 238 MHz | 238 MHz |
| Core Supply Voltage | 2.5 V | 2.5 V |
| Operating Temperature | 0 C to +70 C | -40 C to +100/+125 C (industrial) |
| Programming Technology | Antifuse (OTP) | Antifuse (OTP) |
Key Differentiators
- Commercial temperature grade at lowest channel cost (vs A54SX32A-FGG144I)
- Instant-on antifuse configuration (vs A54SX32A-FGG144I)
- 48K-gate density in the SX-A family (vs A54SX16A-FG144I)
Design Notes
The A54SX32A-FGG144 uses a 2.5 V core with a distributor-listed supply range of 2.25 V to 5.25 V depending on rail configuration. Provide a clean, low-noise 2.5 V rail with local 0.1 uF ceramic decoupling at multiple corners of the 144-FBGA plus at least one bulk 10 uF capacitor. Antifuse FPGAs draw low static current, but dynamic current spikes occur on simultaneous output switching - keep ground bounce in check by assigning high-toggle-rate signals away from shared power/ground ball clusters and confirming the supply rail with an oscilloscope during worst-case vectors.
Antifuse devices are one-time programmable: an error in the design cannot be patched in the field. Complete functional simulation, static timing analysis at the correct speed grade, and ideally a prototype-programmed verification unit before burning production devices. Order a few extra programmed and blank units per build to cover programming yield. Also verify you have selected the correct suffix (commercial FGG144 vs industrial FGG144I) at ordering time - the die is the same, but temperature rating cannot be changed after the fact.
The 144-FBGA (13 x 13 mm) uses a fine ball pitch that requires a controlled reflow profile and accurate stencil design; X-ray inspection of ball collapse is recommended for production. Route I/O with controlled impedance where the 238 MHz-class edges demand it, and break out power/ground balls to internal planes with short vias. If transitioning from the TQFP-144 variants to this FBGA footprint, remember the ball map is not pin-number-identical to QFP pinout - always re-derive the schematic symbol from the manufacturer datasheet package table rather than reusing a QFP symbol.
Compliance Information
Compliance attributes were not present in the provided verified web data; verify on the Microchip product page or DigiKey environmental listing for the exact ordering code.
